Name: DPC ceramic substrate
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

Direct Plate Copper (DPC) ceramic substrate is a new type of ceramic substrate product integrating thin-film circuit technology and electroplating process. Its core advantage lies in the in-depth integration of ceramic processing technology and material technology, featuring high thermal conductivity, high insulation, high circuit precision, high surface flatness and other core characteristics. Moreover, its coefficient of thermal expansion can be accurately matched with chips, adapting to high-end application needs in various fields.

As a new process product developed with the iteration of high-power and small-size integrated circuit technology, DPC ceramic substrate will occupy a dominant position in the ceramic substrate industry in the future and become a core supporting product in the field of high-end electronic packaging, relying on its excellent comprehensive performance.

I. Core Technical Characteristics of DPC Ceramic Substrates

The core competitiveness of DPC ceramic substrates stems from their unique process design and material properties, which can be specifically summarized as follows:

High Thermal Conductivity: The substrate is made of high-performance ceramics such as alumina and aluminum nitride. Among them, the thermal conductivity of alumina ceramics can reach 15～35 W/(m·K), and that of aluminum nitride ceramics can reach 170～230 W/(m·K), enabling rapid heat conduction and dissipation;
High Insulation: The ceramic substrate itself has excellent insulation performance, can withstand high breakdown voltage, and can achieve reliable thermal-electric separation without additional insulation structures;
High Circuit Resolution: Relying on precision technology, high-precision circuit patterns can be prepared to meet the strict requirements of high-end electronic devices for circuit precision;
High Surface Flatness: The substrate has extremely high surface flatness, which can ensure the stability and reliability of chip mounting and reduce hidden dangers such as poor contact;
High Metal-Ceramic Bonding Strength: The bonding strength between the metal layer and the ceramic substrate can reach up to 45MPa (suitable for ceramic sheets with a thickness of more than 1mm), which can withstand temperature changes and mechanical stresses under complex working conditions;
Other Advantages: Supports PTH (Plated Through Holes)/Vias processes, with pure copper through-hole structure; can withstand large fluctuations in high and low temperature cycles, and can even work normally at a high temperature of 600℃; the ceramic substrate has a reasonable dielectric constant, resulting in low signal transmission loss.

II. Core Functions and Industry Pain Points of Packaging Substrates

As the core hub connecting chips and external circuits, the packaging substrate is a key link to open up the internal and external heat dissipation paths of chips. Its core functions include providing electrical connection, physical protection, mechanical support, heat conduction and assembly adaptation for chips, ultimately achieving the goals of multi-pin chips, miniaturization of packaged products, improvement of electrical performance and heat dissipation efficiency, and ultra-high density or multi-chip modular integration.

In recent years, with the continuous upgrading of electronic technology, the input power of chips has been continuously increasing, putting higher requirements on the performance of packaging substrates—it needs to have high electrical insulation, high thermal conductivity, and precise matching of coefficient of thermal expansion with chips. In the traditional metal PCB packaging scheme, an additional insulation layer is required to achieve thermal-electric separation. However, due to the extremely poor thermal conductivity of the insulation layer, the heat generated by the chip cannot be effectively conducted to the heat dissipation end, but instead accumulates near the insulation layer under the chip. Under high-power working conditions, serious heat dissipation bottlenecks are likely to occur, which cannot adapt to the trend of industry technology upgrading.

III. Solutions and Application Scenarios of DPC Ceramic Substrates

DPC ceramic substrates can effectively solve the heat dissipation pain points of traditional packaging schemes: the ceramic substrate itself has both excellent insulation performance and heat dissipation characteristics. The ceramic circuit board prepared based on DPC process can directly fix the chip on the surface of the ceramic substrate without additional insulation layers, realizing efficient thermal-electric separation, ensuring that the heat of the chip is quickly conducted to the ceramic sheet, and completely solving the heat dissipation problem under high-power working conditions.

Based on its excellent comprehensive performance, the application scenarios of DPC ceramic substrates have achieved multi-field coverage. They are not only widely used in traditional lighting fields such as stage lighting, landscape lighting and automotive headlights, but also suitable for packaging scenarios of high-power devices such as Vertical-Cavity Surface-Emitting Lasers (VCSEL) and Ultraviolet Light-Emitting Diodes (UV LED), becoming an important support for high-end electronic devices to achieve performance breakthroughs.

IV. Core Preparation Process of DPC Substrates

DPC substrates adopt precision thin-film manufacturing technology, and their core preparation process is as follows: first, a copper metal composite layer is sputtered and bonded on the surface of the ceramic substrate by vacuum coating to ensure a super strong bonding force between the copper layer and the ceramic substrate; then, yellow light lithography photoresist is used for exposure, development, etching and film stripping processes to complete the precise preparation of circuit patterns; finally, the circuit is thickened by electroplating/electroless plating process, and after removing the photoresist, the overall preparation of the metallized circuit is completed, ensuring the precision and reliability of the circuit.

V. Industry Development and Enterprise Services

At present, the electronic packaging industry is developing rapidly towards high density, high precision and high reliability. With its unique technical advantages, DPC ceramic substrate is fully in line with the industry development trend, and is a feasible and competitive preferred product for PCB manufacturers.

Maxipcb is deeply engaged in the PCB industry, focusing on the R&D and production of DPC ceramic substrates. It can provide customized services according to customer needs, and realize large-scale mass production based on the product design drawings and technical requirements provided by customers, providing customers with more targeted and humanized product solutions. In the future, Maxipcb will continue to deepen technical R&D, keep improving, create high-quality DPC ceramic substrate products, provide customers with better products and services, and achieve win-win development with customers.

Model : DPC ceramic substrate

Material : Ceramic aluminium oxide

Layer : 2Layers

Color : White

Finished Thickness : 2.4mm

Outer copper thickness : 2OZ

Surface Treatment : Hard Gold

Special process : pcb ceramic bracket

Application : LED substrate PCB

DPC ceramic substrate

Description

Data Sheet

I. Core Technical Characteristics of DPC Ceramic Substrates

II. Core Functions and Industry Pain Points of Packaging Substrates

III. Solutions and Application Scenarios of DPC Ceramic Substrates

IV. Core Preparation Process of DPC Substrates

V. Industry Development and Enterprise Services