Description
Data Sheet

ISOLA 370HR: High-Reliability Epoxy Laminate for Next-Generation PCB Applications

Name: ISOLA 370HR 6-Layer PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Premium Standard-Loss Epoxy Laminate & Prepreg: Redefining Thermal and Electrical Performance

As a benchmark in lead-free compatible materials, ISOLA 370HR stands out as the industry’s premier choice for high-reliability PCB designs across diverse market sectors. Engineered to deliver exceptional thermal robustness and signal integrity, this advanced laminate addresses the most demanding requirements of modern electronic systems.

Crafted by Polyclad’s expert engineering team, ISOLA 370HR laminates and prepregs leverage a proprietary high-performance multifunctional epoxy resin system, boasting a glass transition temperature (Tg) of 180°C. Specifically tailored for multilayer printed wiring boards (PWBs) where thermal resilience and long-term reliability are non-negotiable, the material is reinforced with high-grade E-glass fabric—ensuring superior resistance to conductive anodic filament (CAF) formation, a critical factor in extending PCB service life.

Beyond its thermal advantages, ISOLA 370HR offers a low coefficient of thermal expansion (CTE) and robust mechanical, chemical, and moisture resistance properties that surpass or match traditional FR-4 materials. With validation in thousands of PWB designs worldwide, it has established itself as a leader in thermal reliability, CAF performance, processability, and compatibility with sequential lamination techniques—making it a trusted solution for mission-critical applications.

Navigating the High-Speed Data Transmission Evolution: ISOLA 370HR’s Role as a Practical Innovation Enabler

The electronics industry is currently grappling with the challenge of advancing high-speed data transmission rates, with varying perspectives on current capabilities and future roadmaps. While some manufacturers are focused on perfecting 28 Gbps solutions, others are pushing toward 56 Gbps, and a few have shifted their focus entirely to the latter. Regardless of these differing approaches, one universal reality persists: even with the most advanced materials available today, 56 Gbps represents the near-term performance threshold for copper-based PCB technology.

To contextualize this, insertion loss analysis for long-distance backplane applications reveals that PTFE (Teflon) substrates—though offering exceptional high-frequency performance—are economically unfeasible for commercial hardware, both in the short and long term. This is where ISOLA 370HR emerges as a game-changing alternative: bridging the gap between traditional FR-4 and premium high-speed laminates, it reliably supports 28 Gbps signaling and enables short-to-medium reach 56 Gbps links. This positions ISOLA 370HR as the practical limit for mainstream copper-interconnect PCB systems, delivering a balance of performance and cost-effectiveness that no other material in its class can match.

A second critical challenge in high-speed design is scaling bandwidth without integrating optical technology. While optical systems offer virtually unlimited bandwidth, replacing dense copper interconnects on PCBs with optical connections remains a complex undertaking. Embedded silicon photonics is widely regarded as the long-term solution, but this transition will require fundamental overhauls to PCB materials, design methodologies, and manufacturing processes—changes that industry experts anticipate will not reach mass production for approximately two decades.

Against this backdrop, the industry urgently needs bridging technologies that can seamlessly connect today’s PCB infrastructure to future silicon photonic systems. These technologies must preserve current manufacturing capabilities while laying the groundwork for tomorrow’s innovations.

Copper Cable-Enhanced PCBs: A Pragmatic Bridging Solution with ISOLA 370HR

One of the most viable bridging approaches is the replacement of high-speed PCB traces with controlled-impedance copper cables. This method simplifies design constraints, minimizes skew caused by glass-weave effects in traditional PCBs, and delivers significantly lower insertion loss compared to conventional copper traces—all while reducing overall system costs.

By adopting cable-based interconnects, designers can leverage cost-effective materials like ISOLA 370HR or ISOLA FR408, eliminating the need for expensive high-performance laminates such as Tachyon or Megtron 6. This approach not only reduces material and manufacturing costs but also preserves performance headroom for future generations of electronic systems. The primary challenge lies in optimizing the assembly process, which can be efficiently addressed through structured process planning and rigorous manufacturing control—ensuring seamless integration into existing production workflows.

Industry Crossroads: The Evolution of PCB Technology and ISOLA 370HR’s Strategic Role

The PCB industry stands at a pivotal technological crossroads. Copper-based PCB technology has evolved over nearly 40 years: the first two decades were dedicated to refining the technology, while the subsequent two decades have pushed it to its physical performance limits. Before PCBs, point-to-point wiring and multi-wire technologies dominated the industry; today, we stand on the cusp of a gradual shift toward photonics. In this transition, ISOLA 370HR serves as a critical foundation—offering the reliability, performance, and cost-effectiveness needed to support current applications while enabling the industry’s move toward next-generation technologies.

ISOLA 370HR Key Specifications (For complete details, refer to the official ISOLA 370HR datasheet)

Glass Transition Temperature (Tg): 180°C
Thermal Decomposition Temperature (Td): 340°C
Dielectric Constant (Dk): 4.04
Dissipation Factor (Df): 0.021
Reinforcement: High-Quality E-Glass Fabric
Compatibility: Lead-Free Assembly, Sequential Lamination

Application Areas

Telecommunications Infrastructure

ISOLA 370HR is widely deployed in high-speed communication boards that demand enhanced thermal and electrical stability. It maintains exceptional signal integrity at data rates up to 28 Gbps, supporting the development of next-generation network equipment. Fully compatible with lead-free assembly and sequential lamination processes, it meets global environmental regulations and industry standards. Maxipcb® offers end-to-end support for ISOLA 370HR, from rapid prototyping to high-volume production, ensuring a seamless workflow from design validation to market delivery.

Automotive Electronics & Industrial Control

In harsh automotive and industrial environments—where PCBs are exposed to mechanical stress, moisture, and chemical contaminants—ISOLA 370HR’s robust material properties deliver unmatched durability. It is ideally suited for critical embedded systems, including vehicle control units, industrial automation equipment, and power converters. When paired with professional custom PCB assembly services, ISOLA 370HR ensures long-term reliability and performance in mission-critical applications, meeting the strict quality standards of highly regulated sectors.

Frequently Asked Questions (FAQ)

What are the core thermal and electrical properties of ISOLA 370HR PCBs?

ISOLA 370HR is engineered for high performance, featuring a Tg of 180°C for superior thermal stability, a low Df of 0.021, and a Dk of 4.04—all optimized for high-speed signaling. These properties ensure minimal signal loss, strong thermal resilience, and exceptional reliability in demanding high-speed PCB designs.

Does Maxipcb offer customized multilayer PCB solutions using ISOLA 370HR?

Yes, Maxipcb provides fully customized multilayer PCB solutions utilizing ISOLA 370HR, with configurable layer counts, board thicknesses, and surface finishes. Our tailored PCB assembly services are designed to meet the unique design and performance requirements of each customer’s application.

How does ISOLA 370HR support lead-free manufacturing processes?

ISOLA 370HR is fully compatible with lead-free soldering and high-temperature assembly processes, complying with RoHS and other global environmental standards. Its robust material composition ensures structural and electrical reliability even under the elevated temperatures required for lead-free manufacturing.

What is the typical lead time for ISOLA 370HR PCB orders?

Standard lead times for ISOLA 370HR PCBs range from 2 to 4 weeks, depending on order volume and design complexity. Maxipcb maintains a comprehensive global logistics network, ensuring reliable delivery to customers across Asia, Europe, and the Americas.

Productname:lSOLA 370HR PCB

Material: isola 370hr HIGH TG PCB

Df (dissipation factor): 0.021

Dk (dielectric constant):4.04

Glass transition temperature: TG180°C

Td: 340°C

Number of Layers: 6 layers

Board thickness:1.0mm

Surface technology: lmmersion gold

Copper thickness: 1OZ

Minimum line widthline spacing: 4mil/4mil

Use: data storage products

ISOLA 370HR 6-Layer PCB

Description

Data Sheet