• HDI 10Layer Mouse Bite PCB
  • HDI 10Layer Mouse Bite PCB

HDI 10Layer Mouse Bite PCB

Product Model: Consumer Electronics HDI Printed Circuit Board
Layers: 10-layer multilayer HDI board
Base Material: Shengyi S1000-2 high-performance FR-4 laminate
Stackup Structure: 1+4+X stacked HDI configuration
Finished Board Thickness: 0.8 mm
Copper Weight: 1 oz / 1 oz
Solder Mask Color: Green / White
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Minimum Line Width / Spacing: 3 mil / 3 mil
Application: HDI circuit boards for consumer electronic products
  • HDI 10Layer Mouse Bite PCB
  • Description

  • Data Sheet

1. Definition & Application of HDI Mouse Bite PCB

HDI Mouse Bite PCB, also known as half-metallized hole PCB or stamped hole PCB, refers to a special structure in which the board-edge plated through-hole is half-retained by secondary drilling and contouring processes. This structure allows direct soldering between the half-hole and the mating terminal, eliminating connectors and saving assembly space, making it widely used in signal transmission sub-boards and compact interconnection modules.

2. Standard Manufacturing Process Flow

The manufacturing process of HDI Mouse Bite PCB follows a strict sequence to ensure hole quality and structural stability:
  1. Outer layer circuit design & engineering DFM review
  2. Substrate pattern electroplating (copper deposition)
  3. Pattern tin electroplating
  4. Half-hole precision forming treatment
  5. Dry film stripping
  6. Selective etching

3. Key Process Control & Quality Challenges

The core difficulty of half-metallized hole processing lies in controlling hole-wall quality after forming, especially avoiding copper burrs, lifting, residues and delamination on the hole edge.
Boards with dense rows of small-diameter half-holes are mostly used as daughter cards welded to motherboards or component pins. Residual copper spikes can cause poor soldering, cold joints, or even bridging short circuits between adjacent pins. Therefore, refined process control is required throughout machining.
During CNC routing, the spindle rotates clockwise. At point A of the hole edge, the metallized layer is tightly bonded to the substrate, avoiding lifting and residue. At point B, the copper layer lacks sufficient support and tends to curl under tool force, which is the key area requiring targeted process optimization.





4. Design Specifications for HDI Mouse Bite

  • Size range: Hole diameter ≥ 0.6 mm; edge-to-edge spacing between adjacent half-holes ≥ 0.6 mm
  • Pad design: Half-hole pads must be symmetrically distributed across the board outline; the inner pad area beyond the board frame shall be larger than the routed hollow area
  • Minimum margin: Distance from half-hole pad to board corner ≥ 2.0 mm for clamping and structural strength
  • Forming method: V-CUT is strictly prohibited on half-hole edges; only CNC routing is allowed to avoid copper tearing or hole wall voids

5. Panelization & Assembly Rules

  • Standard stamp-hole panelization is adopted with connecting ribs between sub-panels; typical stamp hole diameter: 0.65–0.85 mm
  • Panel size shall be reasonably controlled to match SMT assembly lines
  • Mouse Bite PCBs do not support mixed panelization with other board types
  • Boards smaller than 10 × 10 mm do not support panelized delivery and must be shipped as single units
  • If panelization is necessary, a reserved margin of 1.6–2.0 mm shall be added around the board
  • Expedited orders for half-hole boards are generally not accepted due to complex process control





6. Cost Factors of HDI Mouse Bite PCB

Mouse Bite belongs to a special process requiring secondary routing and precise half-hole control. Most such boards are small in size with high-density structures, leading to relatively higher manufacturing costs. Non-standard design configurations will further affect process cost and delivery cycle.




Maxipcb Quality & Service System

Quality Policy

Centered on product quality and refined process control, Maxipcb® adheres to the principle of focusing on details, manufacturing high-standard products, and providing customers with satisfactory products and services throughout R&D, production and service.

Quality Objectives

  • On-time delivery rate: 100%
  • Production first-pass yield: 98%
  • Finished product acceptance rate: 99%

Service Objectives

  • Customer satisfaction rate: 99.9%
  • Customer complaint rate / return rate: 0.5% / 0.5%
  • Complaint response within 1 hour; processing completed within 4 hours

Engineering Document Review

A strict engineering review mechanism is implemented to verify customer design documents, identify manufacturability risks, and provide optimized suggestions to ensure stable production.

Full-Process Quality Inspection

  • Incoming material inspection: qualified warehousing, unqualified rejected
  • Tooling & fixture verification: qualified for use, unqualified repaired or replaced
  • In-process inspection: 100% inspection before next process, supported by regular patrol inspection

Product Acceptance Standards

  • IPC-A-600G (PCB Acceptance Quality Level, AQL)
  • IPC-6018A (High-Frequency PCB Standard)
  • GJB326A-96 (Military PCB Standard)

Core Product: AnyLayer HDI PCB for Android Smartphones

Maxipcb® has developed AnyLayer HDI PCB for Android smartphone motherboards with advanced laser drilling, sequential lamination and via-filling technologies. It features high circuit density, excellent signal integrity, compact layout and stable high-speed transmission, supporting the continuous upgrading of mobile smart devices.

HDI PCB Core Advantages

  • Cost efficiency for boards over 8 layers compared with traditional lamination
  • High integration and improved interconnection efficiency
  • Compatibility with stacked vias, laser direct drilling and other advanced processes
  • Superior signal integrity and electrical performance in high-speed scenarios
  • High reliability under high-temperature, high-humidity and strong-interference environments
  • Optimized thermal management and enhanced EMC performance against RFI/EMI/ESD
 


Cooperation & Design Guidelines

Customers are recommended to consult Maxipcb’s technical team before finalizing stack-up and layout to comply with DFM rules. Professional HDI manufacturing capabilities ensure high quality, low risk and on-time delivery for ultra-thin, high-density multilayer HDI boards.

About Maxipcb®

Maxipcb® is a professional high-precision PCB manufacturer focusing on R&D and production of advanced PCB products. With a complete product system, strict quality management and professional technical support, we provide customers with high-quality, cost-effective PCB solutions. For quotations or technical inquiries, please contact us via email.
 

Model : HDI Mouse Bite PCB

Layers: 10Layer 

Material: SY S1000-2

Construction : 1+4+q

Finished Thickness:0.8mm

Copper Thickness: 1OZ/1OZ

Color: Green/White

Surface treatment: ENIG

Min Trace / Space:3mil/3mil

Application: Consumer HDI PCB Board