Name: 6L 1+N+1 HDI PCB for Digital Product
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

Description
Data Sheet

1. HDI PCB Technical Definition & Structural Features

HDI (High Density Interconnect) PCB is a high-precision circuit board featuring ultra-fine line density, which achieves high-density interconnection through micro blind and buried via technology. Structurally composed of inner and outer circuit layers, it realizes conductive connection between layers via precision drilling and hole metallization processes. This design effectively reduces board size while ensuring stable signal transmission, perfectly catering to the miniaturization and high-integration trends of global electronic products.

2. HDI PCB Manufacturing Process & Technical Classification

HDI PCBs are primarily manufactured using sequential lamination technology, where the number of lamination cycles directly determines the product’s technical grade. Standard HDI products adopt a single-stage buildup structure, widely applied in general electronic devices. High-order HDI products require two or more lamination processes, combined with advanced PCB manufacturing technologies such as stacked vias, electroplated hole filling, and Laser Direct Imaging (LDI), to meet the high-density and high-speed requirements of high-end electronic products.

For multi-layer PCB designs with 8 layers or more, HDI manufacturing offers significant cost advantages compared to traditional complex lamination processes. Additionally, due to its optimized structural design, HDI PCBs outperform traditional PCBs in electrical performance and signal transmission accuracy. They also provide excellent optimization in Radio Frequency Interference (RFI) resistance, Electromagnetic Interference (EMI) shielding, Electrostatic Discharge (ESD) protection, and thermal conductivity, ensuring stable operation of electronic equipment in harsh working environments.

3. HDI PCB Application Scenarios & Global Industry Trends

As electronic products worldwide continue to develop towards high density, high precision, and miniaturization, HDI high-density interconnection technology has become the core enabler for product upgrading. The "high" in high-end electronic products refers not only to improved machine performance but also to reduced overall volume. HDI technology enables the miniaturization of terminal products while meeting higher standards for electronic performance and operational efficiency.

Currently, HDI PCBs are widely used in mainstream electronic products such as smartphones, digital cameras, notebook computers, and automotive electronics. Driven by continuous product upgrades and growing global market demand, the HDI PCB industry will maintain rapid growth. Meanwhile, requirements for product precision, reliability, and cost control are constantly rising, placing higher demands on PCB manufacturers' technical strength and production capacity.

4. Maxipcb Enterprise Introduction

Maxipcb Circuits Limited (Maxipcb®) is a professional high-tech enterprise specializing in the R&D, production, and sales of high-precision HDI PCBs. With over a decade of industry experience, we have built a complete industrial chain covering raw material procurement, circuit design, production manufacturing, quality inspection, and after-sales service. We hold international certifications including ROHS, UL, ISO 9001, and SGS, and strictly comply with IPC-A-610 Class 2 quality standards.

Boasting a monthly production capacity of 30,000 ㎡, Maxipcb provides one-stop EMS (Electronics Manufacturing Services) including PCB fabrication, component sourcing, PCBA assembly, conformal coating, box build, and functional testing. We have established a mature global service system to meet the customized needs of customers in Europe, North America, Asia, and other regions. Our independently developed industry-leading PCB Automatic Quotation System (PAQS) realizes seamless data connection between engineering, production, and factory terminals, shortening the product development-to-mass-production cycle and helping customers launch products faster.

Relying on advanced production equipment, a professional technical team, and a strict quality control system, Maxipcb has become a trusted partner of many well-known global electronic enterprises, with products widely applied in communications, consumer electronics, automotive electronics, and other fields.

5. Maxipcb HDI PCB Core Advantages

5.1 Leading Technical Strength

Maxipcb’s professional technical team has 3-12 years of experience in the PCB industry, focusing on HDI technology R&D and innovation. We have mastered core technologies such as precision laser drilling, sequential lamination, and electroplated hole filling, enabling stable production of HDI PCBs with micro blind vias (0.05mm-0.15mm in diameter), fine lines (minimum line width/line spacing 0.075mm/0.075mm), and high layer counts (up to 40+ layers for complex HDI boards). We also have extensive experience in high-frequency PCB manufacturing, providing professional technical support for RF circuit and high-speed signal transmission optimization.

5.2 Advanced Production & Inspection Capabilities

Maxipcb has invested heavily in advanced production and inspection equipment, including Mitsubishi laser drilling machines, Hitachi mechanical drilling machines, LDI (Laser Direct Imaging) equipment, automatic exposure machines, and AOI (Automatic Optical Inspection) equipment, realizing full-process automated production and precision monitoring of HDI PCBs. We are equipped with a complete set of surface treatment production lines, covering immersion gold, immersion silver, OSP, spray tin, and thick gold plating processes. As one of the few enterprises with independent surface treatment capabilities, we effectively reduce quality and delivery risks caused by outsourcing, ensuring reliable surface conductivity of products. All products undergo 100% AOI testing before shipment, and advanced temperature cycle testing equipment is used to simulate extreme working environments, verifying long-term product reliability.

5.3 Cost & Efficiency Advantages

For 8-layer and above multi-layer HDI PCBs, Maxipcb optimizes lamination processes and production scheduling, resulting in lower manufacturing costs compared to traditional complex lamination processes, helping global customers reduce overall procurement costs. Our self-developed PAQS automatic quotation system and advanced ERP tracking management system enable efficient connection of all production links, with an on-time delivery rate of over 95% for HDI PCBs, effectively shortening customers’ product launch cycles.

5.4 Strict Quality Control System

Maxipcb adheres to a quality-oriented philosophy, implementing strict full-process quality control and strictly complying with international IPC standards (IPC-A-600G, IPC-6018A) and military-grade standards for product design, production, and inspection. We strictly implement the PDCA quality management cycle to continuously optimize process parameters and can provide IPC Class III standard products according to customer requirements, ensuring product quality stability and consistency. We also have a complete material selection system, cooperating with world-renowned material suppliers such as Isola, Panasonic, Rogers, and Arlon, and stocking a variety of high-quality substrates to ensure product performance stability from the source.

5.5 Comprehensive Global Service Support

Maxipcb provides one-stop customized services for HDI PCBs, including pre-production technical consultation, DFM (Design for Manufacturability) review, process optimization, prototype trial production, and mass production delivery. Our professional engineering team can intervene in the early stage of customer design, providing SI/PI simulation support and process optimization suggestions to help customers avoid design and process risks and shorten R&D cycles. We have a fast-response global service system, with customer complaint response within 1 hour and resolution within 4 hours, adhering to a win-win cooperation philosophy to provide high-quality services for customers of all sizes worldwide.

6. Summary

As the core carrier of high-end electronic products, HDI PCBs have broad global market prospects driven by the upgrading of the electronic industry. Maxipcb, relying on leading technical strength, advanced production equipment, strict quality control, and comprehensive global service support, has become a trusted professional HDI PCB manufacturer in the industry. We are committed to providing high-quality, cost-effective HDI PCB solutions for global customers, helping them achieve product upgrading and enhance market competitiveness, and growing together with the global HDI industry.

Model : 1+N+1 HDI PCB for Digital Product

Layers : 6Layers

Material : SY S1000-2 FR4

Construction : 1+4+1 HDI PCB

Finished Thickness：1.2mm

Copper Thickness : 0.5OZ

Color : Green/White

Surface Treatment：Immersion Gold

Min Trace / Space：4mil/4mil

Min Hole：Laser Hole 0.1mm

Application : Digital Product PCB

6L 1+N+1 HDI PCB for Digital Product

Description

Data Sheet