Name: Camera Rigid-Flex PCB(R-FPCB)
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

1. Overview of R-FPCB (Rigid-Flex PCB)

With the technological iteration and industrial maturity of Flexible Printed Circuit (FPC) and Rigid Printed Circuit (PCB), Rigid-Flex PCB (R-FPCB) has emerged as a new composite circuit product. R-FPCB integrates flexible circuit boards and rigid circuit boards in accordance with relevant process requirements, combining the flexible characteristics of FPC and the structural stability of PCB, which is widely used in high-precision electronic products such as mobile camera modules.

Mobile camera module

2. R-FPCB Requirements & Process Details for Mobile Camera Modules

R-FPCB applied in mobile camera modules must not only meet the structural requirements of ultra-thinness and high flatness, but also retain the inherent advantages of R-FPCB. Importantly, it must maintain excellent flatness of components and chips after mounting to ensure the imaging precision and operational stability of the camera module.

For the manufacturing of R-FPCB for mobile camera modules, the following process designs are adopted: laser cutting deviation detection pads are etched on the base substrate, and no copper is laid on the inner and outer layers of the laser cutting path to avoid interference with cutting precision; adjacent two camera-specific R-FPCB can share the longest laser cutting line to optimize processing efficiency. Although the layout structure effectively solves the product thickness problem, there is currently no mature structural solution to address the issues of heat dissipation and structural strength.

3. Maxipcb R-FPCB Structural & Process Control

Maxipcb has strict control over the structural design and manufacturing process of R-FPCB for camera modules to ensure product performance meets high-precision requirements: the PCB adopts an upper-lower asymmetric structure, and Maxipcb strictly controls the board warpage within ≤ 0.75%; for the rigid board section, mechanical blind milling is adopted for window opening, which effectively prevents damage to the flexible board during cover removal; the flexible section is formed by laser processing, with a shape tolerance controlled at ± 0.05mm, ensuring precise matching with camera module components.

4. Maxipcb Company Strength & Global Layout

4.1 Product Application Scope

Maxipcb’s R-FPCB products are widely used in mobile camera modules, industrial equipment, medical equipment, automotive electronics, communications, digital products and aerospace fields, covering high-precision electronic product scenarios with diverse requirements.

4.2 Global Market & Service

Maxipcb’s products are exported to major global markets including Germany, France, the United States, Australia and Sweden. The company is committed to providing global customers with convenient, efficient and professional one-stop services, covering R&D, production, delivery and after-sales support.

4.3 Quality Certification & Assurance

Maxipcb holds UL certifications for various materials and thick PI thick copper products, and has passed the ISO9001 quality management system and SGS RoHS certification, establishing a comprehensive quality assurance system to provide safe and reliable products for global customers. Since its establishment, the company has focused on R-FPCB R&D and manufacturing, and has become a trusted cooperative partner in the industry.

5. R-FPCB Structural Features & Manufacturing Characteristics

5.1 Structural Features

R-FPCB is a composite circuit board formed by laminating flexible FPC substrates and rigid PCB substrates into an integrated component, enabling three-dimensional wiring design. This structural advantage effectively supports the miniaturization and lightweight design of mobile camera modules. A single R-FPCB can replace the composite PCB structure composed of multiple connectors, improving product performance and stability while maximizing the utilization of limited space inside the camera module. A standard 4-layer R-FPCB adopts a polyimide (PI) core with copper foils on both sides, laminated with FR4 rigid layers to form a high-reliability structure.

5.2 Manufacturing Characteristics

Compared with standard rigid PCBs, R-FPCB manufacturing involves multiple types of materials and more complex processes, resulting in a longer production cycle—typically, the cycle of a 4-layer R-FPCB is 5-7 times that of a standard 4-layer rigid PCB. Maxipcb relies on mature process control capabilities and advanced high-precision equipment to achieve a balance between production efficiency and product precision, effectively meeting the prototype and mass production needs of mobile camera module manufacturers.

6. Core Advantages of R-FPCB for Mobile Camera Modules

6.1 Ultra-Thin & High Flatness: The integrated structure of R-FPCB effectively reduces the overall thickness of the circuit, meets the ultra-thin design requirements of mobile camera modules, and maintains high flatness after component mounting, ensuring the accuracy of camera imaging.

6.2 Space Optimization & Cost Reduction: R-FPCB eliminates the need for connectors and HotBar processes, optimizes the internal space utilization of camera modules, reduces product volume, and saves component and process costs.

6.3 Enhanced Signal Reliability: R-FPCB shortens the signal transmission path, reduces signal attenuation caused by multi-medium switching, ensures stable signal transmission between components and chips of the camera module, and improves the operational stability of the product.

6.4 Flexible Adaptability: R-FPCB supports three-dimensional wiring, can be flexibly shaped according to the internal space constraints of camera modules, and has excellent high and low temperature resistance, anti-static interference and structural stability, adapting to the harsh working environment of electronic products.

6.5 Simplified Assembly: By reducing the number of connectors, R-FPCB reduces SMT mounting and overall assembly man-hours, eliminates FPC insertion and HotBar processes, simplifies the BOM, and lowers parts management and inventory costs for customers.

7. R-FPCB Application Adaptability & Cost Trend

In addition to mobile camera modules, R-FPCB is widely used in medical equipment, aerospace and high-end digital products, especially suitable for miniaturized, high-precision and high-reliability product scenarios. Although R-FPCB has a higher initial manufacturing cost, it provides an ideal solution for mobile camera modules requiring ultra-thin, high-flatness and space-saving design. With the continuous maturity of the R-FPCB industry, manufacturing costs are gradually decreasing, further improving its cost-effectiveness and market competitiveness.

8. Maxipcb’s Exclusive Advantages in R-FPCB for Mobile Camera Modules

8.1 Strict Material Selection

Maxipcb selects high-performance materials tailored for mobile camera module R-FPCB to ensure product performance and reliability:

• Flexible Substrate: Adopts DuPont AP adhesive-free PI substrates, which have excellent flexibility, electrical performance and heat resistance, avoiding the inherent defects of conventional adhesives and ensuring stable performance in the narrow space of camera modules.

• Rigid Substrate: Selects PI resin materials laminated with P95 substrates/prepregs, effectively avoiding warpage caused by resin incompatibility, and ensuring the high flatness of the rigid section after mounting.

• Adhesive: Uses No-flow prepregs for lamination to avoid glue overflow, ensuring the ultra-thin structure of the product; raw materials are strictly verified to meet RoHS, high Tg and impedance requirements, matching the high-precision needs of camera modules.

8.2 Precision Process Control

Maxipcb relies on professional technical teams and advanced high-precision equipment to strictly control each core process of R-FPCB manufacturing, ensuring product precision meets camera module requirements:

• Inner Layer Pattern Transfer: Adopts electrolytic cleaning technology to avoid substrate deformation, ensuring the cleanliness and roughness of the copper surface, and supporting line width/spacing of 0.1mm~0.15mm to meet high-density wiring needs.

• Multi-Layer Positioning: Uses OPE positioning and X-ray drilling technology to eliminate alignment errors caused by material expansion and contraction, meeting the inter-layer registration requirement of 0.1mm~0.15mm and ensuring precise matching of layers.

• Lamination & Drilling: Optimizes lamination parameters for PI substrates, uses silicone rubber gaskets to ensure product flatness; adopts high-speed drilling machines and high-quality drill bits to avoid drilling burrs, ensuring the precision of holes and the stability of component mounting.

Model : Camera Rigid-Flex PCB(R-FPCB)

Material : FR-4+PI

Layer : 4-6Layers

Color : Black/White

Finished Thickness : 0.3mm

Copper Thickness : 0.012mm/0.025mm

Surface Treatment : ENEPIG PCB

Minimum line width / distance : 0.05mm

Application : Mobile camera module rigid-flex pcb(r-fpcb)

Camera Rigid-Flex PCB(R-FPCB)

Description

Data Sheet