Name: Blind vias IC Substrate
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Blind vias IC Substrate

Product Model: Blind Vias IC Substrate

Material: Mitsubishi Gas HF BT HL832NX

PCB Layers: 8 Layers

PCB Thickness: 0.6mm

Single Unit Size: 40 × 55mm

Solder Mask Ink: PSR-4000 AUS308

Surface Treatment: Soft Gold

Min. Aperture: 0.1mm

Min. Line Width: 30μm

Min. Line Spacing: 30μm

Application: Blind Vias IC Substrate

Description
Data Sheet

The adoption of blind and buried via technologies in IC substrate prototyping delivers transformative benefits for high-density electronic designs. It enables significant dimensional miniaturization and weight reduction of IC substrates, reduces required layer counts, enhances electromagnetic compatibility (EMC) performance, improves overall electronic product characteristics, lowers manufacturing costs, and streamlines the design iteration process.

Core Definitions

Blind vias: Plated through holes that interconnect surface circuit layers with internal circuit layers, without penetrating the entire substrate thickness.
Buried vias: Internal vias that exclusively establish electrical connections between adjacent inner layers, remaining completely invisible from the substrate surface.

Blind vias IC Substrate

Industry Evolution & Technical Background

Over the past century, the PCB industry has witnessed revolutionary technological advancements, with electronic assembly capabilities improving exponentially. To keep pace with the global trend toward smaller, lighter, and thinner electronic products, PCB technology has evolved to include flexible boards, rigid-flex boards, and high-density multilayer IC substrates with blind and buried via architectures.

Conventional multilayer PCBs rely on through-hole vias to interconnect all circuit layers. However, as electronic components continue to miniaturize and packaging densities increase, through-hole vias—even with diameters reduced from 1.0mm (DIP era) to below 0.2mm—still occupy valuable surface and internal routing space, becoming a critical bottleneck for further density improvement. This limitation has driven the widespread adoption of blind and buried via technologies in modern IC substrate designs.

Manufacturing Complexity & Capability Benchmark

The most effective approach to increasing PCB wiring density is to minimize through-hole usage and strategically implement blind and buried vias. However, blind and buried via IC substrate fabrication presents significant technical challenges, requiring precise control over drilling, plating, and lamination processes.

The ability to reliably manufacture high-quality blind and buried via IC substrates serves as a definitive benchmark for evaluating a PCB manufacturer’s comprehensive process capability, advanced design expertise, and accumulated engineering experience. Maxipcb maintains continuous investment in state-of-the-art manufacturing equipment and process R&D, delivering high-precision blind and buried via IC substrate prototyping and mass production services to meet the stringent requirements of high-density electronic applications.

Model: Blind vias IC Substrate

Material: Mitsubishi Gas HF BT HL832NX

Layers: 8layers

Thickness: 0.6mm

Single size: 40 * 55mm

Resistance welding: PSR-4000 AUS308

Surface treatment: soft gold

Minimum aperture: 0.1mm

Minimum line distance: 30um

Minimum line width: 30um

Application: Blind vias IC Substrate

Blind vias IC Substrate

Description

Data Sheet

Core Definitions

Industry Evolution & Technical Background

Manufacturing Complexity & Capability Benchmark