Product Model: High-density interconnect PCB for digital electronic devices Layer Structure: 8-layer multilayer board, adopting 2+4+2 HDI laminated architecture Base Laminate: IT180A high TG FR4 substrate Overall Board Thickness: 1.0mm finished dimension Copper Foil Weight: Inner and outer layers both 0.5oz Solder Mask Option: Green and white ink available Surface Finishing: Electroless nickel immersion gold process Custom Special Process: Non-customized special craftsmanship Micro Routing Capability: Minimum line width and line spacing of 3mil/3mil for BGA areas Applicable Scope: Customized circuit substrates for mainstream digital electronic equipment