• ISOLA FR408 PCB
  • ISOLA FR408 PCB
  • ISOLA FR408 PCB
  • ISOLA FR408 PCB
  • ISOLA FR408 PCB
  • ISOLA FR408 PCB

ISOLA FR408 PCB

Product Model: ISOLA FR408 High-Performance Circuit Board
Base Material: ISOLA FR408 high-Tg laminate
Dissipation Factor (Df): 0.012
Dielectric Constant (Dk): 3.67
Glass Transition Temperature (Tg): 180℃
Thermal Decomposition Temperature (Td): 380℃
Layer Count: 8-layer multilayer structure
Finished Board Thickness: 1.2 mm
Copper Weight: 1 oz
Minimum Line Width / Spacing: 6 mil / 6 mil
Surface Treatment: Electroless Nickel Immersion Gold

  • ISOLA FR408 PCB
  • ISOLA FR408 PCB
  • ISOLA FR408 PCB
  • Description

  • Data Sheet

ISOLA FR408 belongs to the medium-loss category of epoxy laminates and prepregs, serving as a high-performance FR‑4 grade material system tailored for sophisticated circuit applications.
Common FR‑4 PCB substrates generally have a glass transition temperature (Tg) of around 130℃, while high-temperature grades can reach 180℃ or above. Take ISOLA 370HR as an example; it supports actual operating frequencies up to 10G and is widely used in scenarios such as high-frequency communications, microwave equipment, and high-speed digital circuits.
However, ISOLA 370HR shows relatively high signal attenuation, close to that of standard FR‑4 materials, with its main advantage being excellent thermal stability. In comparison, ISOLA FR408 only has roughly one‑tenth the transmission loss of 370HR.
As a complementary product to ISOLA 370HR, FR408 features a low dielectric constant (Dk) and low loss factor (Df), making it particularly well‑suited for broadband circuit designs that demand higher transmission rates and better signal integrity. Moreover, ISOLA FR408 is compatible with mainstream FR‑4 manufacturing processes, allowing it to be applied directly without increasing the difficulty of existing production procedures.




ISOLA FR408 PCB Material

Product name: ISOLA FR408 PCB

Material: isola fr408 HIGH TG PCB

Df (dissipation factor): 0.012

Dk (dielectric constant): 3.67

Glass transition temperature: TG180℃

Td: 380℃

Number of Layers: 8 layers

Board thickness: 1.2mm

Surface technology: lmmersion gold

Copper thickness: 1OZ

Minimum line width/line spacing: 6mil/6mil

Use: Communication equipment isola fr408 PCB