Name: Communication Instrument Multilayer PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Communication Instrument Multilayer PCB

Product Model: High-Precision Multilayer PCB for Communication Instruments

Base Material: TUC TU-768 High-Tg Glass Epoxy Laminate

Layer Structure: 10-Layer Multilayer PCB

Solder Mask & Silkscreen: Green Solder Mask with White Legend

Finished Board Thickness: 1.6 mm

Copper Weight: 1 oz for inner and outer layers

Surface Finish: Electroless Nickel Immersion Gold (ENIG), gold thickness: 2 μin

Minimum Design Rule: 3 mil (0.075 mm) trace width / 3 mil (0.075 mm) trace spacing

Key Characteristic: Custom high-precision impedance control capability

Application: Communication instruments and RF equipment

Description
Data Sheet

TU-768 / TU-768P Laminate & Prepreg Performance Overview

TU-768 and TU-768P series laminates and prepregs are manufactured from high-performance woven E-glass fiber impregnated with a specialized epoxy resin system. The material features excellent UV-shielding properties and high compatibility with automatic optical inspection (AOI) systems, making it suitable for high-reliability applications involving harsh thermal cycling conditions and complex assembly processes.

Key performance advantages include stable coefficient of thermal expansion (CTE), outstanding chemical resistance, high thermal stability, and excellent resistance to conductive anode filament (CAF) formation, ensuring long-term reliability in demanding environments.

TUC TU768 PCB

Material Requirements for Communication Equipment PCBs

The development of communication-grade PCBs is clearly oriented toward high-frequency and high-speed material systems and advanced manufacturing processes. Traditional leading material suppliers including ITEQ, Shengyi, Panasonic, and TUC have successively expanded their high-frequency material portfolios and launched a series of high-performance products, gradually breaking the monopoly pattern in the high-frequency substrate market. Healthy market competition will further improve material performance, processability, and supply stability.

For high-speed applications, 400G-class communication products typically require low-loss materials equivalent to M7N and MW4000 series. In backplane designs, M7N has become the minimum standard for low-loss substrates. Higher-capacity backplanes and optical modules will demand ultra-low-loss materials in the future. Optimized combinations of resin systems, high-performance copper foils, and specialized glass fabrics will achieve the best balance between electrical performance and cost-effectiveness. Meanwhile, increasing layer counts and routing density also introduce higher challenges for structural reliability.

Design Requirements for Communication Equipment PCBs

Communication PCB design must strictly meet high-frequency and high-speed transmission requirements. Impedance matching, stack-up configuration, trace spacing, via optimization, and other key design factors must fully satisfy signal integrity (SI) specifications. Design control focuses on six core dimensions: dielectric loss, embedded components, high-frequency phase and amplitude consistency, mixed routing, thermal management, and passive intermodulation (PIM) performance.

Process Technology Requirements for Communication Equipment PCBs

With the functional upgrading of communication equipment, demand for high-density interconnect (HDI) structures continues to grow, and HDI technology has become a core process field. Multi-order HDI structures and any-layer interconnection (ALIVH) solutions are increasingly widely used. New processes such as embedded resistance and embedded capacitance are also gradually being applied in high-end communication boards.

Key process control parameters include copper thickness uniformity, line-width accuracy, layer-to-layer registration, dielectric thickness control, back-drilling depth precision, and plasma desmear capability, all of which require refined process control.

Equipment & Instrument Requirements for Communication Equipment PCBs

High-precision manufacturing equipment and surface treatment lines with minimal copper roughness are preferred for communication PCB production. Professional testing equipment includes passive intermodulation (PIM) analyzers, flying-probe impedance testers, and high-speed transmission loss testing systems.

Advanced manufacturing equipment including high-resolution pattern exposure systems, real-time line-width and coupling-distance monitoring vacuum etching lines, high-uniformity electroplating systems, and high-precision lamination presses can effectively meet the strict manufacturing requirements of communication-grade PCBs.

Quality Monitoring Requirements for Communication Equipment PCBs

As signal transmission rates in communication systems continue to increase, manufacturing deviations have an increasingly significant impact on high-speed signal performance. This requires stricter control over dimensional deviations and process variations in PCB production.

Without upgrades to mainstream manufacturing processes and equipment, technical bottlenecks may restrict further development. For PCB manufacturers, achieving high-precision stable mass production is critical to meeting the quality requirements of next-generation communication equipment.

Model :Communication instrument Multilayer PCB

Material :Taiwan Tuc Tu-768

Layer: 10Layers

Color : Green/white

Finished Thickness:1.6mm

Copper Thickness: 1OZ

Surface Treatment : lmmersion Gold 2u''

Min Trace : 3mil(0.075mm)

Min Space : 3mil(0.075mm)

Characteristic :Need high precision impedance control

Application :Communication instrument PCB