Name: Carbon film hybrid integrated PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Carbon film hybrid integrated PCB

Product Model: Carbon Film Hybrid Integrated PCB

Base Material: Ceramic Substrate + Carbon Oil

PCB Layers: 2 Layers

Finished Thickness: 0.6mm

Copper Thickness: 1OZ (35μm)

Line Width: 0.2mm

Minimum Aperture: 0.3mm

Surface Treatment: Gold Plating

Application: Computer, automotive, communication, instrumentation and power supply industries

Description
Data Sheet

Thick Film Hybrid Integrated Circuit (THIC) represents a specialized category of hybrid integrated circuit substrates derived from PCB technology.

As a core branch of microelectronics, integrated circuits adopt standardized processing techniques to fabricate and interconnect discrete electronic components on a single substrate, forming miniaturized functional circuit systems. According to manufacturing differentiation, integrated circuits are classified into three mainstream types: semiconductor integrated circuits, thick film integrated circuits and thin film integrated circuits.

Thick Film Integrated Circuit (HFIC) utilizes mature thick film processing technologies including screen printing, high-temperature sintering and polymerization. Functional components and conductive interconnections are formed as thick film layers on insulating substrates, with the film thickness generally ranging from several microns to tens of microns.

Developed on the basis of the above three integrated circuit technologies, thick film hybrid integrated circuits adopt thick film processes to manufacture film-type components and circuit interconnections on independent insulating substrates. Meanwhile, micro transistors, monolithic semiconductor ICs and various passive components are mounted and assembled onto the substrate, realizing highly compact functional microcircuit modules.

Compared with conventional PCBs, THIC delivers outstanding comprehensive performance. It supports diversified component parameter configuration, features superior dimensional accuracy and operational stability, along with reliable inter-component insulation and excellent high-frequency performance. This technology enables streamlined development of high-voltage, high-current, high-power, high-temperature resistant and anti-radiation circuit solutions. Benefiting from flexible circuit design and short R&D cycles, THIC is highly adaptable to multi-variety and small-batch production modes, and has been widely deployed in aerospace, computing equipment, automotive electronics, communication facilities, precision instruments, power supply systems and consumer electronics.

Core Application Advantages of THIC

Capable of hybrid integration with IC chips to realize multi-component composite functional modules.
Printed thick film components withstand high specific power load; matched with high thermal conductivity substrates, the finished modules offer strong power bearing capacity, perfectly suitable for high-voltage and high-power circuit scenarios.
Optimized short-distance interconnection layout effectively reduces signal delay, meeting high-speed operation demands of computer equipment.
Finished modules undergo strict process screening to eliminate potential early failure risks, achieving higher operational reliability than single-chip ICs.
The integrated packaging structure delivers prominent advantages in moisture resistance, corrosion resistance and oxidation protection compared with traditional single-chip integrated circuits.
Compatible with surface mounting technology and chip component assembly processes, which facilitates automated mass production and improves overall manufacturing efficiency.

Model : Carbon film hybrid integrated PCB

Material : Ceramic Substrate+Carbon oil

Layer : 2Layers

PCB thickness : 0.6mm

Copper Thickness : 1OZ(35um)

Line width: 0.2mm

Minimum aperture: 0.3mm

Surface Treatment : gold-plated

Application fields : computer, automobile, communication, instrumentation, power supply

Carbon film hybrid integrated PCB

Description

Data Sheet

Core Application Advantages of THIC