Product Model: 4-layer 1+N+1 HDI high-density interconnect substrate Base Material: Industrial FR-4 dielectric laminate Stackup: 1+N+1 HDI structural design Solder Mask Color: Black, white optional Finished Board Thickness: 0.8 mm Copper Specification: Inner layer 1 oz, outer layer 0.5 oz Surface Finish: Combined immersion gold and OSP hybrid processing Minimum Trace / Space: 3 mil / 3 mil Minimum Hole Size: 0.2 mm mechanical hole; 0.1 mm laser microvia Special Technology: Edge half-hole forming process for modular packaging Application: Dedicated circuit board for Wi-Fi wireless communication modules