Name: LED Ceramic PCB,Ceramic Substrate PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

LED Ceramic PCB,Ceramic Substrate PCB

Product Model: LED Ceramic PCB, Ceramic Substrate PCB

Base Material: Ceramic Substrate

PCB Layers: 2 Layers

Color: White

Substrate Thickness: 0.635mm Aluminum Nitride

Copper Thickness: 1OZ (35μm)

Surface Treatment: Immersion Gold

Gold Layer Thickness: ≥3μ"

Minimum Aperture: 0.8mm

Application: High-power LED PCB, LED lamp PCB, LED street lamp PCB, solar energy inverter PCB

Description
Data Sheet

Ceramic based PCB is a specialized type of printed circuit board. Differentiated from conventional FR-4 boards and aluminum substrates, it delivers a semiconductor-matched thermal expansion coefficient and outstanding heat resistance. This substrate solution is well suited for high-heat-generation products including high-brightness LEDs and solar equipment. Its superior weather resistance also enables stable service in harsh outdoor application scenarios.

Core Characteristics of Ceramic Substrate PCB

Structural Performance

It features high mechanical strength, minimal board warpage, and high surface hardness. Materials such as aluminum nitride achieve a thermal expansion coefficient highly compatible with silicon wafers. Meanwhile, it maintains favorable machinability and precise dimensional stability.

Environmental Adaptability

Capable of long-term operation in high-temperature and high-humidity conditions. It offers high thermal conductivity, outstanding heat resistance, corrosion resistance, wear resistance, as well as anti-ultraviolet and anti-yellowing properties.

Chemical Performance

Compliant with lead-free and environmental protection standards with non-toxic composition. It possesses stable chemical properties and strong anti-aging capability.

Electrical Performance

It provides high insulation resistance and excellent metallization performance. The patterned circuit layers can form firm bonding with the ceramic base to ensure long-term structural stability.

Market Advantage

Diversified raw material options are available, including clay-based and aluminum-series ceramic materials. With mature manufacturing procedures, it realizes cost control and cost-effective mass production.

Thermal Conductivity Comparison of Common PCB Base Materials

Traditional glass fiber substrate：0.5 W/m·K

Aluminum substrate：1 ~ 2.2 W/m·K

Alumina ceramic substrate：24 ~ 40 W/m·K

Aluminum nitride ceramic substrate：160 ~ 170 W/m·K

Thermal conductivity of mainstream electronic base materials (Unit: W/m·K)

Resin material：0.5

Alumina：20–40

Silicon carbide：160

Aluminum：170

Aluminum nitride：220

Copper：380

Diamond：600

Process Classification of Ceramic Substrates

Ceramic PCB manufacturing processes are mainly divided into thin film, thick film and co-fired multilayer ceramic technology.

DPC Thin Film Process
Supports high-precision circuit customization with accurate control of line width, spacing and film thickness for high-density circuit design.
Thick Film Process
Focuses on excellent heat dissipation and outdoor weather resistance, widely adopted in medium and high-power electronic modules.
HTCC & LTCC Co-fired Ceramic Technology
Low-temperature co-fired ceramic features low sintering temperature and low melting point, which can be co-fired with precious metal conductors to build multi-layer composite structures. High-temperature co-fired ceramics deliver high structural strength. LTCC technology enables multi-layer ceramic lamination, allowing embedded integration of passive components and IC chips.

Performance Contrast Between Alumina and Aluminum Nitride

Alumina Ceramic

Raw materials are easy to source with low comprehensive cost and simple production processes, while its thermal conduction capacity remains at a moderate level.

Aluminum Nitride Ceramic

Restricted by raw material supply and complex processing technology, it has higher production costs. In return, it possesses ultra-high thermal conductivity, making it the preferred substrate for high-power and high-heat-dissipation scenarios.

Model : LED Ceramic PCB,Ceramic Substrate PCB

Material : Ceramic Substrate

Layer : 2Layer Ceramic PCB

Color : White

Thickness : Aluminum nitride 0.635mm

Copper Thickness : 1OZ(35um)

Surface Treatment : Immersion Gold

Gold thick : >=3U"

Minimum aperture : 0.8mm

Application : high power LED pcb,LED lamp pcb,LED street lamp pcb,solar energy inverter pcb