• 6L 1+N+1 HDI for Mobile Phone Main board PCB
  • 6L 1+N+1 HDI for Mobile Phone Main board PCB

6L 1+N+1 HDI for Mobile Phone Main board PCB

Product Model: 6L 1+N+1 HDI Mobile Mainboard PCB

Material: FR-4 Laminate
Layers: 6L, 1+N+1 HDI Stackup
Solder Mask: Green/White
Finished Thickness: 1.0mm
Copper Weight: Inner 1oz, Outer 0.5oz
Surface Finish: ENIG (Immersion Gold)
Min. Trace/Space: 3mil/3mil
Min. Aperture: 0.2mm Mechanical Hole, 0.1mm Laser Microvia
Application: Mobile Mainboard

  • 6L 1+N+1 HDI for Mobile Phone Main board PCB
  • Description

  • Data Sheet

Maxipcb  is a high-tech enterprise dedicated to the R&D, design, manufacturing and technical services of high-end printed circuit boards (PCBs). Backed by a professional R&D team of senior engineers with over 15 years of industry experience and a standardized intelligent production base, we focus on delivering high-reliability, high-precision PCB solutions for high-end electronic application fields.

As an innovator in the PCB manufacturing industry, we pioneered the independent development of an automatic PCB quotation and order management system—an industry-first solution integrating intelligent quotation, real-time order tracking and intelligent production scheduling. This system streamlines the procurement process, shortens the quotation response time to within 15 minutes, and enables transparent order status inquiry, providing efficient and reliable services for global customers. Guided by the "Internet + Manufacturing" concept, our long-term strategic goal is to construct an Industry 4.0 smart PCB factory, realizing full-process digitalization and intelligence through the integration of advanced digital management, intelligent production equipment and lean manufacturing processes.

Core Product Portfolio

Maxipcb® offers a comprehensive range of high-end PCB products to meet diverse application demands, covering: Radio Frequency (RF) PCBs, Microwave PCBs, Hybrid High-Frequency PCBs, FR4 Double-Sided/Multi-Layer PCBs, 1~3+N+3 Staged HDI Boards, Anylayer HDI Boards, Rigid-Flex PCBs, Blind & Buried Hole PCBs, Blind Slot PCBs, Backdrilled PCBs, IC-Specific Substrates and Heavy Copper PCBs.
Our products are widely applied in high-tech and high-reliability fields, including Industry 4.0 intelligent manufacturing, communication infrastructure, industrial automation control, digital terminals, power supply systems, computer hardware, automotive electronics, medical devices, aerospace equipment, precision instruments, defense industry and Internet of Things (IoT) applications.

High-End PCB Core Features

Our high-end PCBs are engineered to meet the stringent requirements of high-speed, high-density and high-reliability application scenarios, with outstanding electrical, mechanical and environmental performance:
HDI Capabilities: Specializing in 1~3+N+3 staged HDI and anylayer HDI technologies, our products support ultra-fine line width/line spacing (min 2mil/2mil), microvia (min diameter 0.1mm) and precise sequential lamination (alignment tolerance ≤ ±0.02mm), ensuring superior signal integrity and compatibility with BGA, CSP, DCA and other high-end IC packaging.
High-Frequency & High-Speed Performance: Adopting premium dielectric materials (Rogers, Arlon, Isola, etc.) with low DK (2.20~10.2) and Df (≤0.021 at 1GHz), the PCBs support signal transmission up to 56Gbps, with precise impedance control (±5% tolerance) to effectively suppress EMI/EMC issues, suitable for RF communication, radar and high-speed servers.
High Reliability: Fully compliant with IPC-A-600 (Class 3), IPC-6012 (Class 3) standards and ISO9001, ISO14001, IATF16949 certifications, full-process quality control ensures a 99% product pass rate and stable operation in harsh environments, meeting the high-reliability requirements of automotive, medical and aerospace fields.
Special Process & Customization: Equipped with strong R&D and manufacturing capabilities for special processes (rigid-flex integration, heavy copper up to 20OZ, backdrilling, resin-filled vias, etc.), we provide flexible customization (2~30 layers, 0.2~5.0mm thickness, various surface finishes and impedance specifications) to meet personalized high-end product needs.
Environmental Adaptability: Lead-free and RoHS 2.0 compliant, our PCBs adopt environmentally friendly materials and processes, with excellent moisture resistance, chemical resistance and thermal stability (Tg ≥ 180℃, Td ≥ 340℃), enabling stable operation in extreme application environments.

Service Commitment

We provide comprehensive one-stop PCB services, covering design optimization, technical consultation, rapid prototyping, mass production and after-sales support. Committed to becoming a trusted partner in the high-end PCB field, we strive to empower the development of high-end electronic equipment industries worldwide.




Model    : 6L 1+N+1 HDI

Material:FR-4  Mobile Mainbord

Layer    :6L 1+N+1 HDI

Color    :Green/White

Finished Thickness:1.0m

Copper Thickness  :inner1OZ outer0.5OZ

Surface Treatment :Immersion Gold

Min Trace / Space  :3mil/3mil

Min Hole    :Mechanical hole 0.2mm,Laser Hole 0.1mm

Application :Mobile Main baord