18Layers 3oz copper power PCB

Name: 18Layers 3oz copper power PCB
Brand: PCB Printed Circuit Board and PCBA manufacturing
Rating: 5 (1 reviews)

Product Model: 18-Layer 3oz Heavy Copper Power PCB

Base Material: EM827 Epoxy Substrate

Layer Structure: 18-Layer Rigid PCB

Solder Mask Color: Green / White (Optional)

Finished Board Thickness: 4.0 mm, tolerance compliant with IPC standards

Copper Foil Thickness: 3oz (≈105 μm)

Surface Finish: Electroless Nickel Immersion Gold (ENIG)

Immersion Gold Thickness: ≥ 2 Microinches (2U")

Hole Wall Copper Thickness: ≥ 70 μm

Standard Trace Width: 0.3 mm

Minimum Mechanical Aperture: 0.4 mm

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Description
Data Sheet

Maxipcb Core Capabilities

Maxipcb Circuits Limited (Maxipcb®.com) has extensive experience in thick copper coil PCB manufacturing. To ensure the operational reliability of coil power module PCBs, we implement strict low-resistance testing protocols throughout the production process.

We use specialized low-resistance test equipment to verify PCB electrical performance, ensuring they meet the strict reliability requirements for power module applications.

With advanced PCB manufacturing technologies, Maxipcb achieves 4oz inner and outer layer copper thickness, along with hole wall copper thickness ≥ 70μm. Our VCP electroplating lines ensure consistent product quality and meet customers’ custom requirements.

As a high-tech enterprise specializing in high-end PCB R&D and production, Maxipcb®.com has independently developed an industry-leading automated PCB quoting and ordering system. Our long-term goal is to build an Industry 4.0 smart PCB factory via the "Internet +" model, providing professional PCB technical support and one-stop production services to global customers.

All products comply with IPC-A-600, IPC-6012 standards and RoHS/REACH compliance, with a monthly production capacity of 50,000 square meters and a lead time of 5-12 days for standard orders to ensure on-time delivery.

18-Layer 3oz Power PCB Technical Parameters

Product Model: 18-Layer 3oz Copper Power PCB

Base Material: EM827 Epoxy Substrate

Layer Count: 18-Layer Rigid PCB

Solder Mask Color: Green/White (Optional)

Finished Board Thickness: 4.0mm (Tolerance Meets IPC Standards)

Copper Weight: 3oz (≈105μm)

Surface Finish: Immersion Gold (ENIG)

Immersion Gold Thickness Requirement: Immersion Gold Layer ≥ 2 Microinches (μin, 2U")

Hole Wall Copper Thickness: ≥ 70μm

Trace Width: Standard 0.3mm

Minimum Aperture: 0.4mm (Mechanical)

Product Range & Applications

Maxipcb®.com Product Range: Radio/Microwave/Hybrid High-Frequency PCBs, FR4 Double-Sided/Multi-Layer PCBs, 1~3+N+3 HDI PCBs, Anylayer HDI PCBs, Rigid-Flex PCBs, Blind/Buried Via PCBs, Blind Slot PCBs, Backdrilled PCBs, IC Substrates, Heavy Copper PCBs, etc.

These products are widely applied in Industry 4.0, Telecommunications, Industrial Controls, Digital Electronics, Power Supplies, Computing, Automotive, Medical, Aerospace, Instrumentation, Military, Internet, and other key sectors.

Model : 18Layers 3oz copper power PCB

Material : EM827

Layer : 18Layers

Color : Green/White

Finished Thickness : 4.0mm

Copper Thickness : 3OZ

Surface Treatment : Immersion Gold

Surface treatment : deposited gold ≥ 2U“

Copper thickness in hole : 70UM

Line width: 0.3mm

Minimum aperture: 0.4mm

Application : magnetic coil pcb,power supply pcb

18Layers 3oz copper power PCB

Description

Data Sheet

Maxipcb Core Capabilities

18-Layer 3oz Power PCB Technical Parameters

Product Range & Applications