Burn-in Board

Key Design & Manufacturing Requirements for BIB Burn-in Board

1. Independent Power Isolation

   Each chip adopts an independent power supply loop and connects to the main power grid through series resistors, to prevent short circuits of a single chip’s power or signal from causing mass failure of other devices on the board.
2. High Current Marking Rule

   Clear marking is required on schematics for all traces with operating current exceeding 500mA.
3. High-Speed Impedance Matching

   For high-frequency wiring requiring impedance control, detailed parameters including copper thickness, trace width and PCB substrate material must be provided for precise impedance design.
4. Special Protection for Sensitive Devices

   Clear design instructions shall be marked for sensitive pins and precision components that require shielding, isolation or anti-interference processing.
5. Standard Crystal Oscillator Circuit

   Typical reference circuits and matching capacitance parameters must be provided for crystal oscillator peripheral circuits.
6. Digital & Analog Partition Design

   Clear specifications for layout and ground division of analog circuits and digital circuits are mandatory to suppress crosstalk.
7. External Signal Source Specification

   If an external signal source is required, the driving capability and key technical indicators of the supporting signal source shall be defined.
8. High-Temperature Mechanical Stability

   The PCB must maintain no deformation, warpage or distortion during long-term continuous operation at 150°C.
9. High-Temperature Electrical Reliability

   No open circuit, short circuit, copper delamination or circuit failure shall occur on the PCB under prolonged high-temperature working conditions.