Name: Halogen-Free PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
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Halogen-Free PCB

Product Model: Display Backplane Halogen-Free PCB

Base Material: S1150G

PCB Layers: 10 Layers

Solder Mask Color: Green / White

Finished Thickness: 0.8mm

Copper Thickness: 0.5oz

Surface Treatment: Immersion Gold

Min. Trace Width: 3mil (0.075mm)

Min. Line Spacing: 3mil (0.075mm)

Product Characteristic: Halogen-free (HF) compliant

Application: Display Backplane Circuit Board

Description
Data Sheet

Reason for Halogen Restriction

Halogen elements mainly include fluorine (F), chlorine (Cl), bromine (Br) and iodine (I). Traditional flame-retardant substrates such as standard FR-4 and CEM-3 widely adopt brominated epoxy resin as flame retardants, including tetrabromobisphenol A, polybrominated biphenyls and polybrominated diphenyl ethers. Such halogen-containing materials feature low cost and good compatibility with epoxy resin systems.

However, relevant research verifies that discarded halogen-containing flame-retardant materials will produce highly toxic and carcinogenic substances such as dioxins and benzofurans during incineration. Meanwhile, they release dense smoke and pungent odor. These toxic gases are non-degradable in the human body and seriously threaten ecological environment and human health.

For environmental protection and safety control, the European Union has issued regulations to restrict six hazardous substances including PBB and PBDE. Similarly, China’s industrial regulations stipulate that all electronic information products launched to the market after July 1, 2006 shall not contain lead, mercury, hexavalent chromium, polybrominated biphenyls, polybrominated diphenyl ethers and other harmful substances.

At present, the copper-clad laminate industry has completely phased out PBB and PBDE. Most mainstream manufacturers adopt alternative brominated flame retardants such as tetrabromobisphenol A. Though legally permitted, these conventional bromine-containing boards still have hidden risks:

Release toxic bromide fumes and heavy smoke during combustion or electrical fire;
Trace hydrogen bromide may be released under high temperature over 200℃ during HASL processing and component welding;
Potential dioxin generation risk remains under long-term high-temperature aging.
Such boards are legally usable but cannot be defined as halogen-free materials.

This specification sheet references IPC-4101/128 and is provided for general reference only.

All typical performance values are tested based on 1.6mm-thick specimens; Tg parameters are applicable to substrates with a thickness of 0.50mm or above.

All listed typical data are for reference only and shall not be regarded as formal specification standards. For detailed technical parameters, please contact Shengyi Technology Co., Ltd. All rights of this data sheet are reserved by Shengyi Technology.

Conditioning Code Description

C: Humidity conditioning
D: Distilled water immersion conditioning
**E Temperature conditioning

The three digits after the code respectively represent: ① preconditioning duration (hour), ② conditioning temperature (°C), ③ relative humidity.

Flame Retardant Principle of Halogen-Free PCB Substrate

Modern halogen-free PCB materials mainly adopt phosphorus-based and phosphorus-nitrogen composite flame-retardant systems.

Phosphorus-based resin will thermally decompose to produce metaphosphoric acid with strong dehydration performance during combustion, forming a dense carbonized film on the resin surface to isolate air and block combustion;
Phosphorus-nitrogen synergistic materials will release non-combustible gas when heated, further suppressing flame spreading and achieving efficient flame retardancy.

Core Characteristics of Halogen-Free PCB Materials

1. Excellent Insulation Performance

Halogen atoms are replaced by phosphorus and nitrogen elements, which reduces the molecular polarity of epoxy resin. It effectively improves volume insulation resistance and dielectric breakdown resistance, enhancing circuit operation stability.

2. Low Water Absorption

Nitrogen-phosphorus oxygen reduction resin contains fewer active electrons than halogen-based materials, reducing the probability of hydrogen bond combination with water molecules. Lower water absorption greatly improves the substrate’s moisture resistance, anti-delamination capability and long-term operational reliability in humid environments.

3. High Thermal Stability

Halogen-free materials feature higher nitrogen and phosphorus content, larger monomer molecular weight and higher Tg value. Under high-temperature conditions, molecular fluidity is significantly reduced, with a lower coefficient of thermal expansion. It effectively inhibits board warpage, layer separation and thermal deformation, and adapts to high-temperature lead-free welding and complex SMT processes.

Model : Display Backplane Halogen-Free PCB

Material : S1150G

Layer : 10Layers

Color : Green/White

Finished Thickness : 0.8mm

Copper Thickness : 0.5OZ

Surface Treatment : Immersion Gold

Min Trace : 3mil(0.075mm)

Min Space : 3mil(0.075mm)

Characteristic : Halogen-free(HF PCB)

Application : Display Backplane Halogen-Free PCB