Product Model: FPGA High-Speed Control Circuit Board
Substrate Material: High-Tg 180℃ laminate Layer Structure: 10-layer multilayer board Finished Board Thickness: 1.6 mm Copper Weight: 1 oz (inner layers) / 1 oz (outer layers) Solder Mask & Silkscreen: Blue solder mask with white text Minimum Line Width / Spacing: 4 mil / 4 mil Surface Finishing: Hard gold plating, 5μ" Application: High-speed signal circuit for FPGA modules