Name: BGA IC Substrate Board
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

BGA IC Substrate Board

Product Model: BGA IC Substrate Board

Material: HL832NXA

PCB Layers: 2 Layers

PCB Thickness: 0.2mm

Single Unit Size: 35 × 25mm

Solder Mask Ink: PSR-4000 AUS308

Surface Treatment: Soft Gold

Min. Aperture: 0.1mm

Min. Line Width: 30μm

Min. Line Spacing: 30μm

Application: BGA Package IC Substrate PCB Board

Description
Data Sheet

Core Technical Advantages

Micro fine-line process, supporting 30 μm / 30 μm line width and spacing for high-density interconnection.
Laser micro-via forming technology enables compact hole design and further improves routing density.
Adopt high-reliability thermosetting synthetic resin to ensure long-term structural and environmental stability.
Customizable surface finishing including nickel-gold plating, SAC soldering and other options to match diverse packaging requirements.
Comply with environmental protection specifications, providing lead‑free, fluorine‑free and other green material solutions.

BGA IC Substrate Board

BGA IC Substrate Overview

Driven by the rapid iteration of advanced packaging forms such as BGA and CSP, high-performance IC substrates have developed rapidly as dedicated chip carriers. As one of the most high-end circuit board products, IC substrates, together with any-layer HDI and rigid-flex PCBs, see fast-growing market demand, and are widely applied in communication equipment, consumer electronics and high-end industrial fields.

IC substrate is a specialized carrier for bare chip packaging, serving as the key intermediate connecting semiconductor chips and motherboards. Its core functions cover mechanical fixation of bare chips, internal circuit interconnection, chip protection, structural reinforcement and heat dissipation channel construction.

IC Substrate Classification

By Packaging Type

BGA Substrate
Excellent heat dissipation and electrical performance, supporting high pin counts above 300 pins, suitable for high‑performance large-scale IC packaging.
CSP Substrate
Features ultra-light and ultra-thin dimensions close to the chip size, mainly used for memory, portable communication products and low-pin-count electronic devices.
FC Flip-Chip Substrate
Adopt flip-chip bonding design, with low signal crosstalk, low transmission loss and efficient heat dissipation, ideal for high-frequency and high-speed circuit scenarios.
MCM Multi-Chip Module Substrate
Integrate multiple functional chips in a single package to realize miniaturized system-level integration. Restricted by multi-chip layout, it faces challenges in anti-interference, heat dissipation and ultra-fine wiring design.

By Substrate Material

Rigid Substrate: Made of epoxy, BT or ABF resin, with CTE ranging from 13~17 ppm/°C.
Flexible Substrate: Based on PI or PE resin, CTE at 13~27 ppm/°C, suitable for bendable and lightweight devices.
Ceramic Substrate: Composed of alumina, aluminum nitride, silicon carbide and other materials, with low CTE of 6~8 ppm/°C, for high-stability high-end applications.

By Bonding Process

Mainly divided into wire bonding, TAB bonding and flip-chip (FC) bonding processes, to meet different packaging assembly requirements.

Application Fields

IC substrate PCBs are widely used in high-density, miniaturized and high-performance electronic products, including smartphones, laptops, tablets, network communication terminals, medical electronics, industrial control, aerospace and military equipment.

From traditional multilayer boards and HDI structures to SLP and IC substrates, rigid circuit boards continue to iterate toward semiconductor-level manufacturing standards. Among them, SLP adopts substrate-like manufacturing flows, which greatly narrows the technical boundary between high-end PCB and packaging substrate.

Manufacturing Challenges of IC Substrate

Compared with conventional PCB products, IC substrates impose stricter requirements on comprehensive performance and process precision.

Ultra-thin core material is prone to structural deformation, especially for board thickness below 0.2 mm. Stable production relies on optimized shrinkage control, lamination parameter calibration and high-precision layer alignment systems, so as to effectively suppress substrate warpage and control lamination thickness consistency.

Model: BGA IC Substrate Board

Material: HL832NXA

Layers: 2L

Thickness: 0.2mm

Single size: 35 * 25mm

Resistance welding: PSR-4000 AUS308

Surface treatment: Soft Gold

Minimum aperture: 0.1mm

Minimum line distance: 30um

Minimum line width: 30um

Application: BGA package IC Substrate PCB Board

BGA IC Substrate Board

Description

Data Sheet

Core Technical Advantages

BGA IC Substrate Overview

IC Substrate Classification

By Packaging Type

By Substrate Material

By Bonding Process

Application Fields

Manufacturing Challenges of IC Substrate