Name: Heavy Copper PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

Heavy Copper PCB is specially designed for high-current connection, power transmission and hybrid circuit applications. Driven by the rapid growth of automotive electronics and power communication modules, heavy copper circuit boards have become a high-potential special PCB product. Typical application scenarios include automotive electronics, IGBT module mounting, wind power converters, ignition coils and high-power industrial equipment.

As PCB functional requirements continue to upgrade, heavy copper PCB undertakes more comprehensive values beyond basic electrical connection and mechanical support, such as integrated power supply and high-current load bearing. High-reliability heavy copper PCB has become one of the core customized products of Maxipcb.

Heavy Copper PCB Process Upgrade

Traditional production of heavy copper PCB mainly adopts multiple solder mask lamination or electroplating copper thickening with extra-thick copper foil. Limited by conventional technology, the maximum copper thickness is only 0.41 mm (12 oz), and mass production for copper thickness over 12 oz faces huge technical barriers.

To break through limitations, Maxipcb has independently developed an advanced manufacturing solution. Drawing on stacked busbar technology, we adopt copper plate embedded bonding and overall process optimization, realizing stable production of heavy copper PCB with copper thickness above 0.5 mm (14 oz).

Power Converter Heavy Copper PCB Specification

Power converter heavy copper PCB mostly adopts 4-layer or above multilayer structure, with conventional copper thickness up to 1.6 mm. Serving high-current and high-voltage working conditions, thick copper materials and high-grade substrates are essential to avoid burnout and breakdown.

In terms of substrate selection:

Ordinary commercial PCB materials: TG below 140℃
Industrial power heavy copper PCB: medium TG ≥ 150℃, high TG up to 170℃

Higher TG materials deliver better high-temperature resistance and overall board stability. High-voltage heavy copper PCB design requires strict comprehensive consideration of current load and voltage insulation. Unreasonable layout will cause permanent board damage. Many industrial and military customers adopt IPC Class III and zero-defect acceptance standards, which are far stricter than consumer-grade PCB specifications.

Standard FR4 Heavy Copper Design Parameter

Inner layer 2 oz heavy copper: minimum line width / spacing = 6/6 mil
Outer layer 2 oz heavy copper: minimum line width / spacing = 7/7 mil

In standard FR-4 PCB, the minimum linewidth/spacing of Maxipcb inner 2OZ is 6/6mil

In standard FR-4 PCB, the minimum linewidth/spacing of the outer 2OZ of the Maxipcb is 7/7 mil

Heavy Copper PCB Lamination & Manufacturing Process

Typical 4-Layer Heavy Copper Structure

Inner copper: 2 oz; Outer copper: 2 oz; Minimum outer line width & spacing: 0.3 mm

Base material: FR4 glass epoxy copper clad laminate; Total board thickness: 1.6 mm

Surface treatment: single-sided etching; Bonding material: non-flow PP prepreg (0.1 mm)

Key Blackening Treatment

Copper surface blackening is a necessary pre-lamination process. It increases the contact area between copper and resin, improves resin wettability, and forms tight interfacial combination after curing. This process effectively eliminates lamination white spots, delamination and bubbling defects after 287±6℃ high-temperature baking.

Optimized Lamination Technology

Due to thickness deviation between ultra-thick copper and peripheral FR4 filling materials, conventional lamination causes severe defects. Maxipcb applies an integral mold pressing structure with upper and lower steel molds and silicone rubber buffer pads. Core parameters including lamination temperature, pressure and holding time are precisely controlled to ensure uniform pressure distribution.

Optimized lamination parameters:

Pressure: adjusted from 2.1 MPa to 2.94 MPa
Curing temperature of non-flow PP: 170℃

Verified by GJB362B-2009 military standards, finished heavy copper PCB features seamless and full lines, with qualified appearance, size and internal micro-section inspection.

Heavy Copper PCB Reliability Testing

Withstand Voltage Test
Each electrode is tested under AC 1000V for 1 minute, with no breakdown or arc flashing.
High-Current Temperature Rise Test
Custom copper busbars are used for series connection and high-current loading test. The temperature rise coefficient varies with heavy copper structure and layout to meet high-power operating demands.
Thermal Stress Test
Complying with GJB362B-2009 specifications, samples undergo high-temperature thermal stress testing. No defects such as delamination, bubbling, pad warpage and white spots occur after 287±6℃ extreme temperature impact.

All test results prove that Maxipcb heavy copper PCB maintains stable mechanical and electrical performance under high-current, high-voltage and extreme temperature environments, fully adapting to industrial power, new energy and automotive high-reliability application scenarios.

Model: Heavy Copper PCB

PCB Material: SY S1141

PCB Layer: 6Layers

Soldermask Color: Green

Silk Screen: White

Copper thickness: 2OZ/6OZ(70um)

Board Thickness: 2.8mmmm

Surface technology: Immersion Gold(1-3U)

Application: Power converter Heavy Copper PCB

Heavy Copper PCB

Description

Data Sheet