Name: High frequency PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

From the perspective of manufacturers, a high frequency PCB refers to a circuit board fabricated with specialized high-frequency dielectric materials, such as Rogers, Arlon, Taconic, Isola and Nelco. It is produced by adopting standard PCB fabrication workflows or customized high-precision processes on low-loss high-frequency substrates.

In terms of high-speed design engineering, a PCB carrying high-frequency circuit signals is defined as a high frequency PCB. Generally, circuits operating above 1 GHz are classified as high-frequency circuits, consisting of active components, passive elements and passive networks. Core functional units include high-frequency oscillators, transformers, resonators and filters, which undertake signal transmission, frequency selection and impedance conversion for RF and microwave systems.

Driven by technological advancement, massive electronic devices are designed for microwave bands above 1 GHz and even millimeter-wave scenarios over 30 GHz. Higher operating frequencies raise stricter requirements for PCB substrates, including stable electrical performance, excellent chemical resistance and ultra-low transmission loss. With the large-scale commercialization of 5G communication, high frequency PCB materials have become indispensable core components in the radio frequency industry.

High Frequency PCB

Core Characteristics of High Frequency PCB

Stable DK and DF Parameters
Low and stable dielectric constant (DK) and dissipation factor (DF) are essential. Excessively high DK causes signal delay, while low DF effectively reduces high-frequency signal attenuation and ensures transmission quality.
Matched Thermal Expansion Coefficient
The CTE of the dielectric substrate shall be consistent with copper foil to avoid delamination and peeling caused by drastic temperature changes.
Low Water Absorption
Low hygroscopicity prevents the drift of DK and DF in humid environments and maintains long-term electrical stability.
Comprehensive Environmental Resistance
Superior heat resistance, chemical corrosion resistance, impact resistance and peel strength to adapt to complex working conditions.

Key Manufacturing Notes for High Frequency PCB

Fluorine-based dielectric materials represented by PTFE (Teflon) are the most widely used high-frequency substrates. Due to the inert surface of Teflon materials, special processing measures are required:

Plasma treatment is applied to via holes and board surfaces to enhance the adhesion of hole copper and solder mask ink.
Mechanical polishing before solder mask is prohibited; only micro-etching is adopted for surface roughening.
Special milling cutters are required for shaping to prevent burrs on Teflon boards.
Strict impedance control is implemented with line width tolerance controlled within ±2%, meeting high-precision RF parameter requirements.

High Frequency PCB Layout Guidelines

Adopt multi-layer stacking design to reduce electromagnetic coupling and interference for high-density high-frequency circuits.
Minimize wire bends; use 45° broken lines or arc transitions instead of right-angle turns to suppress signal radiation and crosstalk.
Shorten device pins and high-frequency traces, and reduce via quantity, as each via will generate parasitic capacitance and weaken high-speed performance.
Routing on adjacent layers shall be arranged perpendicularly; avoid long parallel traces on the same layer, and lay complete ground planes for isolation when necessary.
Apply ground shielding for critical signal lines such as clock signals to enhance anti-interference capability.
Avoid closed loops for signal lines and ground traces to prevent circulating current interference.
Arrange high-frequency decoupling capacitors close to IC power pins to filter power noise.
Isolate analog and digital circuits with single-point grounding, and use high-frequency ferrite beads for ground isolation.
Compact layout for core chips such as DSP and memory, with equal-length wiring for address and data lines, and add shielding measures for key modules.
Complete multi-physics and electromagnetic simulation after layout to optimize product reliability and manufacturability.

High frequency PCB

High Frequency PCB Product & Application

Maxipcb’s high-frequency PCB product lineup covers Rogers PCB, microwave PCB, radar PCB, RF PCB, microstrip circuit board, antenna PCB, high-heat-dissipation PCB, Arlon PCB, hybrid laminated PCB, F4B high-frequency board and ceramic PCB.

These boards are widely applied in slot antennas, RF antennas, broadband antennas, power dividers, couplers, combiners, power amplifiers, communication base stations, automotive millimeter-wave radar, satellite systems and military radio frequency equipment.

In-Stock High-Frequency Materials

Maxipcb maintains sufficient inventory of mainstream high-frequency substrates: Rogers, Arlon, Taconic, Isola, Panasonic, TUC, ITEQ, Shengyi, Wangling, Nelco, Doosan and other brands, supporting rapid prototyping and mass production.

With rich experience in high-frequency PCB manufacturing, Maxipcb provides one-stop services including high-frequency design rule consultation, layout optimization, customized processing and technical support for global customers.

Product: high frequency PCB

Material: high frequency PCB materials

Quality standard: IPC 6012 Class2

high frequency pcb dk: 2.0 -1.6

Layers: 1 Layer pcb - 36 layer pcb

Thickness: 0.254mm - 12mm

Copper thickness: base copper 0.5oz / 1oz

Surface technology: Silver, Gold, OSP

Special process: mixed material, stepped groove

Application: High Frequency PCB, microstrip antenna

High frequency PCB

Description

Data Sheet

Core Characteristics of High Frequency PCB

Key Manufacturing Notes for High Frequency PCB

High Frequency PCB Layout Guidelines

High Frequency PCB Product & Application

In-Stock High-Frequency Materials