Name: 44layers IC Probe Card PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

44layers IC Probe Card PCB

Product Model: 44Layers IC Probe Card PCB

Base Material: TUC TU872HF

PCB Layers: 44 Layers

Solder Mask Color: Green

Overall Size: 20" × 22"

Layer Structure: L1-L44：10mil / L1-L28：12mil / L29-L44：14mil

Surface Technology: Hard Gold Plating (3-15μm)

Special Process: Metal cladding, depth control drilling

Application: Integrated Circuit (IC) testing

Description
Data Sheet

A probe card is the core connection interface between the wafer-level chip under test and semiconductor testing machines. It is mainly used to detect the electrical performance of bare chips before IC packaging, screening out defective chips in advance to reduce unnecessary packaging costs.

An Integrated Circuit (IC) is a miniaturized integrated electronic circuit. Adopting semiconductor manufacturing technology, numerous transistors, resistors, capacitors and other components are fabricated on a tiny silicon chip. All components are interconnected via multi-layer routing to form a complete functional electronic circuit.

Probe Card Classification

Probe cards are divided into five mainstream types:

Blade probe card
Cantilever probe card
Vertical probe card
Membrane probe card
MEMS probe card

Probe Card Composition

A complete probe card is mainly composed of PCB, probes and functional components. Electronic components and stiffeners are configured according to different test demands. Cantilever probe cards additionally contain structural parts such as positioning rings and epoxy adhesive layers.

Common Cantilever Probe Materials

Tungsten (W)
Rhenium-tungsten alloy (RW: 3% rhenium, 97% tungsten)
Beryllium copper (BeCu)
Paliney 7 alloy

Function of Probe Card PCB

The PCB is the mounting carrier for probes, positioning rings and functional parts, and realizes stable signal transmission between probe tips and testing equipment. Its shape and size are limited by the test interface standard, while substrate materials are selected according to high-temperature and high-humidity test environments. Square and circular outlines are the most conventional designs.

MEMS Probe Card Feature

MEMS (Micro-Electro-Mechanical System) probe cards are developed to improve wafer testing throughput and meet ultra-fine pitch, high pin-count test requirements.

MEMS technology breaks through the limitations of manual assembly for epoxy ring probe cards and one-by-one welding processes for micro spring probes. With a high degree of automation, it solves the problem that manufacturing costs increase linearly with pin quantity, and is highly suitable for mass production of high pin-count probe cards.

Applicable scenarios & advantages:

Support ultra-high pin count (up to ~30K pins per card)
Adapt to high-current testing and long probe compression stroke
Excellent structural stability
Extremely slight wafer surface scratches during contact testing
Effectively extend service life and reduce probe replacement frequency, perfectly matching ultra-narrow pitch wafer testing

Key Technical Parameters

Epoxy cantilever probe card: supports thousands of pins, with up to 16 probe layers;
Minimum pitch: 30μm for cantilever probes, 40~50μm for vertical probes;
Cantilever probe card service life: 100WTD.

Probe Card Storage Specifications

Factory delivery: sealed by vacuum packaging;
Idle storage: placed in a professional nitrogen storage cabinet;
Controlled environmental humidity: 25% ± 2%.

Model : 44layers IC Probe Card PCB

Material : TUC/TU872HF

Layer : 44Layers

Color : Green

Size: 20 "* 22"

Structure: L1-L44 10mil

L1-L28 12mil

L29-L44 14mil

Surface technology: hard gold 3-15u

Special process: metal cladding, depth control drilling

Application : IC(Integrated Circuit Chip) test PCB