• 6L 2+N+2 HDI WiFi Module PCB
  • 6L 2+N+2 HDI WiFi Module PCB
  • 6L 2+N+2 HDI WiFi Module PCB
  • 6L 2+N+2 HDI WiFi Module PCB

6L 2+N+2 HDI WiFi Module PCB

Product Model:2+N+2 structural high-density interconnect board for wireless WiFi modules
Layer Configuration:6-layer multilayer HDI design
Base Substrate:Industrial grade FR-4 dielectric laminate
Stackup Structure:2+2+2 balanced HDI lamination layout
Finished Board Dimension:0.8mm overall thickness
Copper Foil Spec:1oz uniform conductor copper weight
Solder Resist Color:Black and white ink optional
Surface Finishing:Combined ENIG and OSP hybrid surface treatment
Fine Line Capability:Minimum trace and spacing at 3mil/3mil
Microvia Parameter:0.1mm ultra-fine laser blind hole
Application:Customized circuit substrate for wireless communication WiFi modules

  • 6L 2+N+2 HDI WiFi Module PCB
  • 6L 2+N+2 HDI WiFi Module PCB
  • Description

  • Data Sheet

PCB Base Material Overview

FR-4 is the most widely used base material in conventional PCB manufacturing, composed of epoxy resin and electronic-grade glass cloth. This material offers excellent mechanical strength, electrical insulation, and cost-effectiveness, making it the preferred choice for most standard circuit board applications.
In traditional HDI PCB manufacturing, backed copper foil was commonly adopted due to technical limitations. The glass fiber component in standard FR-4 glass cloth posed challenges for laser drilling—conventional laser equipment lacked sufficient energy to penetrate the glass cloth layer, requiring the use of glass fiber-free backed copper foil to ensure drilling accuracy and via quality.
With the advancement of laser drilling technology, Maxipcb has adopted high-energy laser drilling equipment capable of directly penetrating 1180-type glass cloth. This technological breakthrough eliminates the need for special glass fiber-free materials, enabling the direct use of standard FR-4 substrates for HDI manufacturing. As a result, the material selection for HDI PCBs is now consistent with that of conventional PCBs, simplifying the supply chain and reducing production costs while maintaining product reliability.

Maxipcb Enterprise Introduction

Maxipcb Circuits Limited (Maxipcb®) is a professional high-tech enterprise dedicated to providing high-precision PCB products and one-stop EMS solutions for the global electronics industry. With over a decade of profound industry experience, we focus on the R&D, production, and global supply of high-end PCB products, covering a full range of product categories to meet diverse customer demands.
Our core product portfolio includes multi-layer PCB (up to 40+ layers), HDI high-density interconnection boards, rigid-flex PCBs, high-frequency/high-speed PCBs, golden finger PCBs, gold-plated PCBs, ceramic substrate PCBs, and ceramic circuit boards. We also offer comprehensive PCB-related services such as PCB prototyping, multi-layer PCB manufacturing, PCB paneling, and customized circuit board development.
Maxipcb has established a complete industrial chain covering raw material procurement, circuit design, precision manufacturing, quality inspection, and after-sales service. We hold international certifications including ROHS, UL, ISO 9001, and SGS, and strictly comply with IPC-A-600G, IPC-6018A, and military-grade quality standards to ensure product consistency and reliability.

Maxipcb Production Capacity & Equipment Advantages

Boasting a monthly production capacity of 30,000 ㎡, Maxipcb has invested heavily in advanced production and inspection equipment, including Mitsubishi laser drilling machines, Hitachi mechanical drilling machines, LDI (Laser Direct Imaging) equipment, automatic exposure machines, and AOI (Automatic Optical Inspection) systems. This full set of automated equipment realizes full-process intelligent production, from circuit design verification to finished product inspection.
Our professional technical team, with 3-12 years of industry experience per member, is proficient in core processes such as microvia processing, via-in-pad, blind/buried via manufacturing, and fine line processing (minimum line width 20 µm). We also have independent surface treatment production lines, covering immersion gold, OSP, spray tin, thick gold plating, and other processes, eliminating quality risks caused by outsourcing.

Maxipcb Core Competitive Advantages

  • Precision Manufacturing Capability: Stable production of HDI PCBs with 50 µm laser vias, 20 µm circuit geometries, and up to 5 layers of microvias, meeting the high-density requirements of high-end electronic products.
  • Cost Optimization: For 8-layer+ multi-layer PCBs, our optimized lamination process reduces manufacturing costs by 15%-20% compared to traditional processes, helping global customers control procurement budgets effectively.
  • Global Service Support: We provide one-stop customized services including DFM (Design for Manufacturability) review, prototype trial production, mass production, and global logistics distribution. Our 24/7 technical support team ensures fast response (within 1 hour for inquiries, within 4 hours for complaint resolution), serving customers across Europe, North America, Asia, and other regions.
  • Quality Assurance System: Implementing full-process quality control from raw material incoming inspection to finished product shipment, with 100% AOI inspection and temperature cycle testing, ensuring product qualification rate reaches 99.8%.

Contact & Cooperation

Maxipcb is committed to becoming a trusted global partner for high-precision PCB solutions. We provide flexible cooperation models to meet the customized needs of different industries, including semiconductor test equipment, medical devices, aerospace, automotive electronics, and consumer electronics. For inquiries or cooperation, please contact our global sales team for professional technical consultation and quotation support.

Model :2+N+2 HDI WiFi Module PCB

Layers : 6Layers 

Material : FR4

Construction : 2+2+2 HDI PCB

Finished Thickness:0.8mm

Copper Thickness : 1OZ

Color : Black/White

Surface Treatment:Immersion Gold+OSP

Min Trace / Space:3mil/3mil

Min Hole:Laser Hole 0.1mm

Application : WiFi module PCB