High Frequency Embedded Copper PCB

Name: High Frequency Embedded Copper PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Product Model: High-Frequency Embedded Copper Circuit Board

Dielectric Constant (Dk): 3.38

Substrate Structure: Rogers RO4003C + 4450F composite stack

Layer Configuration: 4-layer multilayer board

Finished Board Thickness: 1.6 mm

Dielectric Layer Thickness: 0.508 mm

Base Copper Thickness: ½ oz (18μm), HH/HH grade

Final Copper Weight: 1 / 0.5 / 0.5 / 1 oz

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Special Process: High-frequency embedded copper design

Application: Communications equipment

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Description
Data Sheet

High‑frequency RF circuits and power amplifiers (PA) impose stringent thermal management requirements on PCBs. In response, the industry has widely adopted thermally enhanced embedded copper PCB technology to achieve efficient heat conduction.

To achieve cost optimization of high‑frequency substrates, modern designs typically adopt a hybrid stack‑up architecture, where only the RF signal layer employs high‑performance microwave dielectric materials. Most advanced products integrate a composite lamination process: patterned high‑frequency cores and thermal copper blocks are embedded and co‑laminated during multilayer pressing. Meanwhile, thermal copper blocks are processed with precision CNC cavities for surface‑mount assembly of power amplifier devices.

For high‑current winding PCBs, thermal reliability is a critical performance index, and embedded copper blocks are commonly utilized to satisfy heat dissipation specifications.

A conventional embedded‑copper PCB consists of a core substrate with machined pockets and copper inserts assembled therein. The top surfaces of the core and copper inserts are bonded to the outer copper foil through B‑stage prepreg. Zero‑clearance assembly between the copper block and pocket results in no resin encapsulation along the sidewalls, leading to insufficient interfacial adhesion strength and a high risk of copper block delamination and pull‑out failure.

To improve mechanical interlock and bonding reliability, embedded copper blocks are designed with a controlled peripheral clearance relative to the machined pocket. During hot pressing, resin flows into the gap and forms a reinforced resin fillet, enhancing structural stability.

Nevertheless, in a single‑side laminated structure where only the top surface of the copper block is bonded while the bottom remains exposed, the lack of mechanical support may still lead to loosening. Furthermore, resin flow during pressing may induce lateral shifting and positional deviation of the copper insert.

Model : High Frequency Embedded Copper PCB

Dielectric constant : 3.38

Structure :Rogres RO4003C+4450f

Layer : 4Layers pcb

Finished Thickness :1.6mm

Dielectric Thickness : 0.508mm

Material CoThickness : ½(18um)HH/HH

Finished Co Thickness : 1/0.5/0.5/1(OZ)

SurfaceTreatment :lmmersion Glod

Special process : High frequency embedded copper pcb

Application :Communication equipment pcb

High Frequency Embedded Copper PCB

Product Model: High-Frequency Embedded Copper Circuit Board

Description

Data Sheet