Product Model: Half-Hole Automotive Core Control Module Multilayer PCB Base Material: High-Tg FR‑4 Laminate (Tg ≥ 170°C) Layer Configuration: 6-Layer Multilayer Structure Solder Mask & Silkscreen: Green Solder Mask with White Legend Finished Board Thickness: 0.8 mm Copper Weight: 1 oz for inner layers; 0.5 oz for outer layers Surface Finish: Electroless Nickel Immersion Gold (ENIG) Minimum Design Rule: 4 mil (0.1 mm) trace width / 4 mil (0.1 mm) trace spacing Half-Hole Specification: 0.5 mm castellated hole diameter Key Feature: Custom castellated half-hole structure for stable module interconnection Application: Automotive core control modules and vehicle electronic systems