isola 370hr backplane pcb

This communication backplane circuit board adopts Isola 370HR as its base material. The backplane bus serves as a high-speed data transmission channel between the PLC main controller and I/O expansion modules, supporting real-time I/O data interaction between the main unit and extension modules. The technical standard of the backplane bus directly determines the I/O expansion performance of PLC products, making it a core technology in the development and production of PLC systems.

Currently, most PLC circuit boards are manufactured using Isola 370HR material, and serial communication architecture is widely adopted for PLC backplane buses. Compared with traditional parallel buses, serial buses feature fewer wiring connections, lower hardware costs, and stronger anti-interference capabilities. This design effectively enhances the operational stability of automation equipment in demanding industrial and factory environments.

In the communications PCB sector, applications cover wireless networks, transmission networks, data communications, and fixed-line broadband systems. Relevant products include communication backplanes, high-speed multilayer boards, high-frequency microwave circuit boards, and multifunctional metal-based boards.

Globally, around 85% of demand in the communications backplane PCB segment is concentrated among 13 major customers. Customer qualification and certification typically require 2 to 3 years, resulting in a high entry barrier for accessing the supply chain of premium clients. Our company has successfully passed certifications from numerous large-scale high-quality customers, with its top five customers (including automotive electronics suppliers in mainland China) consistently contributing over 50% of annual revenue. The company’s supply share for several core clients ranges from 10% to 20%. With ongoing capacity expansion, this proportion is expected to rise to 25%–35%.

The fundraising projects will support gradual capacity expansion. At present, the company’s annual production capacity reaches 1.6 million square meters, with capacity utilization remaining at a high level. This year’s utilization rate is projected to exceed 90%, approaching full-capacity production.

Among the fundraising initiatives, the 750,000-square-meter HDI PCB expansion project is currently in the infrastructure construction phase. Plant completion is scheduled for the third quarter of this year, trial production in the first quarter of next year, and formal capacity release in the second and third quarters. The technical upgrade project for high-end 3G communication system PCBs, with an annual output of 117,300 units, mainly involves the renovation and expansion of existing production lines and equipment procurement. Partial capacity has already been put into use, with full capacity expected to be realized in the second half of next year.

The company’s industry-leading production scale, clear strategic planning, and sound operational management lay the foundation for sustained steady growth. While already among the industry frontrunners, it has not yet established absolute technological leadership. Through capacity expansion and upgrading, the company is poised to gradually become a leading provider in the communications backplane PCB field. The fundraising investment projects have created favorable conditions for future capacity growth and market expansion.