Name: 6L Rigid-Flex PCB(R-FPCB)
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Description
Data Sheet

Characteristics & Limitations of Rigid-Flex PCB

Rigid-Flex PCB integrates the dual performance attributes of rigid circuit boards and flexible FPC. With integrated rigid support zones and bendable flexible zones, it perfectly meets the composite structural design demands of high-end electronic equipment. This composite layout effectively optimizes internal space utilization, reduces finished product overall dimensions, and comprehensively upgrades electrical performance and structural compatibility for compact precision devices.

In terms of manufacturing limitations, rigid-flex boards feature complex hybrid processes and high production technical barriers. Diversified material matching and multi-step composite working procedures lead to relatively low production yield. Higher consumption of raw materials and labor resources results in higher product cost, together with longer production lead time compared with standard rigid PCBs.

Rigid-Flex PCB Structure

Material & Auxiliary Material Configuration

Maxipcb adopts high-grade industrial raw materials and globally renowned auxiliary materials to guarantee product stability:

Base materials：SY, KB, EMC, polyimide, aluminum-based, Hitachi and other mainstream high-performance substrates
Chemical materials：Rohm & Haas (USA), Atotech (Germany), Umicore (Germany)
PCB solder mask ink：Taiyo (Japan)
Dry film：Asahi (Japan), DuPont (USA)

Technical Requirements & Process Design for Camera Module R-FPCB

Rigid-flex boards customized for mobile camera modules must satisfy ultra-thin structure and high flatness specifications, while retaining the inherent comprehensive performance of rigid-flex products. Strict flatness consistency is required after SMT component and chip mounting, to secure imaging accuracy and long-term stable operation of camera modules.

In mass production design, laser cutting alignment calibration pads are etched on base materials, with copper-free layout arranged on inner and outer layers along laser routing paths to eliminate cutting interference. Adjacent camera module rigid-flex boards share extended laser cutting lines to elevate processing efficiency. Though the optimized layout solves ultra-thin structural demands, systematic solutions for structural strength and heat dissipation still need further iteration.

Maxipcb Precision Process Control

For camera module dedicated rigid-flex boards, Maxipcb adopts asymmetric upper and lower stacking structure, with board warpage strictly controlled within 0.75%. Mechanical blind routing is applied for window opening on rigid sections, preventing damage to flexible layers during cover film stripping. Flexible zones are processed by high-precision laser forming, with outline tolerance stably controlled at ±0.05mm, ensuring high-precision assembly matching.

Product Application & Global Layout

Maxipcb rigid-flex products are widely applied in mobile camera modules, industrial automation, medical devices, automotive electronics, communication equipment, digital terminals and aerospace industries. Products are exported to Germany, France, the United States, Australia, Sweden and other international markets, providing global customers with integrated, efficient one-stop customized services covering R&D, manufacturing and after-sales support.

Quality Certification & System Guarantee

The company has obtained UL certification for special substrates, thick PI and thick copper materials, and passed ISO9001 quality management system and SGS RoHS compliance certification. With standardized full-link quality management, Maxipcb delivers stable and compliant high-reliability rigid-flex solutions, and has long focused on the R&D and mass production of R-FPCB to become a reliable long-term partner in the industry.

Structural & Manufacturing Features of R-FPCB

Rigid-Flex PCB is a composite high-density circuit formed by laminating flexible FPC and rigid PCB substrates. It supports 3D spatial wiring design and replaces multi-board combined connection structures with a single integrated board, improving structural stability and signal integrity while maximizing limited internal space. The classic 4-layer rigid-flex structure adopts PI flexible core material with double-sided copper foil, combined with FR4 rigid layers through professional lamination to form high-reliability composite stacking.

Restricted by mixed material characteristics and multi-layer composite processes, the manufacturing flow of R-FPCB is far more complicated than conventional rigid boards. The production cycle of standard 4-layer rigid-flex boards is 5–7 times that of ordinary rigid PCB. Relying on mature process iteration and high-precision automated equipment, Maxipcb balances mass production efficiency and dimensional precision to meet prototype verification and batch delivery demands for camera modules.

Core Application Advantages for Camera Modules

Ultra-thin & High-flatness Performance
Integrated composite stacking realizes ultra-thin structural design, with excellent overall flatness after component mounting, fully adapting to high-precision imaging assembly requirements.
Space & Cost Optimization
Integrated rigid-flex structure eliminates external connectors and HotBar processes, simplifies internal structural layout, reduces overall product size and effectively controls accessory and processing comprehensive costs.
Stable Signal Transmission
Simplified cross-board interconnection paths reduce multi-medium signal attenuation, ensuring high stability of high-frequency and high-precision signal transmission for camera chips.
Strong Environmental Adaptability
It features 3D flexible wiring, excellent temperature resistance and anti-static performance, adapting to complex operating environments of consumer electronic products.
Simplified Assembly Flow
Reduced connector usage lowers SMT workload and final assembly procedures, optimizes BOM configuration and cuts inventory and management costs.

Industry Prospect & Cost Trend

Beyond camera modules, rigid-flex boards are widely used in medical equipment, aerospace and high-end consumer electronics, being the core interconnection carrier for miniaturized and high-reliability equipment. Despite higher initial manufacturing cost, R-FPCB provides irreplaceable optimized solutions for thin-type and high-density electronic products. With the continuous maturity of composite material technology and large-scale production, its comprehensive cost will gradually decline, bringing broader market competitiveness.

Maxipcb Customized R-FPCB Core Strength

High-standard Material Selection

Flexible substrate：Adopts DuPont adhesive-free PI series, with outstanding flexibility, dielectric property and thermal stability
Rigid substrate：Matches PI resin system and P95 prepreg lamination to avoid thermal shock warpage caused by material CTE mismatch
Bonding material：Low-flow non-flow prepreg is adopted for rigid-flex transition zones to prevent glue overflow and ensure thin-type structural integrity

Whole-process Precision Control

Inner layer treatment：Electrolytic cleaning technology is adopted to maintain copper surface roughness and cleanliness, supporting 0.1mm~0.15mm fine line production
Multi-layer alignment：OPE positioning holes and X-ray drilling calibration effectively control layer-to-layer alignment accuracy
Lamination & drilling：Optimized lamination parameter matching and high-speed drilling equipment ensure board flatness and hole wall quality

Model : 6L Rigid-Flex PCB Communication Product

Material : FR4 + PI

Construction : FR4 4L +FLEX 2L

Finished Thickness : 0.15mm

Copper Thickness : 1OZ

Color : Green /White

Surface Treatment : Immersion Gold

Min Trace / Space : 5mil/5mil

Min Hole : Mechanical Hole0.2mm，Laser Hole0.1mm

Application : Communication Product pcb

6L Rigid-Flex PCB(R-FPCB)

Description

Data Sheet