Name: 20 Layers High Speed PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

20 Layers High Speed PCB

Product Model: 20-Layer High-Speed Circuit Board

Base Material: TUC TU872LK high-performance substrate

Layer Structure: 20-layer multilayer design

Finished Board Thickness: 5.0 mm

Copper Weight: 1 oz for inner and outer layers

Solder Mask & Silkscreen: Green solder mask with white silkscreen

Minimum Line Width / Spacing: 4 mil / 4 mil

Surface Finish: Hard gold plating, gold thickness: 3–15μ"

Blind Via Structure: L3–L20 blind vias

Application Field: Communication backplane PCB

Description
Data Sheet

Printed circuit boards serve as the cornerstone of nearly all electronic systems, acting as fundamental core components for electronic devices and sustaining strong global market demand. Their downstream applications extend across communications, computing devices, consumer electronics, industrial control, medical instruments, automotive electronics, aerospace, and numerous other industries.

In the communications sector, PCBs are widely deployed in wireless networks, transmission networks, data communication systems, and fixed-line broadband infrastructure. Typical products include high-speed backplanes, multilayer high-performance boards, high-frequency microwave substrates, and multifunctional metal-core circuit boards. Communications PCB applications are generally divided into four key segments: wireless networks including communication base stations, transmission networks, data communications, and fixed-line broadband. However, complete market data remains relatively scarce for segments outside of wireless network applications.

Industry analysis shows that each 5G base station uses approximately 3.21 square meters of PCB material, roughly 1.76 times the 1.825 square meters required for a 4G base station. Meanwhile, the higher operating frequency and stricter performance requirements of 5G technology also drive up the unit price of corresponding PCBs. Overall, the total PCB value per 5G base station is roughly three times that of a 4G base station.

Furthermore, the higher frequency spectrum used in 5G results in smaller coverage radius per base station. It is projected that the total number of domestic 5G base stations will reach 1.2 to 1.5 times that of 4G, supported by a large number of small and micro base stations. The peak number of new 5G macro base stations in 2023 is estimated to be 1.5 times the peak volume of 4G construction in 2015. Based on comprehensive estimates, the market size of base station communication PCBs in the coming years will range from 5 billion to 26 billion yuan, representing significant explosive growth compared with the 4G era market of 5 billion to 9 billion yuan.

Our enterprise focuses on PCB prototype manufacturing, with core products covering 4 to 48 layers of high-precision prototype boards. These mainly include enterprise-level communication PCBs, mid-to-high-end automotive PCBs, and industrial equipment PCB assemblies as supplementary products, which are widely used in communications equipment, automotive systems, industrial devices, microwave RF modules, and other high-end fields.

Communications PCB applications are mainly concentrated in four areas: wireless networks including communication base stations, transmission networks, data communications, and fixed-line broadband. Market data remains insufficient for most segments outside wireless network applications.

Model : 20 Layers High Speed PCB

Material: TUC/TU872LK

Layer: 20Layers

Finished Thickness: 5.0mm

Copper Thickness : Innerouter 1OZ

Color : Green/White

Min Trace/Space : 4mil/4mil

Surfacet Treatment: Hard Gold 3-15U

Blind Hole : L3-L20

Application: Communication backplane PCB

20 Layers High Speed PCB

Description

Data Sheet