24 Layers Communication backplane PCB

Name: 24 Layers Communication backplane PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Product Model: 24-Layer High-Density Communication Backplane PCB

Base Material: Panasonic M6 High-Tg Glass Epoxy Laminate, with high thermal stability and low signal loss

Layer Configuration: 24-layer multilayer structure, optimized stack-up design for high-speed signal transmission

Solder Mask & Silkscreen: Blue high-insulation solder mask and high-visibility white silkscreen

Finished Board Thickness: 2.0 mm, precision tolerance: ±0.05 mm

Copper Weight: 1 oz (35 μm) for inner and outer layers, ensuring stable conductivity and excellent signal integrity

Surface Finish: Electroless Nickel Immersion Gold (ENIG), providing premium solderability, corrosion resistance and long-term reliability

Minimum Design Parameter: 6 mil (0.15 mm) trace width and 6 mil (0.15 mm) trace spacing, compliant with high-density interconnection demands

Key Feature: High-layer multilayer structure with enhanced mechanical stability and signal performance, ideal for complex backplane interconnection scenarios

Application: High-speed communication equipment backplanes, covering data center switches, telecom base stations and enterprise network backend devices

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Description
Data Sheet

Maxipcb has formed a complete technical system and service capability in the field of communication PCB manufacturing, especially in high-layer, high-precision and high-reliability product research and production. The core advantages in communication PCB manufacturing are as follows, fully complying with the technical norms of the PCB industry and meeting the high-standard requirements of communication equipment supporting:

High-End Material Application Capability
We exclusively adopt high-performance substrate materials from well-known brands, including high-frequency dedicated laminates and high-temperature resistant substrates, which effectively ensure the stability of signal transmission and mechanical strength of communication PCBs. The material selection strictly meets the electrical performance requirements of communication equipment, laying a solid foundation for the stable operation of high-frequency and high-speed signal transmission.
High-Precision Process Control
For communication backplane PCBs, high-layer HDI boards and other core products, we implement strict process control. We have mature manufacturing experience in multi-layer board lamination, blind via processing, and high-density wiring, and the line width, spacing and layer alignment accuracy fully meet the IPC-6012 standard. The dimensional tolerance of each process is strictly controlled within ±0.05mm, ensuring the consistency and reliability of product performance.
Strict Quality Supervision System
We have established a full-process quality supervision mechanism covering material incoming inspection, process monitoring, and finished product testing. All products are inspected in accordance with international quality standards, and key indicators such as impedance control, solderability, and interlayer alignment are tested and verified to ensure that each batch of products meets the technical requirements of communication equipment.
Professional R&D and Technical Support
Our R&D team is composed of senior engineers with more than 10 years of experience in communication PCB design and manufacturing. We can provide customized solutions according to the specific needs of communication equipment, and continuously optimize the process technology through PDCA cycle management, effectively solving technical difficulties such as high-layer board manufacturing and high-precision impedance control.
Perfect After-Sales and Technical Guarantee
We provide full-cycle technical support for communication PCB products, including pre-production program optimization, in-production technical guidance, and post-delivery performance tracking. For the technical problems encountered in the use of products, we respond quickly and provide professional solutions to ensure the stable operation of communication equipment and the continuous progress of project delivery.

Model :24 Layers Communication backplane PCB

Material: Panasonic m6

Layer: 24Layers

Color : Blue/white

Finished Thickness:2.0mm

Copper Thickness:1OZ

Surface Treatment : lmmersion Gold

Min Trace : 6mil(0.15mm)

Min Space : 6mil(0.15mm)

characteristic : High multilayer

Application :communication backplane pcb

24 Layers Communication backplane PCB

Description

Data Sheet