Name: ATE Load board PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

ATE testing is highly dependent on the design of the ATE interface board. A high‑quality probe card and load board are critical to ensuring stable mass production yields. In general, ATE test engineers define board‑level requirements and complete schematic design, while professional PCB manufacturers undertake layout and routing. Test engineers are responsible for reviewing all design deliverables to verify compliance with test specifications.

PDN Design for High‑Power SoC

Complex high‑performance chips such as CPU, GPU and APU deliver extreme power consumption under full‑load operation. Meanwhile, advanced semiconductor processes further reduce core operating voltages — for example, the digital core voltage of TSMC 7nm process is only 0.7V. This brings strict requirements for PDN (Power Distribution Network) design.

The PDN must maintain low and flat equivalent impedance across the full frequency spectrum, to avoid severe voltage drop caused by instantaneous current surges during chip dynamic switching.

PDN Impedance Optimization & Decoupling Capacitor Layout

Essentially, PDN impedance tuning relies on reasonable configuration and layout of bulk capacitors and decoupling capacitors:

Die & Package Capacitors
On‑die and on‑package capacitors (typically 1μF) dominate high‑frequency impedance suppression. This high‑frequency optimization is limited by chip packaging and cannot be improved through external PCB design.
Low‑Frequency Impedance Improvement
Low‑frequency PDN impedance is mainly restricted by the internal resistance and inductance of the power supply. High‑capacity tantalum capacitors arranged near the power input terminal can effectively optimize low‑frequency loop performance.
Full‑Band Intermediate Frequency Decoupling
Multiple types of decoupling capacitors need to be densely placed near DUT power pins to stabilize PDN impedance within the 10kHz ~ 10MHz frequency range.
Power/Ground Layer Coupling Capacitance
The inherent parasitic capacitance between power and ground layers serves as natural high‑frequency decoupling (several nF). This capacitance can be increased by reducing core layer spacing and adopting high‑DK dielectric materials.

Via Design Optimization

For PDN design, the parasitic inductance of decoupling capacitor vias must be strictly controlled. During PCB review, the pad and via placement of each capacitor should be optimized to eliminate redundant stubs and extra traces, which would otherwise increase loop inductance and degrade transient power response.

High‑Speed Signal Impedance Continuity

High‑speed signal traces are extremely sensitive to structural mutations:

Vias, pogo pins and mounted components all cause impedance discontinuity and signal integrity degradation;
Dense RX/TX differential vias easily introduce crosstalk and coupling interference;
PCB manufacturing process tolerance will lead to actual impedance deviation from design values.

Common optimization methods such as ground voiding are widely used. By locally removing the reference ground copper of microstrip lines, equivalent impedance can be adjusted to match stripline impedance and achieve consistent differential impedance.

Grounding Design Specification

Separate grounding domains including digital ground, analog ground and RF ground are required for mixed‑signal test boards. All grounding branches must adopt star single‑point grounding converged near the DUT. The common grounding node shall not be moved away from the chip side to avoid ground loop noise and potential interference.

PCB Stack‑Up Design Principles

Conventional stack‑up: Arrange RF and mixed‑signal layers on the top and bottom outer layers to reduce via inductance; place power layers in the inner core to suppress EMI radiation.
Isolation layout: Keep digital power layers and digital signal layers far away from analog/RF grounding and analog/RF signals. The power layer adjacent to analog ground is recommended to allocate low‑current and low‑ripple power rails.
High‑power chip stack‑up (CPU / GPU): Arrange power layers on the upper layer to shorten power vias and optimize PDN performance. Correspondingly, decoupling capacitors need to be arranged on the socket side instead of the bottom layer.

Low Noise Design for Precision Analog Circuits

High‑precision ADC and DAC circuits have stringent requirements on board‑level bottom noise. Direct power supply from the built‑in ATE power supply will introduce high ripple and background noise. The recommended solution is to adopt ultra‑low noise LDO for independent analog power supply.

In addition, all ADC analog input traces and DAC analog output traces should adopt complete analog ground shielding. Dense grounding stitching vias are arranged along the shielding boundary to isolate external coupled noise.

High‑Speed PCB Material Selection

Standard FR4 dielectric materials feature cost advantages but exhibit large insertion loss for high‑frequency high‑speed signals. For high‑speed test boards, low‑loss high‑frequency substrates are required to reduce signal attenuation.

If a hybrid stacked PCB adopts multiple different dielectric materials, the mismatch of thermal expansion coefficient (CTE) and cooling shrinkage coefficient between dissimilar materials must be fully evaluated to prevent board warpage, layer delamination and thermal stress failure.

Maxipcb provides professional high‑speed ATE test board, PDN high‑current board and mixed‑signal high‑precision PCB customization, supporting high‑layer stack‑up, low‑impedance routing, high‑frequency material stacking and strict industrial testing standards.

Model : ATE Load board PCB

Material : TUC/TU872HF

Layer : 28Layers

Color : Yellow

Board Thickness: 5.0mm

Surface technology: hard gold 3-15u

Copper thickness: inner layer 2OZ, outer layer 2OZ

Special process: metal cladding, depth control drilling

Application : ATE Load board PCB

ATE Load board PCB

Description

Data Sheet