Product Model: Rigid-Flex PCB Material: FR4 + PI Composite Substrate Layer Structure: 1 Rigid Layer + 1 Flexible Layer Copper Thickness: 2oz Finished Thickness: 1.6mm Surface Finish: Immersion Gold PCB (Gold Thickness: 2U) Min. Aperture: 0.2mm Min. Trace / Space: 3mil/3mil Special Process: Resin Plug Hole + Electroplating Filling