Product Model:2+N+2 structural high-density interconnect board for wireless WiFi modules Layer Configuration:6-layer multilayer HDI design Base Substrate:Industrial grade FR-4 dielectric laminate Stackup Structure:2+2+2 balanced HDI lamination layout Finished Board Dimension:0.8mm overall thickness Copper Foil Spec:1oz uniform conductor copper weight Solder Resist Color:Black and white ink optional Surface Finishing:Combined ENIG and OSP hybrid surface treatment Fine Line Capability:Minimum trace and spacing at 3mil/3mil Microvia Parameter:0.1mm ultra-fine laser blind hole Application:Customized circuit substrate for wireless communication WiFi modules