Name: HDI IC Substrate Board
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

HDI IC Substrate Board

Product Model: HDI IC Substrate Board

Material: SI10U

PCB Layers: 6L (2+2+2 stackup)

PCB Thickness: 0.6mm

Single Unit Size: 35 × 35mm

Solder Mask Ink: PSR-4000 AUS308

Surface Treatment: ENEPIG

Min. Aperture: 0.1mm

Min. Line Width: 30μm

Min. Line Spacing: 70μm

Application: HDI IC Substrate Board

Description
Data Sheet

Core Features of SI10U(S)

Low coefficient of thermal expansion combined with high elastic modulus, which significantly suppresses dimensional deformation and warpage of packaging carriers during production and application.
Superior thermal stability and moisture resistance, adapting to complex high-temperature and humid working environments.
Outstanding fabrication compatibility, matching mainstream PCB and substrate mass production processes to ensure stable yield.
Adopts halogen-free environmental formula materials, complying with global green manufacturing and environmental protection regulations.

Main Application Coverage

Highly adapted for mass production of eMMC and DRAM memory substrates, AP/PA chip carriers, dual CM modules, fingerprint identification modules and radio frequency (RF) functional packaging substrates.

IC Package Substrate Basic Introduction

IC packaging frame is a critical specialized base material for chip module packaging. It provides mechanical protection for bare chips and acts as a reliable electrical bridge between integrated circuits and external system circuits. Usually supplied in golden ribbon form, it is processed through standardized packaging workflows: bare chips are mounted on the carrier frame by automatic placement equipment, wire bonding technology realizes electrical interconnection between chip pins and substrate circuits, and final encapsulation molding is adopted to complete module integration for subsequent assembly and application.

Most IC carrier boards are developed based on BGA architectural design. Though their manufacturing workflows are partially similar to conventional PCB products, they adopt ultra-high-precision production standards and customized process routes. As a core key material in advanced semiconductor packaging, IC substrates have gradually replaced traditional lead frames and become the mainstream packaging carrier for high-density chips.

There is essential difference between integrated circuits and printed circuit boards. An IC chip integrates complete circuit functions as a single indivisible unit; once internal circuits are damaged, the whole chip fails. In contrast, PCB serves as a circuit carrier for discrete electronic components, supporting independent soldering, replacement and after-sales maintenance of single devices.

IC Carrier Board Industry & Technical Parameters

IC substrate is a miniature high-precision circuit board dedicated for chip bearing. With compact overall dimensions and ultra-thin structure, its conventional board thickness ranges from 0.2 mm to 0.4 mm. Common core materials include BT resin and FR-5 high-performance dielectric materials, with ultra-fine circuit design up to 2mil/2mil line width and spacing.

In terms of industrial layout, high-end IC substrate manufacturing was previously dominated by Taiwanese manufacturers, while mainland production capacity and technical capabilities are now developing rapidly. At present, the mainstream mass production yield of the industry is about 75%. As a high-value precision electronic component, IC substrates are priced and supplied on a per-piece basis for customized packaging demands.

Model: HDI IC Substrate Board

Material: SI10U

Layers: 6L(2+2+2)

Thickness: 0.6mm

Single size: 35 * 35mm

Resistance welding: PSR-4000 AUS308

Surface treatment: ENEPIG

Minimum aperture: 0.1mm

Minimum line distance: 70um

Minimum line width: 30um

Application: HDI IC Substrate Board

HDI IC Substrate Board

Description

Data Sheet

Core Features of SI10U(S)

Main Application Coverage

IC Package Substrate Basic Introduction

IC Carrier Board Industry & Technical Parameters