Description
Data Sheet

1. Application & Functional Positioning of AI Server PCBs

PCB acts as the core interconnection carrier in AI servers, responsible for the stable connection and reliable operation of key components including processors, memory modules, computing accelerators and power management systems. To support large-scale data processing and high-performance computing clusters such as GPU/TPU, AI server PCB design must focus on high-speed signal transmission, high power density adaptation and efficient thermal management, forming a fundamental hardware platform for AI computing.

2. Main PCB Categories in AI Servers

AI server PCB mainly covers three technical routes:

GPU core boards mostly adopt high-layer structures above 20 layers;
Compact AI accelerator modules are mainly equipped with 4–5 layer HDI boards to achieve high-density interconnection;
Conventional CPU motherboards serve as the basic control and support carrier of the whole machine.

With the iterative upgrading of AI server architecture, GPU motherboards are gradually adopting HDI structures. Advanced HDI products, especially those above 4th order, will become the fastest-growing segment in the AI server PCB market in the next five years.

3. Application Scenarios & Technical Characteristics

In server systems, PCBs are widely used in accelerator cards, motherboards, power backplanes, hard disk backplanes, network cards, adapter boards and other components. The core technical characteristics are high layer count, high aspect ratio, high wiring density and high-speed signal transmission. With the continuous upgrading of server platforms, the layer count of PCBs keeps rising, putting forward higher requirements for base materials, design schemes and manufacturing processes.

4. Supply Chain & Supporting Relationship

The supply mode of AI server PCB is divided into three categories:

GPU module PCBs are designed by GPU chip manufacturers, who dominate the PCB supplier selection and supply arrangement.
CPU module PCBs follow the supporting system of complete machine manufacturers. CPU core carrier boards are designated by chip designers, while motherboard and expansion card PCBs are specified by end customers. For most functional PCBs with chips, customers put forward design requirements to component manufacturers, who independently complete PCB procurement.
Accessory PCBs are usually directly purchased by customers from professional module manufacturers. Even if customers put forward targeted design requirements, module suppliers still have independent decision-making power in PCB procurement.

5. Technical Upgrading of Power Supply System PCBs

In the upgrading of AI server power supply, PCBs have achieved comprehensive optimization in materials, technology and structure. As the carrier of power devices, they are mainly used in power switches, filter modules, voltage regulators, radiators and other components. Compared with standard server PCBs, AI server power supply PCBs have significant improvements in material performance and manufacturing technology:

(1) Thickened Copper for High Current Carrying

PCB conduction relies on copper circuits; thicker copper foil significantly improves current carrying capacity. Copper foil accounts for about 9% of PCB raw material cost and about 40% of copper clad laminate cost, while CCL itself accounts for more than 30% of PCB cost. Thickening copper puts forward higher requirements for lamination, drilling, electroplating and other processes, and significantly enhances the product added value.

(2) Embedded Power Module for Higher Power Density

Embedded power module technology greatly improves power density. Compared with traditional packaging, it can increase the single semiconductor current capacity by about 40%, or reduce the number of chips by one-third under the same current output. Under the same power output, the material cost of power modules can be reduced by about 20%, and the switching loss of the whole inverter can be reduced to one-third of the traditional scheme, effectively suppressing the loss growth caused by high-frequency switching.

(3) High Thermal Conductivity Materials & Thermal Management Optimization

High thermal conductivity substrate materials improve heat dissipation efficiency. With low thermal conductivity of resin media, copper circuits and vias become the main heat conduction paths. Key thermal control measures include increasing copper retention, increasing thermal vias and thickening copper in holes, embedding copper blocks or ceramic sheets, and optimizing wiring layout to avoid local hot spots.

6. Core Technical Challenges

High-Speed Signal Integrity

AI servers rely on high-speed interconnection interfaces such as PCIe 5.0/6.0, CXL and HBM. During high-speed differential signal transmission, problems such as crosstalk, reflection, delay and insertion loss are likely to occur. With the increase of PCB layers and wiring density, maintaining high signal integrity and low transmission delay becomes more difficult.

High Material & Manufacturing Cost

AI server PCBs often use high-performance low-Dk/Df high-speed materials and even mixed pressing materials, combined with ultra-high layer count (≥20 layers), precision HDI and blind/buried via technology. These factors lead to a significant increase in manufacturing cost and difficulty in ensuring yield, restricting large-scale cost-effective application.

7. Industry Development Opportunities

Driven by high-speed interconnection demand, AI servers put forward higher requirements for multi-layer structure, high-speed signal integrity and low-loss materials. This brings clear growth space for advanced PCB technologies including HDI, SLP, mSAP and AnyLayer interconnection boards.

Although facing challenges in signal integrity and cost, the upgrading of high-speed interconnection and power technology continues to promote the development of AI server PCBs and accelerate the penetration of advanced products. In the future, the market space will be further expanded through the balanced optimization of performance and cost.

Maxipcb® Core Advantages & Service System

Name: AI Server PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing

Core Product: AnyLayer HDI PCB for Android Smartphones

Focusing on the miniaturization and high integration trend of mobile electronic products, Maxipcb® has developed AnyLayer HDI PCB for Android smartphone motherboards. Adopting advanced laser drilling, multilayer lamination and via filling electroplating technology, the product effectively improves circuit density and signal integrity, meeting the requirements of compact layout, stable high-speed transmission and low power consumption, and supporting the continuous upgrading of mobile smart devices.

Quality Policy

Centered on product quality and refined process control, Maxipcb® adheres to the principle of focusing on details, manufacturing high-standard products and providing customers with satisfactory products and services throughout R&D, production and service.

Quality Objectives

On-time delivery rate: 100%
Production first-pass yield: 98%
Finished product acceptance rate: 99%

Service Objectives

Customer satisfaction rate: 99.9%
Customer complaint rate / return rate: 0.5% / 0.5%
Complaint response within 1 hour, processing within 4 hours

Engineering Document Review

Maxipcb implements a strict engineering document review mechanism. Professional engineers conduct comprehensive verification of customer design documents and technical indicators, identify potential manufacturability risks in advance, and provide optimized suggestions to ensure smooth production.

Full-Process Quality Inspection

Incoming material inspection: qualified warehousing, unqualified return
Tooling & fixture verification: qualified for use, unqualified returned for maintenance
In-process inspection: products pass inspection before entering the next process, with patrol inspection to ensure stability

Product Acceptance Standards

IPC-A-600G (PCB Acceptance Quality Level, AQL)
IPC-6018A (High-Frequency PCB Standard)
GJB326A-96 (Military PCB Standard)

HDI PCB Core Advantages

Cost optimization: lower manufacturing cost than traditional lamination for boards above 8 layers
High integration: improved interconnection efficiency to meet miniaturization needs
Advanced process compatibility: supports stacked vias, laser direct drilling and other high-end processes
Excellent electrical performance: stable signal transmission in high-speed and high-frequency scenarios
High reliability: stable operation in high temperature, high humidity and strong interference environments
Optimized thermal performance: efficient heat dissipation to reduce overheating risk
Strong EMC performance: effective suppression of RFI, EMI and ESD

Cooperation & Design Guidelines

Customers are recommended to communicate with Maxipcb technical team before completing HDI stack-up and layout design to comply with DFM rules. With rich experience in high-precision HDI manufacturing, we support ultra-thin, high-density multilayer HDI production. Close technical communication helps reduce costs, avoid process risks and ensure quality and delivery.

About Maxipcb

Maxipcb is a professional high-precision PCB manufacturer focusing on R&D and production of high-end PCB products. With a complete product system, strict quality management system and professional technical team, we are committed to providing customers with high-quality, cost-effective PCB solutions and full-process technical support. For quotation and technical consultation, please contact us by email.

Model : AI Servers PCB

Layers : 8-20Layers

Finished Thickness：1.2mm

Copper Thickness : 0.5OZ

Color : Blue/White

Surface treatment: immersion gold

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network interface cards.

AI Server PCB

Description

Data Sheet