Name: 6layer Resin Plug PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

6layer Resin Plug PCB

Product Model: Resin Plug PCB

PCB Layers: 6 Layers

Base Material: S1141

Finished Thickness: 1.2mm

Copper Thickness: 1OZ / 0.5OZ

Color Configuration: Green solder mask, white silkscreen

Surface Treatment: Immersion Gold

Special Process: Resin plug technology

Min Trace / Space: 3mil / 3mil (BGA)

Application: Digital products

Description
Data Sheet

In recent years, ultra-thin resin layers have become a mainstream trend in the PCB industry. With increasingly dense hole design, resin plug hole technology has been widely adopted to solve a series of defects that cannot be addressed by traditional green oil plug holes or lamination resin filling. However, restricted by the inherent material characteristics of plugging resin, multiple technical difficulties must be overcome to achieve high-quality resin plug hole production.

Many mature processes in the PCB industry have been used for decades, while their origins are often overlooked. As early as the initial launch of BGA (Ball Grid Array) chips, the industry began optimizing structural designs for miniaturized SMD components to reduce the overall size of end products.

In the 1990s, a Japanese company developed a direct resin plugging process followed by surface copper plating, mainly to eliminate air bubble defects commonly found in green oil plug holes. Intel first applied this technology to mass-produced electronic devices, which marked the official birth of the POFV (Via On Pad) process.

Three Core Application Scenarios of Resin Plug Hole

3.1 POFV Resin Plug Hole

3.1.1 Technical Principle

Fill through holes with insulating resin, then plate a complete copper layer over the hole surface.

3.1.2 Advantages of POFV Technology

Reduce hole pitch limitations and effectively shrink PCB footprint;
Optimize routing space, break wiring barriers, and greatly improve circuit density.

3.2 Inner Layer HDI Resin Plug Hole

3.2.1 Technical Principle

Fill inner HDI buried holes with resin before multi-layer lamination. This process resolves the conflict between thin dielectric layer thickness control and inner buried hole glue-filling requirements.

Key Functions

Unfilled inner HDI buried holes will cause board cracking and scrappage under high-temperature thermal shock;
Without resin plugging, multiple PP prepregs are required for lamination filling, resulting in excessively thick interlayer dielectric layers and failing thin-board design demands.

3.2.3 Industry Applications

Widely used in high-end HDI boards to meet ultra-thin dielectric layer design specifications;
Mandatory for blind & buried hole PCBs with ultra-thin intermediate dielectric layers and inner buried hole structures;
For blind holes with a layer thickness over 0.5mm, conventional lamination filling cannot fully fill the holes. Resin plugging avoids copper missing and open-circuit risks in subsequent production processes.

3.3 Through-Hole Resin Plug Hole

For 3G communication and industrial products with a board thickness above 3.2mm, manufacturers adopt full through-hole resin plugging within acceptable cost budgets. This solution greatly improves long-term product reliability and eliminates hidden risks caused by traditional green oil plug holes. It has become a popular and mass-produced process in recent years.

Model :Resin Plug PCB

Layers : 6Layers

Material : S1141

Finished Thickness：1.2mm

Copper Thickness : 1/0.5OZ

Color : Green/White

Surface treatment: immersion gold

Special technology: resin plug

Min Trace / Space：BGA 3mil/3mil

Application : Digital products