Focus on the production of high quality printed circuit boards

Name: Focus on the production of high quality printed circuit boards
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Product Model: HDI PCB for Micro SD Card

Base Material: Isola FR408 High-Performance FR-4 Laminate

Layer Configuration: 6-layer, 2+N+2 HDI stacked structure

Solder Mask Color: Black / White (dual options available)

Finished Board Thickness: 0.3mm (ultra-thin standard for memory card applications)

Copper Foil Weight: Inner layer 1/3oz, Outer layer 0oz (customized copper distribution for miniaturized products)

Surface Finishing: Adapted to Micro SD card miniaturization requirements, matching standard memory card PCB finishing

Special Process: No special customized processes

Precision Standard: High-precision routing, compatible with Micro SD card compact layout requirements

Application Field: Core circuit board for Micro SD memory cards (industrial and consumer grade)

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Description
Data Sheet

Micro SD is a miniaturized removable flash storage medium originally developed by SanDisk. After multiple naming iterations, the specification was officially unified as Micro SD under the standardization of the SD Association (SDA). Together with Mini SD and standard SD, it forms a complete series of portable memory card products.

Featuring ultra-compact dimension and large storage capacity, Micro SD is widely adopted in consumer electronics. Although primarily applied to smartphones, it is also extensively deployed in GPS navigation devices, portable audio equipment and miniature portable storage modules. With overall dimensions of 15mm × 11mm × 1mm, it ranks among the smallest commercial storage card form factors currently available on the market.

Equipped with a universal adapter, Micro SD can be compatible with standard SD card slots for cross-device expansion. Its mainstream capacity coverage ranges from 128MB up to 128GB. Since 2014, high-capacity Micro SDXC specifications have been commercially mass-produced, further expanding high-density storage application scenarios.

Micro SD card

PCB Design Guidelines for Micro SD Card Socket

1. Schematic & Naming Standardization

Unified management shall be implemented for schematic names, paragraph labels and document version information. Marking parameters and description contents in the lower-right area of schematics must be complete and standardized. For idle pins and unconnected socket terminals, redundant network labels and residual wiring segments shall be thoroughly removed to eliminate design conflicts and hidden short-circuit risks.

2. Engineering Document Export Requirements

Manufacturing deliverables shall include complete Gerber data and panel layout drawings. Material grade, substrate type and special process requirements must be clearly defined in production documents. Coordinate parameters and layer configuration need accurate calibration to guarantee file compatibility and production consistency.

Indicator components such as main control status lights shall be kept away from board edges, with a reserved safety spacing of no less than 0.5mm to satisfy SMT and mechanical forming tolerance.

CAD structural files shall be submitted to engineering teams in DXF format with unified millimeter unit specification, ensuring accurate structural matching and assembly verification.

3. Signal Wiring & Grounding Design

Clear priority classification is required for signal routing, among which CLK and VSD key control signals are defined as core priority lines. Clock signals shall be surrounded by complete ground shielding or adjacent ground plane isolation to suppress high-frequency interference and signal attenuation.

After signal routing completion, holistic copper pouring is adopted to maximize ground coverage. Isolation spacing between adjacent signal circuits shall be reasonably compressed under EMC compliance, and top/bottom ground layers shall conduct reliable interlayer connection. For distributed copper areas on both board sides, dense grounding vias are added to enhance ground integrity and overall shielding performance.

4. Layout Balance & Structural Stability

Component breakpoints and local layout distribution shall be arranged in a balanced manner, optimizing overall structural stress distribution and improving board-level bending resistance and long-term service stability.

Model : Micro SD card PCB

material: isola fr408

Layer ：6Layers 2+N+2 HDI

colour : black / white

Finished Thickness : 0.3mm

Copper Thickness: 1/3oz inside, 0oz outside. oz.

surface treatment : gold leaching

minimum track/ space : 2.5mil /2.5mil

Min Hole :Mechanical hole 0.2mm, Laser Hole 0.1mm

Application: Micro SDKA PCB