1Layer Glass PCB

Driven by the rapid iteration of electronic technologies, terminal devices are evolving toward lightweight, compact and highly integrated design, which raises stringent technical demands for the foundational printed circuit board industry, including high wiring density, miniaturized dimensions and superior conductive performance. Against this industry backdrop, PCB manufacturing technologies continue to advance at a fast pace. Meanwhile, multiple low-voltage application sectors covering computers and peripheral systems, medical devices, mobile terminals, digital imaging equipment, communication hardware, precision instrumentation and aerospace electronics have formulated refined and standardized technical specifications for PCB processing workflows and overall product quality.

Double-sided routing PCBs, which serve as critical carriers for IC chip mounting, have gained extensive industry attention. This type of PCB features dual conductive layers distributed on two sides of the insulating substrate. Conductive connection is realized by fabricating through holes or blind holes at designated pattern areas, with hole inner walls processed via electroplating or conductive adhesive filling to achieve vertical electrical conduction between layers.

Conventional PCB products generally adopt epoxy glass or polyimide as core insulating substrates, with copper foil laminated on the substrate surface to form conductive layers. Long-term service will lead to gradual aging and adhesion attenuation of bonding materials, resulting in poor bonding tightness between copper foil and the insulating base. Such defects cause separation of conductive layers, uneven board surface, and increased risks of circuit damage and peeling. Although ultra-thin copper foil has been adopted to optimize structural performance, the mainstream thickness of industrial copper foil is still maintained at 12μm, leaving limited room for further optimization.

Different from traditional structures, transparent glass-based double-layer circuit boards adopt an integrated fusion process for glass substrates and conductive circuits. The circuit layer is tightly bonded with the glass base, achieving a flush surface between the substrate and conductive traces. This design delivers an overall smooth board surface, effective protection for conductive circuits against mechanical damage, and excellent electrical conductivity for long-term stable operation.