High Speed Rigid-Flex PCB(R-FPCB) for Module

Description
Data Sheet

1. Rigid-Flex PCB (R-FPCB) & High-Speed R-FPCB Technical Overview

1.1 General R-FPCB Characteristics

Rigid-Flex PCB (R-FPCB) is a composite circuit substrate integrating the structural advantages of rigid printed circuit boards (PCB) and flexible printed circuit boards (FPC). Its integrated structure includes both rigid sections and flexible sections, and through advanced process integration and high-performance material matching, it achieves excellent design flexibility and structural reliability. This product form is particularly suitable for high-density electronic applications with strict space constraints, effectively optimizing internal layout and improving product integration.

1.2 High-Speed Rigid-Flex PCB Core Advantages

High-Speed Rigid-Flex PCB integrates the structural design of rigid and flexible circuits, enabling efficient current transmission between different circuit units. Its unique composite structure ensures low latency and low signal distortion during high-speed signal transmission, which is a critical factor in ensuring the performance stability of modern high-frequency electronic devices.

Adopting a modular design concept, High-Speed Rigid-Flex PCB can be flexibly adapted to diverse application scenarios. By independently designing electronic function modules, it realizes quick component replacement, simplifies production and maintenance processes, shortens assembly cycle and reduces comprehensive costs. Meanwhile, this design allows R&D designers to select appropriate materials and processes according to specific performance requirements, further enhancing product adaptability.

2. Maxipcb Enterprise Strength & Strategic Positioning

Maxipcb is a high-tech enterprise specializing in the R&D and mass production of high-end printed circuit boards (PCB). The company has independently developed an industry-leading automatic PCB quotation and ordering system, and is committed to building an Industry 4.0 smart PCB factory under the "Internet +" strategy, providing global customers with professional PCB technical support and integrated production services.

2.1 Quality Management & Production Capability

Maxipcb is equipped with a full set of advanced PCB production and precision testing equipment, supported by an experienced team of production technicians and high-quality management personnel. The company implements Total Quality Management (TQM) and adheres to the quality philosophy of "Do it right the first time, prioritize prevention", establishing a comprehensive full-process quality assurance system to effectively improve production efficiency, stabilize product quality and optimize comprehensive manufacturing costs.

Adhering to the environmental philosophy of pollution reduction, rational resource utilization and sustainable development, Maxipcb continuously consolidates its industry competitiveness and builds a high-reputation corporate image in the global PCB market.

2.2 Intelligent Online Service Platform

Maxipcb.cn has independently developed an automatic PCB online quotation and ordering platform, integrating real-time quotation, order placement, payment settlement and after-sales service in one system. Relying on this industry-leading intelligent platform, the company significantly shortens customer waiting time, optimizes the R&D cycle of customer products and accelerates the time-to-market of new products.

2.3 Technical Innovation & Commitment

Maxipcb focuses on continuous optimization of PCB production processes, focusing on solving technical difficulties for customers and challenging complex technical bottlenecks. The company persists in technological innovation to provide customers with products of more stable quality, higher performance and more satisfactory services, maintaining long-term technological leading advantages in the high-end PCB and high-speed R-FPCB fields.

3. Maxipcb Product Portfolio & Core Specifications

3.1 Product Series

Maxipcb’s product lineup covers radio frequency, microwave and hybrid high-frequency boards, conventional FR4 double-sided and multilayer boards, 1~3+N+3 HDI boards, anylayer HDI, rigid-flex composite boards (R-FPCB), blind & buried hole boards, blind slot boards, backdrilled boards, IC carrier boards and heavy copper PCBs, widely applicable to Industry 4.0, communication equipment, industrial control, digital products, power modules, computers, automotive electronics, medical devices, aerospace, precision instruments, military equipment and IoT fields.

3.2 Surface Finishing Options

The company provides a full range of surface finishing solutions to meet diverse application requirements, including OSP, ENIG (Electroless Nickel Immersion Gold), lead-free HASL (Hot Air Solder Leveling), full-plate gold plating, flash gold, immersion tin, immersion silver and immersion gold.

3.3 Key Manufacturing Capabilities

Maxipcb boasts comprehensive processing capabilities, including golden finger fabrication, heavy copper circuit production, blind/buried via processing, precision impedance control, resin plug hole, carbon ink printing, backdrilling, countersink hole, depth-controlled drilling, half-plated hole, press-fit hole, peelable blue mask, peelable solder stop, thick copper manufacturing and oversized PCB production.

3.4 Material Selection

The company adopts high-performance base materials, including Taiflex, Grace, SY, KB, ITEQ, Rogers series (RO4350B, RO3003, RO4003, RO3006), RT/Duroid 5880, RT5870, as well as Arlon, Isola, Taconic and special materials such as PTFE and Teflon, to meet the high-performance requirements of different application scenarios.

3.5 Layer Configuration & Dielectric Constant

Layer coverage: 2L, 4L, 6L, 8L, 10L, 12L, 14L, 16L, 18L, 20L, 22L, 24L, 26L, 28L, 30L, supporting customized layer design for high-end and high-density application scenarios.

Customizable dielectric constant (DK): 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2, matching the electrical performance requirements of different PCB and R-FPCB products, especially suitable for high-speed signal transmission scenarios.

4. Maxipcb R-FPCB Exclusive Advantages

For rigid-flex PCB (including high-speed type), Maxipcb adopts targeted material selection and process control to ensure product performance: it selects DuPont AP adhesive-free PI flexible substrates, PI resin rigid substrates matched with P95 prepregs, and No-flow prepregs for rigid-flex transition zones, all of which meet RoHS compliance, high Tg and precision impedance control requirements. In terms of process, electrolytic cleaning technology is adopted for inner layer pattern transfer (supporting 0.1mm~0.15mm line width/spacing), OPE positioning and X-ray drilling are used for multi-layer alignment, and optimized lamination and drilling parameters are applied to ensure product precision, flatness and high-speed signal transmission stability.

5. Quality Certification & Global Service

Maxipcb holds authoritative certifications including UL, ISO9001 quality management system and SGS RoHS environmental compliance certification, providing standardized and reliable quality guarantee for all high-end PCB and R-FPCB products.

The company’s products are widely applied in consumer electronics, military/space, antenna & communication systems, high-power equipment, medical devices, automotive electronics, industrial control, handheld cellular devices, WiFi antennas, telematics and infotainment, computing, radar and power amplifiers. Products are exported to Germany, France, the United States, Australia, Sweden and other global markets, providing one-stop services covering R&D, prototype verification, mass production and after-sales support.

Model : 8L High Speed Rigid-Flex PCB(R-FPCB)

Material : FR4 +PI

Layer : Rigid 6L + Flex 2L

Copper Thickness : 1OZ

Finished Thickness : 1.0mm

Surface Treatment : Immersion Gold

Min Hole : 0.2mm

Gold thickness 2U

Min Trace / Space : 3mil/3mil

Application : Module pcb