Name: HDI PCB Type-C Connector board
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

1. Definition of HDI PCB

High Density Interconnect (HDI) PCB is a high-precision printed circuit board characterized by significantly higher wiring density per unit area compared to conventional PCBs. Its core advantage lies in enabling more electronic components to be integrated within the same physical space, which not only enhances the overall electrical performance of equipment but also achieves remarkable reduction in product weight and size—perfectly aligning with the global trend of miniaturization and high integration for electronic devices.

2. Maxipcb’s HDI PCB Core Capabilities

Maxipcb is dedicated to breaking through the technical limitations of standard circuit boards, leveraging advanced technologies including ultra-thin core materials, fine line processing, and innovative via solutions. Our HDI PCB manufacturing capabilities not only minimize the size and weight of your components but also significantly enhance their operational performance, providing reliable support for your high-end product development.

For detailed technical parameters of our HDI PCB manufacturing processes, please refer to: HDI PCB Technics Capacity

3. HDI PCB Layer Structure & Key Process Features

3.1 Layer Structure Classification

Maxipcb offers a full range of HDI PCB layer structures, with clear classification based on microvia layers:

1+n+1: Single layer of microvias
2+n+2: Double layers of microvias (core structure for mainstream high-end applications)
3+n+3: Triple layers of microvias
4+n+3: Four layers of microvias
5+n+5: Five layers of microvias

3.2 High-Demand HDI PCB Characteristics

Maxipcb’s HDI PCBs integrate the most sought-after technical features in global markets, ensuring compatibility with high-end application scenarios:

Through vias (surface-to-surface connection)
Via-in-pad technology (optimized for component miniaturization)
Blind and/or buried vias (enhanced wiring density, reduced signal interference)
30 µm dielectric layers (improved high-frequency performance)
20 µm circuit geometries (ultra-fine line precision)
50 µm laser vias (high-precision interlayer connection)
125 µm bump pitch processing (adaptable to high-density packaging)

4. HDI PCB Application Industries

Maxipcb’s high-density circuit boards are equipped with technology-leading capabilities, driving innovation across a wide range of high-end industries, including but not limited to:

Semiconductor test equipment
Medical devices (high-reliability requirements)
Aerospace and defense (meets strict military-grade standards)
Communications (5G terminals, high-frequency devices)
Automotive electronics (intelligent driving, in-vehicle systems)

5. About Maxipcb

Maxipcb Circuits Limited (Maxipcb®) is a professional high-tech enterprise specializing in R&D, production, and global supply of high-precision HDI PCBs. With over a decade of industry experience, we have built a complete industrial chain covering raw material procurement, circuit design, manufacturing, quality inspection, and after-sales service. We hold international certifications including ROHS, UL, ISO 9001, and SGS, and strictly comply with IPC-A-600G, IPC-6018A, and military-grade quality standards.

Boasting a monthly production capacity of 30,000 ㎡, Maxipcb provides one-stop EMS (Electronics Manufacturing Services) including PCB fabrication, component sourcing, PCBA assembly, conformal coating, box build, and functional testing. Our independently developed PCB Automatic Quotation System (PAQS) enables seamless data connection between engineering, production, and global customer terminals, significantly shortening the product development-to-mass-production cycle.

Relying on advanced production equipment (Mitsubishi laser drilling machines, Hitachi mechanical drilling machines, LDI equipment, etc.), a professional technical team with 3-12 years of industry experience, and a strict full-process quality control system, Maxipcb has become a trusted partner of well-known global electronic enterprises, serving customers in Europe, North America, Asia, and other regions.

6. Maxipcb HDI PCB Competitive Advantages

Leading Precision: Stable production of HDI PCBs with 50 µm laser vias, 20 µm circuit geometries, and up to 5 layers of microvias, meeting the most demanding high-density design requirements.
Advanced Manufacturing: Full-process automated production and 100% AOI inspection, paired with independent surface treatment lines (immersion gold, OSP, spray tin, etc.), ensuring product consistency and reliability.
Cost Efficiency: Optimized lamination processes for 8-layer+ HDI PCBs, reducing manufacturing costs compared to traditional complex lamination, helping global customers control procurement budgets.
Global Service: One-stop customized services (DFM review, prototype trial, mass production), 24/7 fast response (complaint resolution within 4 hours), and mature global logistics support.

Model：Type-C Connector PCB

Material：High TG FR4

Construction：6Layers 2+N+2 HDI PCB

Finished Thickness：0.8mm

Copper Thickness ：1OZ

Color：Green /White（PSR:TAIYO INK）

Surface Treatment：Immersion Gold+OSP

Min Trace / Space：3mil/3mil

Min Hole：Mechanical Hole0.2mm，Laser Hole0.1mm

Specail Process：The tolerance requirement of Outline &PSR Tolerance are stick

Application： type-c data and power transmission

HDI PCB Type-C Connector board

Description

Data Sheet