Name: 6layers 1+N+1 Mobile Phone PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

1. Overview of PCB (Printed Circuit Board)

A Printed Circuit Board (PCB) serves as the core carrier for electronic components, providing mechanical support and electrical interconnection for all components. It is named "Printed Circuit Board" due to its manufacturing process adopting electronic printing technology. PCB design is based on circuit schematics to realize the functional requirements defined by circuit designers, with layout design as the core link. The design process must comprehensively consider external connection layout, internal component placement, metal wire routing, via arrangement, electromagnetic compatibility (EMC) protection, thermal dissipation performance and other key factors.

An optimized layout design can effectively reduce production costs while ensuring excellent circuit performance and thermal management. Simple PCB layout can be completed manually, while complex high-density layouts (such as mobile phone PCBs) must rely on Computer-Aided Design (CAD) tools to ensure design accuracy and manufacturability.

2. Maxipcb Mobile Phone PCB Layout Requirements

2.1 Component Spacing Requirement

To ensure the SMT mass production feasibility of Maxipcb, the side-to-side spacing between adjacent components on the PCB shall be ≥ 6mil. This requirement is formulated to avoid component collision during mounting and ensure the stability of the SMT process.

2.2 Structural Design Requirement

Component layout must fully align with product structural design requirements. During PCB design, close communication with structural engineers is required. On the premise of ensuring electrical performance, components with different heights and sizes shall be placed in designated areas according to structural constraints, avoiding conflicts with the shell, connectors and other structural parts.

2.3 Electrical Performance Requirement

Component placement must comply with electrical characteristic requirements: RF components and baseband components shall be placed in separate areas, and mutual placement is prohibited. According to the circuit schematic, components with different electrical functions shall be partitioned and arranged; if crosstalk is likely to occur between different functional areas, shielding covers shall be used for isolation if necessary.

In addition, components with adjacent logical relationships in the schematic shall be placed closely (e.g., filter capacitors for I/O signal lines shall be placed near the pins of the I/O connector, otherwise the filtering effect cannot be achieved). The higher the signal frequency and the smaller the capacitor capacity, the stricter the requirement for adjacent placement.

3. Maxipcb® Mobile Phone PCB Silk Screen Design Specifications

3.1 Positioning Silk Screen for High-Precision Devices

For BGA packaged devices and other components that cannot be visually inspected after SMT mounting, positioning silk screens shall be added around the pads. This facilitates SMT workers to verify the mounting accuracy and avoid misalignment.

3.2 Special Silk Screen Design

Silk screens shall be added between pads prone to short circuits to prevent tin bridging during soldering;
If PCB wiring is likely to come into contact with metal shells, insulating silk screens shall be added to avoid short circuits;
Directional identification silk screens shall be designed for polar components to ensure correct mounting direction;
PCB file name, version number and design date shall be clearly marked on the board surface with silk screens for traceability.

3.3 Silk Screen Size Requirement

The width of silk screen lines shall be ≥ 7mil to ensure clear printing during Maxipcb's production process. Silk screens shall not cover component pads (PADs), as this will affect solder paste adhesion and tin loading effect.

4. Maxipcb Mobile Phone PCB Routing Requirements

4.1 Power Line Width & Spacing Requirements

For the Vbatt power line from the battery connector input terminal to the PA (RF Power Amplifier) power pin, the line width requirements are as follows:

When the routing length < 60mm (2362mil), the line width shall be ≥ 1.5mm (60mil);
When 60mm (2362mil) ≤ routing length < 90mm (3543mil), the line width shall be ≥ 2mm (90mil).

To ensure the stable operation of the PA, the total length of the power lead from the battery connector to the PA shall not exceed 90mm (3543mil). The line width design of other high-current leads shall follow the same standard as the Vbatt power line. For general power lines, the line width shall be designed as 0.2mm-0.4mm (8mil-16mil) according to the current load.

4.2 Crosstalk Control Requirements

To reduce crosstalk between signal lines, the spacing between two easily interfering lines shall be greater than twice the line width; direct overlap of upper and lower layer lines (without ground layer isolation) shall be strictly avoided.

4.3 High-Speed Signal Routing Requirements

To improve the high-frequency performance of high-speed signals, the routing shall adopt natural arc turning; if arc turning cannot be fully realized, 135° turning shall be used, and right-angle or acute-angle turning shall be prohibited. The grounding pins of components shall be directly connected to the ground layer; if necessary, nearby grounding shall be adopted, but the routing width shall be ≥ 0.5mm (20mil), and long-distance grounding routing shall be avoided.

4.4 Routing for Large-Size Devices

To enhance the anti-peeling performance of large-size devices (such as tantalum capacitors, battery connectors), teardrops or copper cladding can be added to the pad leads connected to these devices, and additional vias shall be added to connect with other layers to improve mechanical strength.

4.5 Routing to Board Edge Spacing

The spacing between routing lines and the PCB board edge shall be designed to be ≥ 0.4mm (16mil) to avoid edge damage affecting circuit performance during PCB forming.

5. HDI PCB Technical Standards for Mobile Phones

5.1 Key HDI Terminology Definition

Blind Hole: A via that connects the outer layer and inner layer without penetrating the entire board, with a diameter ranging from 0.05mm to 0.15mm. It is mainly formed by laser drilling, plasma etching or photo-induced drilling, among which laser drilling (CO₂ laser and YAG (UV) laser) is the most commonly used process.
Buried Hole: A via that realizes interconnection between inner layers (not connected to any outer layer), with a larger diameter than blind holes, and is also formed by precision drilling processes such as laser drilling.

5.2 HDI PCB Level Classification & 6-Layer HDI Technical Details

HDI PCB is classified by the number of laser drilling and lamination cycles. 6-layer HDI PCB, widely used in mobile phone motherboards, is mainly divided into first-order and second-order types.

5.2.1 6-Layer First-Order HDI PCB

The blind hole distribution is 1-2 layers, 2-5 layers, 5-6 layers. Among them, 1-2 layer and 5-6 layer vias are processed by laser drilling, while 2-5 layer vias are completed by conventional drilling. This type of HDI has simple production process, controllable parameters and low cost, which is suitable for entry-level mobile phones and other cost-sensitive products.

5.2.2 6-Layer Second-Order HDI PCB

The blind hole distribution covers 1-2 layers, 2-3 layers, 3-4 layers, 4-5 layers, 5-6 layers, requiring two laser drilling and two lamination processes. The specific process flow is as follows:

Drill 3-4 layer buried holes first;
Complete the first lamination to form the 2-5 layer core board;
Perform the first laser drilling to process 2-3 layer and 4-5 layer blind holes;
Complete the second lamination to form the 1-6 layer complete board;
Perform the second laser drilling to process 1-2 layer and 5-6 layer blind holes;
Drill through holes (if required) to complete the overall processing.

According to the blind hole distribution, 6-layer second-order HDI PCB is further divided into two categories:

Second-Order Staggered HDI PCB: Blind holes of adjacent layers (e.g., 1-2 layers and 2-3 layers) are arranged in a staggered manner without overlapping, with relatively simple process control.
Second-Order Stacked HDI PCB: Blind holes of adjacent layers (e.g., 1-2 layers and 2-3 layers) are stacked and overlapped (e.g., blind hole distribution of 1-3 layers, 3-4 layers, 4-6 layers), with higher density but higher process difficulty.

The classification logic of third-order, fourth-order and higher-order HDI PCB is consistent with the above, which is realized by increasing the number of laser drilling and lamination cycles, and is mainly used in ultra-high-density mobile phone motherboards.

6. Maxipcb® Core Product: AnyLayer HDI PCB for Android Mobile Phones

Focusing on the miniaturization and high integration trend of mobile electronic products, Maxipcb® has independently developed AnyLayer HDI PCB specially for Android mobile phone motherboards. Adopting advanced laser drilling, sequential lamination and via filling technologies, the product effectively improves circuit density and signal integrity, meets the high-performance requirements of mobile phone motherboards for compact layout, stable high-speed signal transmission and low power consumption, and provides reliable technical support for product performance upgrading.

7. Maxipcb® HDI PCB Core Advantages

Cost Optimization: For PCBs with more than 8 layers, HDI technology has lower manufacturing costs than traditional complex lamination processes, helping customers reduce overall procurement costs.
High Integration: Effectively improves interconnection efficiency, realizes higher component integration, and meets the miniaturization needs of mobile phones.
Advanced Process Compatibility: Compatible with stacked vias, laser direct drilling and other advanced processes, supporting high-end mobile phone PCB design.
Superior Electrical Performance: Excellent signal integrity ensures stable transmission of high-frequency and high-speed signals in mobile phone circuits.
High Reliability: Optimized structure and strict process control ensure stable operation under high temperature, high humidity and strong interference environments.
Enhanced Thermal Performance: Improved heat conduction efficiency reduces the overheating risk of high-power components (such as PA), extending the service life of mobile phones.
EMC Optimization: Strong resistance to RFI, EMI and ESD, meeting the electromagnetic compatibility requirements of high-end mobile electronic products.

8. Maxipcb® Quality Assurance System

8.1 Quality Policy

Maxipcb® takes product quality as the core, focuses on details, adheres to the policy of "taking quality as the core inspection point, starting from details, manufacturing high-quality products, and providing customers with satisfactory products and services", and implements it in all links of R&D, production and service.

8.2 Quality & Service Targets

Quality Targets: On-time delivery rate 100%, production qualification rate 98%, finished product inspection rate 99%.
Service Targets: Customer satisfaction rate 99.9%, customer complaint rate/return rate 0.5%/0.5%; complaint response within 1 hour, processing within 4 hours.

8.3 Document Review & Full-Process Inspection

Document Review: A strict engineering document review mechanism is implemented to conduct comprehensive verification of customer design files, identify manufacturability risks in advance, and provide optimization suggestions to avoid production problems.

Full-Process Inspection: Covering incoming material inspection (qualified warehousing, unqualified rejection), tooling fixture inspection (qualified for use, unqualified maintenance/replacement), and production process inspection (100% inspection before entering the next process, with patrol inspection to ensure stability).

8.4 Product Acceptance Standards

Strictly implement international and industry authoritative standards: IPC-A-600G (PCB Acceptance Quality Level, AQL), IPC-6018A (High-Frequency PCB Acceptance Standard), GJB326A-96 (Military-Grade PCB Standard).

9. Design & Cooperation Guidelines

Maxipcb recommends that customers consult our technical team before finalizing mobile phone PCB layout and HDI stack-up design to ensure compliance with DFM (Design for Manufacturability) guidelines. With rich experience in high-precision mobile phone PCB and HDI manufacturing, we can provide professional technical support, help reduce manufacturing costs, avoid process risks, and ensure product quality and delivery cycle.

10. About Maxipcb

Maxipcb is a professional high-precision PCB manufacturer focusing on the R&D and production of mobile phone PCBs, HDI PCBs and other high-end products. Equipped with a complete product system, strict quality control system and professional technical service team, we are committed to providing global customers with high-quality, cost-effective PCB solutions and intimate technical support. For product quotation or technical consultation, please feel free to send us an email, and our team will reply in a timely manner.

Model : 6layers 1+N+1 Mobile Phone PCB

Material : S1000-2

Layer ：6Layers 1+N+1

Color ：Green/White

Finished Thickness : 0.8mm

Copper Thickness : inner0.5OZ,outer1OZ

Surface Treatment ：Immersion Gold+OSP

Min Trace / Space ：3mil/3mil

Application ：mobile phone PCB

6layers 1+N+1 Mobile Phone PCB

Description

Data Sheet