• 6L 1+N+1 HDI ENIG PCB Manufacturing in China
  • 6L 1+N+1 HDI ENIG PCB Manufacturing in China

6L 1+N+1 HDI ENIG PCB Manufacturing in China

Product Model: 6L 1+N+1 HDI PCB

Material: ITEQ FR-4 Dielectric Laminate
Layer Structure: 6-layer with 1+N+1 HDI stackup
Solder Mask: Green / White
Finished Thickness: 1.0mm
Copper Weight: Inner 1oz, Outer 0.5oz
Surface Finish: Electroless Nickel Immersion Gold
Min. Trace / Space: 3mil/3mil
Min. Aperture: 0.2mm mechanical hole, 0.1mm laser microvia
Application: Smart digital electronic products

  • 6L 1+N+1 HDI ENIG PCB Manufacturing in China
  • Description

  • Data Sheet

All Maxipcb products are manufactured via high-precision automated equipment, with layer-by-layer product inspection and strict full-process control to ensure stable quality. The company upholds the enterprise tenet of "Pursuing Perfection Unremittingly, Serving Customers Wholeheartedly" and the philosophy of "Professionalism, Dedication, Integrity and Win-Win". We continuously upgrade technology, improve product quality and corporate credibility, providing customers with all-round, efficient, meticulous and rigorous high-quality services. We sincerely look forward to establishing long-term mutually beneficial cooperation with you, and welcome consultation and negotiation for win-win development.

HDI PCB Quotation Instructions

Since PCB products are fully customized according to customer specifications, accurate quotations cannot be provided on the webpage. The pictures, processes and prices displayed on the website are for reference only. The actual PCB price is determined by board size, process requirements and order quantity. Please consult customer service before placing an order for accurate quotation and technical confirmation.




HDI PCB

Surface Finishing Options

Diversified surface treatment solutions: OSP, ENIG, Lead-Free HASL, Plated Gold, Flash Gold, Immersion Tin, Immersion Silver, Electrolytic Gold (meeting welding, conductivity and environmental reliability requirements).

Manufacturing Capabilities

High-precision and special process capabilities: Golden Finger Beveling, Heavy Copper Fabrication, Blind & Buried Via Processing, Precision Impedance Control, Resin-Filled Vias, Carbon Ink Printing, Backdrilling, Countersink Machining, Depth-Controlled Drilling, Half-Plated Holes, Press-Fit Holes, Peelable Blue Mask, Peelable Solder Stop, Thick Copper Circuitry, Oversized Board Customization.

Application Fields

Widely applied in high-tech and high-reliability fields: Consumer Electronics, Aerospace & Defense, Antenna & Communication Systems, High-Power Equipment, Medical Instruments, Automotive Electronics, Industrial Automation, Cellular Handheld Devices, WiFi Antennas, Automotive Telematics & Infotainment, WiFi/Computing Equipment, Radar Systems, Power Amplifiers, Industry 4.0, Digital Terminals, Power Supply Systems, Computer Hardware.

High-End PCB Core Advantages

• High-Density & High-Speed: 1~3+N+3 staged/anylayer HDI, ultra-fine line/space, microvia, 56Gbps signal transmission, ±5% impedance control. • High Reliability: Compliant with IPC-A-600 (Class 3), IPC-6012 (Class 3), ISO9001, ISO14001, IATF16949; full-process quality control for stable performance in harsh environments. • Customization Flexibility: Support customization of layer count, board thickness, surface finish and special processes. • Environmental Compliance: Lead-free, RoHS compliant, adopting eco-friendly materials and processes.

Service Commitment

One-stop PCB solutions: design optimization, technical consultation, prototyping, mass production and after-sales support. We strive to be a trusted high-end PCB partner globally.

Model    : 6L 1+N+1 HDI

Material:FR-4 (ITEQ)

Layer    :6L 1+N+1 HDI

Color    :Green/White

Finished Thickness:1.0m

Copper Thickness  :inner1OZ outer0.5OZ

Surface Treatment :Immersion Gold

Min Trace / Space  :3mil/3mil

Min Hole    :Mechanical hole 0.2mm,Laser Hole 0.1mm

Application :Intelligent digital products