Name: 4L 1+N+1 HDI PCB for Wifi Module with ENIG + OSP Finishing
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

4L 1+N+1 HDI PCB for Wifi Module with ENIG + OSP Finishing

Product Model: 4-Layer 1+N+1 HDI WiFi Module PCB
Material: FR-4 Laminate
Layers: 4L, 1+N+1 HDI stackup
Solder Mask: Green/White
Finished Thickness: 1.0mm
Copper Weight: Inner 1oz, Outer 0.5oz
Surface Finish: Immersion Gold + OSP
Min Trace/Space: 4mil/4mil
Min Hole: Mechanical hole 0.2mm, Laser hole 0.1mm
Special Process: Quadrilateral hole
Application: WiFi Module

Description
Data Sheet

Maxipcb is a high-tech enterprise dedicated to R&D, design, manufacturing and technical services of high-end PCBs. With a professional R&D team of senior engineers (over 15 years of industry experience) and a standardized intelligent production base, we focus on providing high-reliability, high-precision PCB solutions for high-end electronic fields.

As an industry innovator, we independently developed the first automatic PCB quotation and order management system, integrating intelligent quotation, order tracking and production scheduling. It streamlines procurement, shortens quotation response to within 15 minutes, and enables real-time order inquiry, providing efficient and transparent services for global customers.

High-End PCB Product Core Features

Our high-end PCBs are engineered to meet stringent requirements of high-speed, high-density and high-reliability scenarios, with outstanding electrical, mechanical and environmental performance. Core technical features and process advantages are as follows:

1. High-Density Interconnection (HDI) Capabilities

We specialize in high-end HDI PCBs, covering 1~3+N+3 staged HDI and anylayer HDI technologies. Our products support ultra-fine line width/line spacing (min 2mil/2mil), microvia (min diameter 0.1mm) and high-density pad layout, with precise sequential lamination (alignment tolerance ≤ ±0.02mm) for superior signal integrity. They are fully compatible with BGA, CSP, DCA and other high-end IC packaging, widely used in high-end electronics, industrial control and medical equipment.

2. High-Frequency & High-Speed Performance

For high-frequency and high-speed scenarios, our PCBs adopt premium dielectric materials (Rogers, Arlon, Isola, etc.) with low DK (2.20~10.2) and Df (≤0.021 at 1GHz), supporting signal transmission up to 56Gbps. With precise impedance control (±5% tolerance) and excellent consistency, they effectively suppress EMI/EMC issues, ideal for RF communication, radar, satellite communication and high-speed servers.

3. High-Reliability & Stable Quality

High reliability is guaranteed by strict compliance with IPC-A-600 (Class 3), IPC-6012 (Class 3) standards and ISO9001, ISO14001, IATF16949 certifications. Full-process quality control (incoming inspection, in-process monitoring, finished product testing) ensures 99% product pass rate and stable operation in harsh environments, meeting high-reliability requirements of automotive, medical and aerospace fields.

4. Special Process & Customization Capabilities

We have strong R&D and manufacturing capabilities for special processes, including rigid-flex integration, heavy copper (up to 20OZ), backdrilling, resin-filled vias, carbon ink printing and golden finger beveling. We provide flexible customization (2~30 layers, 0.2~5.0mm thickness, various surface finishes and impedance specifications) to meet personalized needs of high-end products.

5. Environmental Adaptability

Our high-end PCBs are lead-free, RoHS 2.0 compliant, adopting environmentally friendly materials and processes. With excellent moisture resistance, chemical resistance and thermal stability (Tg ≥ 180℃, Td ≥ 340℃), they can operate stably in extreme environments such as automotive, medical and aerospace fields.

Strategic Goals & Service Commitment

Guided by "Internet + Manufacturing", our long-term goal is to build an Industry 4.0 smart PCB factory, integrating digital management, intelligent equipment and lean processes to realize full-process digitalization and intelligence.

We provide comprehensive one-stop services from design optimization, technical consultation and rapid prototyping to mass production and after-sales support, striving to be a trusted partner in the high-end PCB field and empower high-end electronic industries.

Mode: 4L 1+N+1 HDI Wifi Module
Material：FR-4
Layer：4L 1+N+1 HDI
Color：Green /White
Finished Thickness：1.0m
Copper Thickness ：inner1OZ outer0.5OZ
Surface Treatment ：Immersion Gold + OSP
Min Trace / Space ：4mil/4mil
Min Hole：Mechanical hole 0.2mm，Laser Hole 0.1mm
Application ：Module
Specail Process：Quadrilateral foramen