Name: IC package substrate
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

SI10U IC package substrate PCB board parameter specification

1. IC Package Substrate Industry Evolution

Traditional IC packaging relied on lead frames as both electrical conductors and mechanical carriers, with pins extending from the sides or periphery of the frame. However, as IC packaging technology advanced, increasing pin counts, higher wiring densities, and more complex layer requirements rendered traditional packaging forms obsolete. The emergence of advanced packaging technologies such as Ball Grid Array (BGA) and Chip Scale Package (CSP) has driven the development of dedicated IC package substrates, which now serve as the primary carrier for semiconductor chip packaging.

2. Global IC Package Substrate Market Landscape

The global IC package substrate market has historically been dominated by three regions: Japan, South Korea, and Taiwan. Japan initially established market leadership, with key manufacturers including Ibiden, Shinko, Kyocera, and Eastern. South Korea's industry, led by SEMCO, Simmteck, and Daeduck, and Taiwan's sector, represented by UMTC, Nanya, Kinsus, and ASEM, have since grown rapidly, forming a tripartite market structure.

Japanese manufacturers retain technological leadership in high-end substrates. Taiwanese manufacturers, however, have expanded production capacity significantly and hold a competitive cost advantage in mature product segments such as Plastic BGA (PBGA). According to 2012 Prismark market research, four of the world's top 11 substrate manufacturers by revenue were Taiwanese companies.

3. Maxipcb IC Package Substrate Manufacturing Capabilities

Maxipcb has established mass production capabilities for IC package substrates including PBGA, Wire Bond CSP (WB-CSP), and embedded passive device substrates. We also provide prototype services for advanced packaging substrates such as Flip-Chip BGA (FC-BGA), Flip-Chip CSP (FC-CSP), Flip-Chip Package-on-Package (FC-POP), and Flip-Chip System-in-Package (FC-SiP). Our current product portfolio covers BGA, camera module, SiP, memory, MEMS, and RF substrates.

IC package substrate PCB board

4. Technical Specifications & Roadmap

The industry trend toward thinner, smaller IC package substrates demands finer line spacing, smaller aperture sizes, and advanced surface finishing technologies. Maxipcb continuously advances its technical capabilities to meet these evolving requirements.

Current Mass Production Specifications

Parameter	Specification
Line Width/Line Spacing	35/35µm
Blind Hole/Pad Diameter	75/175µm
Through Hole/Pad Diameter	100/230µm
Solder Mask Alignment Accuracy	±35µm
Surface Finishes	Electrolytic Ni/Au, ENEPIG, OSP, AFOP

Upcoming Technology Roadmap (Next Year)

Line Width/Line Spacing: 20/20µm
Blind Hole/Pad Diameter: 65/150µm
Through Hole/Pad Diameter: 100/200µm
Solder Mask Alignment Accuracy: ±20µm
New Surface Finish: Immersion Tin

5. Integrated System-in-Package (SiP) Solutions

As electronic products become more integrated, SiP packaging technology has gained widespread industry adoption due to its advantages in miniaturization, high performance, and multi-function integration. SiP enables the packaging of multiple chips in a single module, significantly reducing product size and improving reliability.

Maxipcb provides end-to-end SiP services covering design, substrate fabrication, assembly, packaging, and testing. Customers submit their packaging design requirements at the tape-out stage, and receive finished SiP samples approximately one week after tape-out. Our SiP design capabilities include device modeling, die stacking design, package substrate design, embedded active chip substrate design, and embedded passive device substrate design.

Supported by a comprehensive experimental platform consisting of a packaging pilot line, failure analysis laboratory, environmental reliability testing center, and signal function testing facility, Maxipcb has developed core R&D capabilities in SiP packaging technology. We support a wide range of packaging formats including QFN, BGA, LGA, POP, PiP, SiP, and 3D embedded packaging.

6. Strategic Positioning & Industry Outlook

Maxipcb has strategically shifted its customer focus from traditional packaging manufacturers to direct engagement with chip designers and end-system manufacturers. This approach enables more proactive collaboration during product definition, where chip design, packaging design, and PCB design must be considered holistically.

As a fully integrated back-end manufacturing solution provider, Maxipcb offers seamless capabilities across substrates, PCBs, PCBA, and IC packaging. This integration is critical for enabling product innovation in an industry where semiconductor manufacturing segments are increasingly converging. By combining these technologies and fostering cross-disciplinary collaboration, Maxipcb delivers enhanced value and competitive advantage to our global customers.

FAQ

What types of surface finishes do you offer for IC package substrates?
We provide multiple reliable surface finishes including Electrolytic Ni/Au, ENEPIG, OSP, and AFOP. Additionally, our roadmap includes introducing Immersion Tin finish to meet evolving industry needs, ensuring your substrate's long-term performance and solderability.

Can you support customized IC package substrate designs for specific applications?
Yes, we offer end-to-end services from design to testing for customized PCB circuit boards. Our team works closely with you to meet precise line widths, hole diameters, and packaging format requirements, guaranteeing substrates tailored to your technical specifications.

How do you ensure product quality and compliance in mass production?
Our production strictly follows IPC standards with precision manufacturing and testing equipment. We maintain solder mask alignment accuracy within ±35 µm and support through-hole and blind-hole specifications to ensure consistent quality for all printed circuit board orders.

Do you provide integrated System-in-Package (SiP) solutions along with IC substrates?
We offer full SiP integration capabilities, including design, substrate fabrication, assembly, packaging, and testing. This turnkey approach supports multi-chip modules and advanced packaging formats, helping you achieve compact, high-performance module assembly.

Model: Fingerprint card IC package substrate

Material: Shengyi SI10U

Layers: 2L

Thickness: 0.2mm

Single size: 11 * 11mm

Resistance welding: PSR-4000 AUS308

Surface treatment: Soft Gold+Hard Gold

Minimum aperture: 0.1mm

Minimum line distance: 75um

Minimum line width: 35um

Application: Fingerprint card IC package substrate

IC package substrate

Description

Data Sheet