Name: 6L 2+N+2 HDI Communication PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

1. Professional Technical Team & Core HDI Technology

Maxipcb has a professional technical team with 3–12 years of PCB industry experience. Its profound accumulation in communication PCB ensures high stability and reliability of HDI communication PCBs, supporting high-frequency and high-speed communication needs.

Maxipcb masters advanced high-precision back-drilling technology, which reduces via equivalent series inductance (ESL), eliminates signal reflection and attenuation, and meets high signal integrity requirements of high-frequency communication products.

2. Advanced Process Capability

Maxipcb has mature process capabilities to meet high-precision HDI communication PCB manufacturing needs. Key parameters are as follows:

Maximum aspect ratio: 10:1
Maximum copper thickness: 6oz
Maximum working panel size: 2000mm × 610mm
Thinnest 4-layer HDI board: 0.33mm
Minimum mechanical hole/pad size: 0.2mm / 0.40mm
Drilling accuracy: ±0.05mm; PTH hole diameter tolerance: ±0.05mm
Minimum line width/line spacing: 0.075mm / 0.075mm

These process indicators meet the manufacturing requirements of high-density, miniaturized HDI communication PCBs, adapting to 5G base stations, communication terminals and transmission equipment.

3. Advanced Production & Inspection Equipment

Maxipcb has built a complete set of intelligent production and precision inspection equipment, laying a solid foundation for HDI communication PCB quality and efficiency:

Core production equipment: Automatic V-CUT machine, German precision press, Mitsubishi laser drilling machine, Hitachi mechanical drilling machine, automatic exposure machine, LDI equipment, etc., realizing automatic and high-precision processing to ensure high-frequency signal stability.
Surface treatment system: Equipped with a complete set of HDI-specific surface treatment lines, covering immersion gold, immersion silver, immersion tin, OSP, spray tin, gold plating, thick gold plating, electroplated silver and electroplated tin. As one of the few enterprises with independent surface treatment systems, it reduces outsourcing risks and ensures surface conductivity reliability.
Precision inspection equipment: Equipped with AOI and advanced temperature cycle testing equipment, realizing full-process quality monitoring and reliability verification for complex communication working environments.

4. Strict Quality Control & Reliability Guarantee

Maxipcb adheres to quality-oriented principles, implements full-process quality control, and follows IPC international standards for HDI communication PCB design, production and inspection, ensuring 100% shipment qualification rate. Advanced temperature cycle testing simulates extreme communication environments to verify product reliability; the PDCA quality management cycle continuously optimizes process parameters to meet high-end 5G communication requirements.

5. Green Environmental Protection & Industry Recognition

Maxipcb is a clean production certified enterprise and won the title of "Green Advanced Enterprise in the PCB Industry". It adheres to environmental protection standards and is a trusted partner of well-known communication enterprises.

6. HDI PCB Technical Standards & Core Products

6.1 Key HDI Terminology Definition

Blind Via: A via connecting outer and inner layers without penetrating the whole board (diameter 0.05mm–0.15mm), the core interconnection structure to improve signal line density.
Buried Via: An inner-layer interconnection via (not connected to outer layers) with larger diameter than blind vias, ensuring stable high-frequency signal transmission.

6.2 HDI Level Classification & Process Details

HDI PCBs are classified by laser drilling and lamination cycles. Those used in communication equipment are mainly first-order and second-order, matching different product performance needs.

6.2.1 First-Order HDI

Blind hole distribution: 1-2/2-5/5-6 layers (laser drilling for outer layers, mechanical drilling for middle layers). It has mature processes, controllable parameters and low cost, suitable for mid-range communication terminals and auxiliary equipment.

6.2.2 Second-Order HDI

Blind hole distribution covers 1-2/2-3/3-4/4-5/5-6 layers, requiring two laser drilling and lamination processes. Process flow: 1. Drill 3-4 layer buried holes for inner interconnection; 2. First lamination to form 2-5 layer core board; 3. First laser drilling for 2-3/4-5 layer blind holes; 4. Second lamination to form 1-6 layer board; 5. Second laser drilling for 1-2/5-6 layer blind holes; 6. Drill through holes (if required) to complete processing.

Second-order HDI is divided into two types: Staggered HDI (blind holes arranged staggeredly, simple process, stable yield, suitable for 5G auxiliary equipment); Stacked HDI (blind holes stacked, high wiring density, suitable for high-end 5G base stations and core equipment).

Third-order and higher-order HDI PCBs adopt the same logic, realized by increasing laser drilling and lamination cycles, mainly used in ultra-high-density core communication equipment.

6.3 Core Product

Focusing on the high-frequency, high-speed and miniaturization trend of communication products, Maxipcb® has developed HDI PCBs for communication equipment (5G base stations, terminals, transmission equipment). Adopting advanced laser drilling, sequential lamination and via filling technologies, it improves circuit density and signal integrity, meeting the requirements of compact layout, stable signal transmission and anti-interference.

7. Core Advantages

Cost Optimization: Lower manufacturing costs than traditional lamination for 8+ layer communication PCBs, reducing customer procurement costs.
High Integration: Micro blind hole design improves interconnection efficiency, meeting miniaturization needs of communication terminals.
Advanced Process Compatibility: Compatible with stacked vias and laser direct drilling, supporting high-end 5G communication PCBs.
Superior Electrical Performance: Excellent signal integrity ensures stable high-frequency signal transmission, reducing loss and interference.
High Reliability: Stable operation under high temperature, high humidity and strong electromagnetic interference.
Enhanced Thermal Performance: Reasonable copper laying and via distribution reduce overheating risk of high-power components.
EMC Optimization: Strong resistance to RFI, EMI and ESD interference, meeting high-end communication EMC requirements.

8. Quality Assurance & Service Standards

Maxipcb® takes quality as the core, adhering to the policy of "quality-oriented, meticulous manufacturing, customer satisfaction", implemented in all links. Quality targets: On-time delivery rate 100%, production qualification rate 98%, finished product inspection rate 99%. Service targets: Customer satisfaction rate 99.9%, complaint/return rate 0.5%/0.5%; complaint response within 1 hour, processing within 4 hours. Strict document review identifies manufacturability risks in advance; full-process inspection forms a closed-loop quality control. All products comply with IPC-A-600G, IPC-6018A and GJB326A-96 standards, meeting global customer requirements.

9. Design & Cooperation Guidelines

Maxipcb® recommends customers consult our technical team before finalizing HDI stack-up and high-frequency signal routing to comply with DFM guidelines, reducing costs and process risks.

10. About Maxipcb

Maxipcb is a professional high-precision PCB manufacturer focusing on HDI communication PCB R&D and production. With complete product systems, strict quality control and professional technical services, it provides high-quality, cost-effective solutions for global communication customers. For quotation or consultation, please send an email for timely reply.

Model : 2+N+2 HDI Communication PCB

Layers : 6Layers

Material : IT150

Construction : 2+2+2 HDI PCB

Finished Thickness：0.8mm

Copper Thickness : 0.5OZ

Color : Green/White

Surface Treatment：Immersion Gold+OSP

Min Trace / Space：3mil/3mil

Min Hole：Laser Hole 0.1mm

Application : Communication HDI PCB

6L 2+N+2 HDI Communication PCB

Description

Data Sheet