Product Model: 6L 1+N+1 HDI Mobile Mainboard PCB
Material: FR-4 Laminate
Layers: 6L, 1+N+1 HDI Stackup
Solder Mask: Green/White
Finished Thickness: 1.0mm
Copper Weight: Inner 1oz, Outer 0.5oz
Surface Finish: ENIG (Immersion Gold)
Min. Trace/Space: 3mil/3mil
Min. Aperture: 0.2mm Mechanical Hole, 0.1mm Laser Microvia
Application: Mobile Mainboard