Name: BGA IC Substrate
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

1. BGA IC Substrate Frame

The BGA IC substrate frame is a core special raw material dedicated to advanced chip packaging. It provides mechanical protection for bare chips and builds a stable electrical interconnection interface between IC dies and external circuit systems. It is generally supplied in golden ribbon-shaped continuous roll materials.

In standard packaging workflows, substrates are precisely mounted on the frame by high-speed automatic placement equipment. Wire bonding processes are adopted to achieve electrical conduction between chip contacts and frame circuit nodes. Finally, professional encapsulation materials are used for overall protection to complete integrated BGA packaging modules, meeting subsequent SMT and system assembly requirements. At present, key IC substrate frame materials and accessories still rely on imported supply channels.

2. Technical Specification of TAIYO PSR4000 AUS308 Special Ink

TAIYO PSR4000 AUS308 is a high-performance customized solder resist ink exclusively developed for IC substrate production. It delivers outstanding chemical resistance against severe surface roughening and browning pretreatment, with stable film adhesion and no peeling or oil shedding. Featuring fine and uniform ink texture, this material perfectly matches the combined process of sandblasting and super coarsening, and maintains stable performance for ENEPIG and Ni/Pd/Au surface finishing, with uniform and exquisite appearance color.

Process Control Key Points

Copper surface cleanliness is the core control indicator, while excessive substrate roughness is unnecessary. Sandblasting is the preferred process to unify copper surface consistency; volcanic ash grinding presents weaker overall effect. Moderate treatment is sufficient to eliminate subtle copper surface color difference, with 280-mesh emery recommended for sandblasting.

Curing & Baking Parameters for Plugged-hole Boards

Segmented temperature curing: 75°C for 1 hour → 95°C for 1 hour → 110°C for 1 hour;

After legend printing: 150°C baking for 50 minutes, plus 25-minute staged drying;

Horizontal drying section fixed at 180°C to ensure full ink curing and long-term surface resistance.

3. BGA Packaging Technology Overview

BGA (Ball Grid Array) is a mature high-density surface mounting packaging solution. Different from peripheral pin layout, it adopts grid-arranged spherical solder joints as bottom I/O terminals, and is widely applied in main control chipsets, high-speed memory and high-performance semiconductor devices, with ceramic substrates as the mainstream high-reliability material.

With BGA packaging, memory chips achieve 2~3 times capacity expansion under the same outline dimension. Compared with traditional TSOP packaging, BGA features miniaturized size, efficient heat dissipation and superior high-frequency electrical performance, greatly enhancing circuit integration density. Under the same capacity configuration, BGA component volume is only one-third of TSOP products, and its multi-point array heat conduction structure effectively optimizes overall thermal dissipation efficiency.

4. Core Mechanism & Advantages of BGA

BGA realizes electrical interconnection with motherboards through circular or columnar array solder balls on the substrate bottom. Its core design breaks the limitation of peripheral lead layout: I/O quantity is greatly increased with enlarged solder ball pitch, which effectively improves SMT placement yield. Supported by CCP controlled collapse soldering technology, it balances power consumption and electrothermal performance. Meanwhile, the optimized ultra-thin structure reduces weight and thickness, suppresses parasitic parameters, shortens signal transmission delay, and adapts to high-frequency operating conditions. In addition, integral coplanar soldering further enhances assembly stability and long-term operational reliability.

5. Key Technical Characteristics of BGA Packaging

High I/O Integration
I/O scale is determined by package size and solder ball pitch. Array layout greatly increases pin quantity and reduces occupied assembly area. Compared with PLCC and QFP conventional packaging, BGA can reduce outline size by more than 30%, realizing high-density circuit integration.
High Assembly Yield & Controlled Cost
Traditional peripheral narrow-pitch packages are prone to pin deformation and soldering failure. BGA standard solder ball pitches cover 1.5mm, 1.27mm and 1.0mm, and fine-pitch CSP-BGA adapts to 0.5mm miniaturized specification. Compatible with existing SMT equipment, its mass production defect rate is controlled below 10ppm, effectively lowering comprehensive manufacturing costs.
Efficient Heat Dissipation Performance
Large-area and short-path contact between array solder balls and the base material forms a multi-dimensional heat dissipation channel, rapidly exporting core heat and meeting the heat dissipation demands of high-power chips.
Excellent High-speed Signal Performance
Short solder ball interconnects reduce lead inductance and resistance, optimize signal integrity, minimize transmission delay and crosstalk, and fully adapt to high-speed digital and radio frequency circuit design.
High Assembly Coplanarity
Integral array molding ensures high coplanarity of I/O terminals, avoiding welding defects caused by flatness deviation and reducing assembly loss in mass production.
MCM Multi-chip Integration Compatibility
BGA architecture supports MCM multi-chip module packaging, enabling hybrid integration of multiple functional chips to realize lightweight, miniaturized and high-performance system-level packaging.
High Mechanical Stability
Compared with fine-pitch QFP and PLCC packages, array solder ball structure provides stronger mechanical shock resistance and vibration resistance, with higher structural stability and environmental adaptability for long-term service.

Product Name:BGA IC substrate

Plate:Mitsubishi Gas HF BT HL832NX-A-HS

Minimum width / spacing:30 / 30um

Surface:ENEPIG(2U)

PCB thickness:0.3mm

Layer:4Layers

Structure:1L-4L,1L-2L,3L-4L

Solder mask ink:TAIYO PSR4000 AUS308

Aperture:Laser hole 0.075mm, Mechanical hole 0.1mm

Application:BGA Circuit Board

BGA IC Substrate

Description

Data Sheet