Stackup: 6L, 2+N+2 HDI structure
Material: ITEQ IT150 high-reliability substrate
Solder Mask: Black / White
Finished Thickness: 1.0mm
Copper Weight: Inner 1oz, Outer 0.5oz
Surface Finish: ENIG + OSP
Min. Trace/Space: 2.5mil / 2.5mil
Min. Aperture: 0.2mm mechanical hole, 0.1mm laser microvia
Application: Communication equipment circuit boards