Anylayer HDI 10Layer PCB

Founded on 17 years of in-depth manufacturing accumulation, Maxipcb® is a professional manufacturer focusing on high-frequency radio frequency and microwave printed circuit boards. With rich experience in high-end PCB mass production and customized fabrication, our team fully recognizes that dielectric substrate selection acts as the decisive factor for high-frequency circuit electrical performance, signal stability and environmental adaptability.

In high-frequency design and mass production, core indicators including operating frequency spectrum, microwave load capacity, continuous working temperature range and electrical operating parameters must be precisely matched with board materials. Our technical team has long-term verification and practical application experience with various high-frequency dielectric laminates. A complete range of mainstream high-frequency substrates are kept in sufficient inventory, enabling rapid prototyping and efficient mass delivery cycles.

Stable manufacturing quality is underpinned by mature technical engineering teams, standardized production workflows and a rigorous quality assurance system. Cross-department collaboration runs through the whole production process, from incoming material inspection, in-process operation monitoring to finished product performance testing, to ensure every batch of products complies with industrial manufacturing specifications. We always take product quality as the core development strategy, and firmly believe that stable quality is the cornerstone of long-term global strategic cooperation. Over years of development, we have continuously optimized processing technology, upgraded production equipment and expanded manufacturing capabilities, growing together with global partners to meet evolving high-frequency PCB design demands.

We provide full-spectrum customized PCB solutions, covering microwave radio frequency composite boards, mixed dielectric high-frequency boards, conventional FR4 double-sided and multi-layer circuits, staged HDI boards (1~3+N+3), any-layer HDI interconnection boards, rigid-flex hybrid PCBs, blind & buried hole structural boards, backdrill boards, dedicated IC substrates and heavy copper power circuit boards. Our products are widely deployed in Industry 4.0 intelligent equipment, communication infrastructure, industrial automation, digital terminals, power supply systems, computer hardware, automotive electronics, medical devices, aerospace equipment, precision instruments, defense industry and IoT facilities.

Diversified surface finishing processes are available to satisfy different welding, conductivity, corrosion resistance and environmental reliability requirements: OSP, Electroless Nickel Immersion Gold, Lead-Free HASL, Hard Gold Plating, Soft Gold Plating, Immersion Tin, Immersion Silver, Electrolytic Hard Gold

We support high-precision and special customized processes for high-reliability application scenarios: Golden finger profiling, heavy copper circuit fabrication, blind & buried hole processing, precision impedance tuning, resin plugging, carbon ink printing, controlled-depth backdrilling, countersink hole machining, depth-locked drilling, half-plated holes, press-fit holes, removable blue solder mask, peelable solder resist, ultra-thick copper circuits and oversized board customization.

We adopt globally renowned high-performance dielectric materials for high-frequency and high-speed projects: Rogers series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870 Universal high-frequency brands: Arlon, Isola, Taconic, PTFE F4BM and full-spec Teflon low-loss laminates

Flexible multi-layer stacking design is optional, with configurable layer counts from 2 layers up to 30 layers, meeting diversified structural demands of high-frequency, high-speed and high-density circuit designs.

A wide range of dielectric constant options are fully covered to lower high-frequency signal loss and optimize transmission performance: DK: 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.60, 6.15, 10.2

Our high-frequency RF and high-speed PCBs are widely applicable to consumer electronic terminals, aerospace & defense equipment, antenna communication systems, high-power industrial facilities, medical precision devices, vehicle electronic systems, automated industrial equipment, cellular handheld terminals, wireless WiFi modules, automotive intelligent telematics, edge computing hardware, radar detection systems and radio frequency power amplifier modules.