6L 1+N+1 HDI PCB Prototype for Portable Electronic Product

With over 17 years of focused manufacturing expertise in high-frequency and RF circuit boards, Maxipcb has long been rooted in the domestic high-end microwave PCB production sector.

High-frequency substrate selection is the core determinant of RF board electrical performance. In high-speed microwave circuit development, critical indicators including operating frequency band, microwave power density, ambient temperature tolerance, and rated electrical load must be fully evaluated during material specification confirmation. Our technical team maintains in-depth research and long-term application accumulation on various high-frequency dielectric materials, with mainstream high-frequency laminates and special substrates kept in sufficient inventory to support short-cycle prototype orders and mass production delivery.

Relying on a seasoned engineering R&D team and standardized production management system, we implement full-process quality linkage with the quality assurance department. Strict process control and multi-point testing are carried out throughout manufacturing to stabilize product consistency and long-term operational reliability. Rather than superficial market praise, stable repeat cooperation from global clients serves as the most intuitive recognition of our comprehensive strength. Adhering to quality-oriented operation philosophy, we fully recognize that stable quality is the foundation of long-term strategic cooperation. Over the past 17 years, we have continued to upgrade manufacturing equipment, optimize process flows, and expand technical boundaries alongside global partners.

We supply and process a full range of mainstream high-performance dielectric substrates, covering international renowned brands: Rogers series: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870 Supplemental high-frequency materials: Arlon, Isola, Taconic, PTFE F4BM and Teflon-based high-low loss laminates

For cost-effective high-frequency hybrid design demands, we provide composite laminated circuit boards combining high-frequency materials and conventional FR-4 substrates: RO4350B + FR4, RO4350B + IT180 high-Tg material, RO4003C + FR4, RO3010 + FR4, RO3003 + FR4 and other customized mixed stacking structures

High-frequency microwave PCBs are widely adopted in multiple high-precision and high-reliability industries, including consumer electronic devices, aerospace & defense, high-power energy equipment, medical instrumentation, new energy vehicles, and industrial automation systems.

Multiple surface treatment processes are available to match different welding, conduction and environmental resistance requirements: OSP, electroless nickel immersion gold, lead-free hot air leveling, hard gold plating, soft flash gold, immersion tin, immersion silver and electrolytic hard gold

We support customized high-difficulty special processes to meet diverse high-end design specifications: Golden finger bevel processing, heavy copper circuit, blind & buried via fabrication, precise impedance control, resin-filled vias, carbon ink printing, backdrill technology, countersink hole, depth-controlled drilling, half-plated holes, press-fit holes, peelable blue solder mask and special thick copper, super-large format board customization

Flexible layer configuration supports multi-layer high-frequency board customization: 2–30 layers optional stacking design

Covers multiple classic dielectric constant specifications to meet different high-frequency signal loss design needs: DK 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2

Our high-frequency RF boards are widely applied in antenna communication systems, power amplifier modules, radar detection equipment, vehicle-mounted intelligent networking, in-vehicle infotainment, WiFi wireless transmission, portable communication terminals, cloud computing hardware and core high-frequency units in various industrial high-precision equipment.