Name: Double side Power PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

Power circuit PCB design must follow standardized power filtering and power distribution rules to suppress voltage ripple and ensure system stability. After power input, the current first flows through filter capacitors, and then supplies power to post-stage functional loads. Actual PCB traces contain inherent line resistance and distributed inductance; if power is tapped before the filter capacitor, residual high-frequency ripple cannot be effectively suppressed, resulting in degraded filtering performance and unstable circuit operation.

General Routing Design Guidelines

All power and signal traces shall adopt the widest feasible width and avoid overly thin wiring. Sharp angles and 90° right-angle bends are strictly prohibited for trace turning. Ground circuits shall be designed with widened traces, and large-area solid copper grounding is recommended to optimize grounding continuity, reduce interference and enhance overall circuit anti-noise capability.

For switching devices, gate units and core chips requiring filtering and decoupling, dedicated buffer capacitors must be configured and placed in immediate proximity to the target components. Excessive spacing will weaken decoupling efficiency and render noise suppression measures ineffective.

High-Voltage Safety & Creepage Distance Specifications

For power board development, all design schemes must comply with industrial safety isolation standards:

Fuse front AC area: The minimum electrical clearance between two AC lines, and between AC lines and the equipment shell or internal grounding, shall be ≥ 6 mm; the safety distance to shell grounding shall be ≥ 8 mm.
Fuse rear wiring: The minimum creepage distance between live wire and neutral wire shall not be less than 3 mm.
High and low voltage isolation: The isolation creepage distance between high-voltage and low-voltage zones shall be 8 mm or above. When the actual spacing is ≤ 8 mm, a 2 mm insulation slot must be added for reinforced isolation.
High-voltage marking requirements: High-voltage areas shall be printed with standard silk-screen high-voltage warning symbols (triangular exclamation mark), and enclosed by closed silk-screen frames with a frame width of no less than 3 mm. The minimum safe distance between the positive and negative terminals of the high-voltage rectification and filtering circuit shall be ≥ 2 mm.

Standard PCB Development Process

Complete schematic design according to product functional requirements and technical indicators.
Generate and verify network tables after schematic design is finalized.
Define board outline, positioning holes and keep-out boundary layers.
Import component packages and network data to build the complete engineering project.
Rational component layout. Component arrangement directly affects product service life, operational stability and EMC performance, and shall follow standardized principles:
- Placement sequence: Preferentially fix structurally constrained components such as power sockets, indicator lamps, function switches and external connectors, and lock their positions to prevent accidental displacement. Arrange heating elements, transformers, core ICs and special functional components secondly, and finally complete the layout of small discrete devices.
- Thermal optimization: For high-power circuits, heat-generating components such as power transistors and transformers shall be arranged dispersedly to avoid local heat accumulation. Heating devices must be kept away from electrolytic capacitors to prevent accelerated electrolyte aging and early component failure.

Post-Routing Optimization and Copper Laying Specification

After routing is completed, overall optimization shall be carried out, including silkscreen adjustment, local component fine-tuning, trace trimming and copper area planning, to facilitate subsequent mass production, circuit debugging and after-sales maintenance.

Large-area copper laying is widely used in PCB design, including GND ground copper and VCC power copper. Ground copper laying is the mainstream anti-interference solution; integral VCC copper laying is only applicable to high-current transmission scenarios, as improper power copper design may trigger short-circuit risks and component burnout. For sensitive signal lines susceptible to crosstalk, double-ground shielding routing is adopted for isolation protection. When applying large-area grounding copper, designers need to fully confirm ground network continuity, current magnitude, current flow direction and special design constraints to reduce hidden design risks.

Design Verification Before Production

Due to human negligence and operational errors, the actual network connection of the finished PCB may deviate from the original schematic. Comprehensive network inspection and rule checking must be performed. Design files can only be delivered to qualified PCB manufacturers such as Maxipcb after full verification, so as to ensure design consistency and improve production yield.

Model : Double side Power PCB

Material : FR4

Layer : 2Layers

Color : Green

Finished Thickness : 1.6mm

Copper Thickness : 1OZ

Surface Treatment : Free HASL pcb

Min Trace : 6mil(0.15mm)

Min Space : 6mil(0.15mm)

Application : Double side Power PCB

Double side Power PCB

Description

Data Sheet

General Routing Design Guidelines

High-Voltage Safety & Creepage Distance Specifications

Standard PCB Development Process

Post-Routing Optimization and Copper Laying Specification

Design Verification Before Production