Name: Fibre-Optical Module PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

A fibre-optical module is a core optoelectronic conversion component that realizes mutual conversion between optical signals and electrical signals. It mainly consists of optical transmitters, optical receivers and electronic functional circuits. Optical modules are widely deployed in all scenarios involving optical signal transmission.

By functional classification, fibre-optical modules are divided into optical receiving modules, optical transmitting modules, integrated optical transceiver modules and optical forwarding modules.

1. Fibre-Optical Module PCB Panel Design

1.1 Panel Layout

For miniaturized optical module PCBs, central mirror symmetrical panel design is strongly recommended.

1.2 Fiducial Mark Design

Two fiducial marks are required on each unit board; if space is limited for two marks, at least one mark shall be reserved, and copper-ring-free fiducial points are acceptable.
Additional fiducial marks must be added on the auxiliary edge for unified positioning and assembly coordination.

1.3 PCB Panel Connection Methods

Milling Slot + Stamp Hole (Preferred)
Milling slot width: 2 mm; stamp holes are non-metallic.
Recommended stamp hole spacing: 1.0 mm; hole diameter: 0.5 mm.
The center of stamp holes shall be offset toward the optical module PCB. The minimum distance between stamp hole center and milling slot edge is 0.6 mm, to reduce edge burrs and avoid shell assembly interference.
Milling Slot + Solid Connection
Milling slot width: 2 mm; solid connection width: 2~10 mm; 1 mm forbidden wiring area reserved at the connection.
V‑CUT (Not Recommended)
V‑cut requires hob plate splitting instead of cutter splitting, which generates excessive mechanical stress and fails optical module layout forbidden-area requirements.

Priority order of connection: Stamp hole + milling slot > Solid connection + milling slot > V‑CUT.

2. PCB Layout & Placement Requirements

Component spacing shall comply with industry minimum dimensional standards; the spacing value refers to the minimum distance between pad-to-pad, pad-to-component body, and component-to-component body.
No components are allowed on PCB and FPC soldering surfaces.
Hotbar Welding Area: The hot pressing zone shall be 0.5 mm larger than the hot pressing head operation area, and the overall hot pressing length ≥ assembly length + 4 mm.
Screw-Fixed Optoelectronic Devices:
1. No components or non-ground vias within 1.5 mm around and underneath the device;
2. 1.5 mm forbidden area around the optical fiber sheath;
3. If non-ground vias are unavoidable, resin plug holes and silkscreen insulation are mandatory; non-ground through holes are prohibited directly beneath silkscreen areas.
A 0.25 mm assembly gap is reserved between screw holes and device screws, matched with ±0.25 mm device tolerance; the 1.5 mm forbidden layout range is formulated for overall assembly tolerance superposition.
For manually welded optical devices: 1.0 mm forbidden area for vias, test points and surrounding components. If through holes are necessary, full green oil plugging is required.
Exposed copper must not be directly connected to pads; a minimum 3mil solder mask isolation is required.
The layout of optical devices and electrical components shall reserve sufficient space for manual welding and after-sales maintenance.
The fiber outlet of optical devices shall not extend into the connector plugging forbidden area, to prevent tail fiber damage during plug-in operation.

3. PCB Routing Requirements

Recommended line width for traces connected to Hotbar reflow pads: 5~10 mil.
For large-area grounding design, the reserved lead length d ≥ 50 mil.
Key note: Excessively short leads for large-area grounding cause rapid heat conduction during hot pressing, leading to uncontrollable process parameters and defective welding. Thick/wide traces, dense vias and large copper foils accelerate heat dissipation, resulting in uneven temperature and inconsistent welding reliability.

4. Pad Design

Through holes are prohibited on non-heat-dissipation pads of all components.

5. Surface Treatment

ENIG (Immersion Gold) is the preferred surface finish for optical module PCBs.
OSP surface treatment is strictly forbidden for Hotbar welding pads.

6. PCB Thickness Specification

Complying with MSA industry agreement, the fixed board thickness of SFP and XFP optical modules is 1.0 mm.

Model : Fibre-Optical Module PCB

Material : MEGTRON 6(Panasonic M6)

Layer : 8Layers

Color : Green/White

Finished Thickness : 1.0mm

Copper Thickness : 1OZ

Surface Treatment : Immersion Gold+Gold finger

Min Trace : 4mil(0.1mm)

Min Space : 4mil(0.1mm)

Product features: impedance 100 ± 7%; 50 ± 10%; speed: 400g; tolerance between gold finger and plate edge: ± 0.05mm

Application :fbre-optical module pcb

Fibre-Optical Module PCB

Description

Data Sheet