Name: 4layers Multilayer Bluetooth PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

4layers Multilayer Bluetooth PCB

Product Model: 4-Layer Multilayer PCB for Bluetooth Module
Base Material: FR-4 Glass Epoxy Laminate
Layer Structure: 4-layer
Solder Mask Color: Black / White
Finished Board Thickness: 1.0 mm
Copper Weight: 1 oz (35 μm)
Surface Finish: Electroless Nickel Immersion Gold (ENIG)
Minimum Trace Width: 4 mil (0.10 mm)
Minimum Trace Spacing: 4 mil (0.10 mm)
Process Feature: Castellated half-hole structure design
Typical Application: Bluetooth module & wireless communication circuit board

Description
Data Sheet

Maxipcb is a leading high-tech enterprise dedicated to the R&D and manufacturing of high-end printed circuit boards (PCBs). As an industry innovator, Maxipcb® has independently developed an industry-first automatic PCB quotation and ordering system, breaking through traditional manufacturing bottlenecks by integrating digital technology into the entire PCB production chain. Our long-term strategic vision is to build a cutting-edge Industry 4.0 smart PCB factory under the "Internet + Manufacturing" model, delivering professional, efficient, and tailored PCB technical support and one-stop production services that exceed customer expectations.

Surface Finish Capabilities

We offer a comprehensive portfolio of industry-standard surface finishing solutions, tailored to meet the diverse and stringent requirements of various electronic applications. Our offerings include: Organic Solderability Preservative (OSP), Electroless Nickel Immersion Gold (ENIG), Lead-Free Hot Air Solder Leveling (HASL LF), Plated Gold, Flash Gold, Immersion Tin, Immersion Silver, and Electrolytic Gold. Every surface finishing process is strictly compliant with IPC and RoHS 2.0 standards, guaranteeing superior solderability, robust corrosion resistance, and stable electrical performance—laying a solid foundation for the reliability of your end products.

Special Process Capabilities

Maxipcb® boasts mature and advanced technical capabilities in a full range of special PCB processes, empowering us to tackle even the most complex customization needs with precision and efficiency. Our special process offerings include: Gold Finger (Edge Connector Plating), Heavy Copper Plating, Blind/Buried Vias, Impedance Control (controlled impedance PCB), Resin Filling, Carbon Ink Printing, Backdrilling, Countersinking, Controlled-Depth Drilling, Castellated Holes (Half-Plated Holes), Press-Fit Holes, Peelable Blue Mask, Peelable Solder Stop, Thick Copper Fabrication, and Oversized PCB Manufacturing—turning your innovative designs into high-quality, market-ready products.

Substrate Material Options

We provide a comprehensive selection of high-performance substrate materials, carefully curated to adapt to the unique demands of diverse application scenarios—from high-frequency and high-temperature environments to high-reliability critical systems. Our material portfolio includes the full Rogers series (RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870), as well as premium substrates from globally renowned brands such as Arlon, Isola, Taconic, PTFE F4BM, and Teflon. Every material undergoes strict quality inspection and complies with international industry standards, ensuring the long-term stability, reliability, and performance of your PCBs.

Layer Count Capabilities

Our PCB manufacturing capabilities span a wide range of layer counts, from 2-layer to 30-layer PCBs, including: 2L, 4L, 6L, 8L, 10L, 12L, 14L, 16L, 18L, 20L, 22L, 24L, 26L, 28L, and 30L. For multi-layer PCBs with 6 or more layers—where precision is paramount—we implement rigorous engineering review and strict process control throughout production, ensuring exceptional layer alignment accuracy, strong interlayer adhesion, and consistent overall electrical performance that meets even the most demanding industry standards.

Dielectric Constant (DK) Range

Based on different substrate materials and the specific requirements of your application, we offer PCBs with a flexible range of dielectric constant (DK) options, including: 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, and 10.2. Our precise control of dielectric constant ensures stable, high-quality signal transmission—making our PCBs the ideal choice for high-frequency, high-speed, and signal-sensitive electronic applications, where performance and reliability cannot be compromised.

Application Fields

Our high-quality PCBs are widely trusted and applied across a diverse range of high-end electronic fields, including: Consumer Electronics, Military & Aerospace, Antenna & Communication Systems, High-Power Equipment, Medical Devices, Automotive Electronics, Industrial Control, Handheld Cellular Devices, WiFi Antennas, Telematics & Infotainment Systems, as well as WiFi, Computing, Radar, and Power Amplifier equipment. We don’t just provide PCBs—we deliver customized solutions tailored to the unique challenges and requirements of each industry, partnering with you to drive innovation and success.

Model : 4layers Multilayer Bluetooth PCB

Material : FR4

Layer : 2Layers

Color : Black/White

Finished Thickness : 1.0mm

Copper Thickness : 1OZ

Surface Treatment : Immersion Gold

Min Trace : 4mil(0.1mm)

Min Space : 4mil(0.1mm)

characteristic : Half hole PCB

Application : Multilayer Bluetooth PCB