Name: 2+N+2 Countersink hole 2 HDI 8L PCB with Blind Hole
Brand: PCB Printed Circuit Board and PCBA manufacturing
Availability: InStock
Rating: 5 (1 reviews)

2+N+2 Countersink hole 2 HDI 8L PCB with Blind Hole

Product Model: 8L 2+N+2 HDI PCB

Layer Structure: 8-layer, 2+N+2 HDI stackup

Base Material: FR-4 Laminate

Finished Thickness: 1.0 mm

Copper Weight: Inner 1 oz / Outer 0.5 oz

Solder Mask & Silkscreen: Blue solder mask, white silkscreen

Surface Finish: Immersion Gold + OSP

Minimum Trace / Spacing: 3 mil / 3 mil

Minimum Hole Size: Mechanical hole 0.2 mm, Laser microvia 0.1 mm

Special Process: Blind hole fabrication

Application: Intelligent digital products

Description
Data Sheet

With over 17 years of specialized experience in RF and high-frequency PCB fabrication in China, Maxipcb deeply understands how substrate selection directly impacts high-frequency signal stability and overall board performance.

Key electrical parameters including microwave power rating, working frequency, temperature endurance, rated current and voltage are critical for precise material matching in high-frequency circuit production. Our engineering team maintains in-depth expertise across mainstream RF dielectric materials, with sufficient in-house stock to support short lead times and fast mass delivery.

Reliable product quality is backed by our seasoned engineering team, standardized production workflows and strict QA control. Cross-department collaboration ensures every circuit board meets international industry specifications. Instead of superficial praise, continuous repeat orders from global clients best prove our stable quality and satisfactory cooperation experience.

Quality remains our core business principle, as we recognize its essential role in long-term global partnership. Over 17 years, we have grown alongside worldwide customers, steadily upgrading manufacturing capacity, process technology and high-end PCB production capabilities.

RF & Microwave PCB Materials

We supply full-series high-frequency substrates for RF applications:

Rogers: RO4350B, RO3003, RO4003, RO3006, RT/Duroid 5880, RT5870
Arlon, Isola, Taconic
PTFE, F4BM and Teflon-based dielectric materials

Hybrid Mixed Dielectric PCB

Combined high-frequency + standard FR4 laminates for cost-effective high-performance designs:

RO4350B + FR4 / IT180
RO4003C + FR4
RO3010 + FR4
RO3003 + FR4

Main Surface Finishes

OSP, ENIG, Lead-free HASL, hard gold plating, soft flash gold, immersion tin, immersion silver, electrolytic gold

Core Process Capabilities

Golden finger, heavy copper circuit, blind & buried via, impedance control, resin filling, carbon ink printing, backdrill, countersink, depth-controlled drilling, half-plated hole, press-fit hole, peelable blue solder mask, ultra-thick copper and oversized board production

Standard Specifications

Layer Count: 2–30 layers
Dielectric Constant (DK): 2.20, 2.55, 3.00, 3.38, 3.48, 3.50, 3.6, 6.15, 10.2

Application Fields

Our RF microwave PCBs are widely adopted across high-end industries:

Consumer electronics, military & aerospace, high-power equipment, medical devices, automotive, industrial control, communication antenna systems, handheld terminals, cellular hardware, Wi-Fi antenna, telematics, radar systems and power amplifiers.

Model : 8L 8L 2+N+2 HDI

Material：FR-4

Layer ：8L 8L 2+N+2 HDI

Color ：Blue /White

Finished Thickness：1.0m

Copper Thickness ：inner1OZ outer0.5OZ

Surface Treatment ：Immersion Gold + OSP

Min Trace / Space ：3mil/3mil

Min Hole ：Mechanical hole 0.2mm，Laser Hole 0.1mm

Application ：Intelligent digital products pcb

Specail Process： Blind hole pcb